Multiple light-emitting element heat pipe assembly

• US 8,047,686 B2
• Filed: 08/31/2007
• Issued: 11/01/2011
• Est. Priority Date: 09/01/2006
• Status: Expired due to Fees

• Current Assignee: TIR Technology LP
• Original Assignee: TIR Technology LP
• Inventors: Jongewaard, Mark Paul, Dahm, Jonathan S.
• Primary Examiner(s): Lee; Jong-Suk (James)
• Assistant Examiner(s): Makiya; David J
• Application Number:
  US11/849,147
• Publication Number:
  US 20080205062A1
• Time in Patent Office: 1,523 Days
• Field of Search: 362/94, 362/580, 362/345, 362/373
• US Class Current: 362/294
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: F21K 9/68 Details of reflectors forming part of the light source
• CPC Class Codes: F21V 29/51 using condensation or evaporation of a fluid, e.g. heat pipes
• CPC Class Codes: F21V 29/74 with fins or blades
• CPC Class Codes: F21V 29/773 the planes containing the fins or blades having the direction of the light emitting axis
• CPC Class Codes: F21V 29/83 the elements having apertures, ducts or channels, e.g. heat radiation holes
• CPC Class Codes: F28D 15/0233 the conduits having a particular shape, e.g. non-circular cross-section, annular F28D15/0241, F28D15/0266 take precedence
• CPC Class Codes: F28D 15/0266 with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers F28D15/043 takes precedence
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 33/648 the elements comprising fluids, e.g. heat-pipes

Abstract

The present invention provides an optical device comprising one or more heat pipes with a desired level of thermal coupling with the light-emitting elements which are positioned along a periphery of the evaporator surface portion of the heat pipe in such a way that they are thermally coupled to the heat pipe. In one embodiment, the heat pipe of the present invention can be readily integrated with optical elements such as reflectors or collimators.

Claims

1. An optical device comprising:

a plurality of heat pipes, each of the plurality of heat pipes having an evaporator end portion having a perimeter, respectively;

one or more light-emitting elements configured to generate light, the one or more light-emitting elements operatively and thermally coupled to at least one of the plurality of heat pipes at the perimeter of the evaporator end portion;

a corrugated heat sink forming a plurality of integral folds extending radially outward relative to a central longitudinal axis of the optical device and each of the plurality of integral folds forming an internal space, wherein at least a portion of each of the plurality of heat pipes is longitudinally disposed within the internal space formed by one of the plurality of integral folds; and

a plurality of hollow regions each defined by the corrugated heat sink and the portion of a respective one of the plurality of heat pipes.

2. The optical device according to claim 1, further comprising an optical element having a top portion having a first diameter and a bottom portion having a second diameter smaller than the first diameter, said optical element optically coupled to the one or more light-emitting elements.

3. The optical device according to claim 1, wherein the corrugated heat sink is thermally coupled to each of the plurality of heat pipes.

4. The optical device according to claim 1, wherein each of the plurality of heat pipes has a bent configuration.

5. The optical device according to claim 1, wherein each of the plurality of heat pipes has a tear drop cross sectional shape.

6. The optical device according to claim 1, wherein each of the plurality of heat pipes is thermally conductive and electrically passive.

7. The optical device according to claim 1, wherein each of the plurality of heat pipes is thermally conductive and electrically conductive.

8. The optical device according to claim 2, wherein the evaporator end portion comprises a recess configured to mechanically connect with the optical element.

9. The optical device according to claim 1, further comprising a substrate, wherein at least one of the one or more light-emitting elements is positioned on the substrate, said substrate being thermally coupled to each of the plurality of heat pipes.

10. The optical device according to claim 9, wherein the substrate is formed from one or more materials selected from the group comprising silicon, copper plated silicon, aluminum oxide, aluminum nitride, CVD diamond, BeO, GaN, SiC, graphite, diamond coated silicon and ceramic.

11. The optical device according to claim 9, further comprising an optical sensor optically coupled to the one or more light-emitting elements and configured to sense a portion of light generated by the one or more light-emitting elements, wherein the optical sensor is disposed on the substrate in a central region with respect to the longitudinal axis of the optical device.

12. The optical device according to claim 2, wherein the optical element is configured to manipulate light emitted by the one or more light-emitting elements, said manipulation including one or more actions selected from the group comprising redirection, collection and blending.

13. The optical device according to claim 2, wherein the optical element is selected from the group comprising a compound parabolic concentrator, an elliptical concentrator, a compound elliptical concentrator, a colour mixing totally internally reflecting reflector and a compound hyperbolic concentrator.

25. The optical device according to claim 1, wherein the plurality of heat pipes are located in alternate ones of the plurality of integral folds.

14. An optical device comprising:

a plurality of heat pipes each having a evaporator end portion having a perimeter, respectively, and each of the heat pipes having a condenser end portion, respectively, wherein the evaporator end portion of each of the heat pipes has a cross sectional shape configured to enable compact proximate positioning of the evaporator end portion of each of the heat pipes, and wherein each of the plurality of heat pipes is configured to provide spatial separation of each condenser end portion of the heat pipes relative to others of the plurality of heat pipes;

one or more light-emitting elements configured to generate light, wherein the one or more light-emitting elements are operatively and thermally coupled to at least one of the heat pipes at the perimeter of the evaporator end portion; and

a corrugated heat sink forming a plurality of integral folds extending radially outward relative to a central longitudinal axis of the optical device and each of the plurality of integral folds forming an internal space, wherein at least a portion of each of the plurality of heat pipes is longitudinally disposed within the internal space formed by one of the plurality of integral folds; and

a plurality of hollow regions each defined by the corrugated heat sink and the portion of a respective one of the plurality of heat pipes.

15. The optical device according to claim 14, wherein each of the evaporator end portions of the plurality of heat pipes are in physical contact.

16. The optical device according to claim 14, wherein one or more of the evaporator end portions of the plurality of heat pipes is physically separated.

17. The optical device according to claim 14, wherein the corrugated heat sink is thermally coupled to one or more of the plurality of heat pipes.

18. The optical device according to claim 14, wherein the one or more of the plurality of heat pipes has a bent configuration.

19. The optical device according to claim 14, wherein the each of the plurality of heat pipes has a tear drop cross sectional shape.

20. The optical device according to claim 14, wherein each of the plurality of heat pipes is thermally conductive and electrically passive.

21. The optical device according to claim 14, wherein each of the plurality of heat pipes is thermally conductive and electrically conductive.

22. The optical device according to claim 14, further comprising a substrate, wherein at least one of the one or more light-emitting elements is positioned on the substrate, said substrate being thermally coupled to one or more of the plurality of heat pipes.

23. The optical device according to claim 22, wherein the substrate is formed from one or more materials selected from the group comprising silicon, copper plated silicon, aluminum oxide, aluminum nitride, CVD diamond, BeO, GaN, SiC, graphite, diamond coated silicon and ceramic.

24. The optical device according to claim 22, further comprising an optical sensor optically coupled to the one or more light-emitting elements and configured to sense a portion of light generated by the one or more light-emitting elements, wherein the optical sensor is disposed in a central region of the substrate.