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Microdisplay packaging system

  • US 8,044,431 B2
  • Filed: 06/03/2008
  • Issued: 10/25/2011
  • Est. Priority Date: 12/31/2003
  • Status: Expired due to Fees
First Claim
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1. A method comprising:

  • fabricating at least one set of imaging elements on an upper surface of a semiconductor substrate; and

    affixing a base to a lower surface of the semiconductor substrate to generate substantially negligible mechanical stress between the semiconductor substrate and the base in a case that the imaging elements are operated within a range of operating temperatures;

    wherein the at least one set of imaging elements comprises a pixel cell array and a liquid crystal layer; and

    wherein affixing the base comprises;

    applying an epoxy to one or both of the base and the lower surface of the semiconductor substrate;

    bringing the base and the lower surface into contact with one another while at a temperature equal to at least one operating temperature of the imaging elements; and

    partially curing the epoxy at least one operating temperature of the imaging elements.

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