Method of manufacturing an encapsulated package for a magnetic device

• US 8,043,544 B2
• Filed: 11/12/2008
• Issued: 10/25/2011
• Est. Priority Date: 11/10/2004
• Status: Expired due to Fees

• Current Assignee: Altera Corporation (Intel Corporation)
• Original Assignee: Enpirion, Inc. (MediaTek, Inc.)
• Inventors: Weld, John D., Wilkowski, Mathew, Lotfi, Ashraf W.
• Primary Examiner(s): Gupta; Yogendra
• Assistant Examiner(s): Grun; Robert J
• Application Number:
  US12/269,651
• Publication Number:
  US 20090065964A1
• Time in Patent Office: 1,077 Days
• Field of Search: 264/104, 264/272.11, 264/272.16
• US Class Current: 264/272.11
• CPC Class Codes: H01F 41/005 Impregnating or encapsulating insulating of windings H01F41/12
• CPC Class Codes: H05K 3/284 for encapsulating mounted components H05K1/185 takes precedence
• CPC Class Codes: Y10T 29/4902 Electromagnet, transformer or inductor
• CPC Class Codes: Y10T 29/49146 with encapsulating, e.g., potting, etc.
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base

Abstract

A method of manufacturing an encapsulated package for a magnetic device on a substrate. In one embodiment, the method includes providing a magnetic core on the substrate and placing a shielding structure over the magnetic core to create a chamber thereabout. The method also includes depositing an encapsulant about a portion of the magnetic core within the chamber. The shielding structure limits the encapsulant entering the chamber.

Claims

1. A method of manufacturing an encapsulated package for a magnetic device on a substrate, comprising:

providing a magnetic core on said substrate;

placing a permanent shielding structure formed from a non-magnetic ceramic material, aluminum, copper or a non-magnetic molded plastic material over said magnetic core to create a chamber thereabout; and

depositing an encapsulant about a portion of said magnetic core within said chamber, said shielding structure limiting said encapsulant entering said chamber.

2. The method as recited in claim 1 further comprising allowing at least a portion of said encapsulant to exit said chamber via said shielding structure as said encapsulant cures.

3. The method as recited in claim 1 wherein said shielding structure limits an exposure of said magnetic core to said encapsulant.

4. The method as recited in claim 1 wherein said shielding structure creates a partial seal about said magnetic core.

5. The method as recited in claim 1 wherein said shielding structure creates an opening between a junction of said shielding structure and said substrate.

6. The method as recited in claim 1 wherein said shielding structure is a protective cap.

7. The method as recited in claim 1 wherein said shielding structure is over said magnetic core without mating with said substrate.

8. The method as recited in claim 1 further comprising locating a stand off on said substrate, said stand off being between said magnetic core and said substrate.

9. The method as recited in claim 1 further comprising providing electrical leads protruding from sidewalls of said substrate.

10. The method as recited in claim 1 further comprising providing electrical leads protruding from opposing sidewalls of said substrate to allow said magnetic device to be mounted to another substrate.

11. The method as recited in claim 1 further comprising providing electrical leads protruding from sidewalls of said substrate to accommodate through hole mounting or surface mounting of said magnetic device to another substrate.

12. The method as recited in claim 1 further comprising placing at least one conductive winding about said magnetic core.

13. The method as recited in claim 1 further comprising placing at least one planar conductive winding about said magnetic core.

14. The method as recited in claim 1 wherein said magnetic core is formed from ferrite.

15. The method as recited in claim 1 wherein said substrate is a printed wiring board.

16. The method as recited in claim 1 wherein said encapsulant is an epoxy molding compound.

17. The method as recited in claim 1 wherein said shielding structure is substantially rigid.

18. The method as recited in claim 1 wherein said encapsulant is substantially non-compliant.

19. The method as recited in claim 1 wherein said shielding structure protects said magnetic core from said encapsulant.

20. The method as recited in claim 1 wherein said encapsulant has a different coefficient of thermal expansion from said magnetic core and said shielding structure.