LED light emitter with heat sink holder and method for manufacturing the same

• US 8,048,692 B2
• Filed: 01/25/2008
• Issued: 11/01/2011
• Est. Priority Date: 11/05/2007
• Status: Expired due to Fees

• Current Assignee: Liung Feng Industrial Co., Ltd.
• Original Assignee: Liung Feng Industrial Co., Ltd.
• Inventors: Hsiao, Hsiang-yun, Wuu, Dong-sing, Hsu, Tsang-lin, Lin, Heng-I, Chiang, Cheng-chung, Horng, Ray-hua
• Primary Examiner(s): Matthews; Colleen
• Assistant Examiner(s): YUSHINA, GALINA G
• Application Number:
  US12/010,457
• Publication Number:
  US 20090114934A1
• Time in Patent Office: 1,376 Days
• Field of Search: 257/79, 257/71, 257/82, 257/98, 257/95, 257/99, 257/100, 257/675, 257/678, 257/706, 257/720, 257/E33.068, 257/E33.071, 257/E33.072, 257/E33.075, 257/E21.001, 257/E21.51, 362/611, 362/612, 438/22, 438/26, 438/25, 438/29, 438/39, 438/40, 438/455
• US Class Current: 438/22
• CPC Class Codes: H01L 2224/32 of an individual layer connector
• CPC Class Codes: H01L 33/60 Reflective elements

Abstract

An LED light emitter with heat sink holder and a method for manufacturing it are both disclosed. The LED light emitter with heat sink holder includes a heat sink holder and at least an LED chip. The heat sink holder is made of high thermal conductivity coefficient, and includes a reflecting mirror having a central portion and a reflecting portion surrounding the central portion. A normal of a top surface of the reflecting portion forms an acute angle relative to a normal of a top surface of the central portion. The LED chip is unitarily connected with a top surface of the central portion, and an electrode unit connecting with and Ohmic contacting the light emitting film for supplying power for the light emitting film. The LED light emitter with heat sink holder improves heat dissipation and working duration.

Claims

1. A method for manufacturing an LED light emitter with a heat sink holder, comprising:

a chip setting step, putting and fixing an LED chip on a support portion in such a way that a light emitting plane of the LED chip faces to the support portion, wherein the LED chip includes a substrate, a light emitting film on the substrate for generating light by photoemission, and an electrode unit connecting with and Ohmic contacting the light emitting film for supplying power for the light emitting film;

a sacrificial layer forming step, forming a removable sacrificial layer on the support portion and around a peripheral of the LED chip, a thickness of the sacrificial layer being continuously reduced from the substrate of the LED chip to the support portion;

a heat sink holder forming step, forming the heat sink holder from a bottom of the LED chip to the sacrificial layer with a material of high thermal conductivity coefficient, the heat sink holder having a top surface substantially parallel to a bottom surface of the substrate; and

a sacrificial layer removing step, including removing the support portion and the sacrificial layer to form the LED light emitter with the heat sink holder.

2. The method for manufacturing the LED light emitter with the heat sink holder as recited in claim 1, further comprising a chip manufacturing step for preliminarily forming the LED chip, the LED chip including the substrate, the light emitting film on the substrate for generating light by photoemission, and the electrode unit connecting with and Ohmic contacting the light emitting film for supplying power for the light emitting film.

3. The method for manufacturing the LED light emitter with the heat sink holder as recited in claim 1, wherein the thickness of the sacrificial layer is continuously reduced along a smooth concave surface from the substrate of the LED chip to the support portion.

4. The method for manufacturing the LED light emitter with the heat sink holder as recited in claim 1, wherein the heat sink holder forming step comprises forming a reflecting mirror from a bottom of the substrate of the LED chip to the sacrificial layer with a material having a high light reflectivity coefficient and high thermal conductivity coefficient, sequentially forming a base coated incrementally upward on the reflecting mirror having a high thermal conductivity material, the reflecting mirror and the base together forming the heat sink holder.

5. The method for manufacturing the LED light emitter with the heat sink holder as recited in claim 4, wherein the reflecting mirror is formed with at least two film portions which are located in a manner that a film portion of a relatively high refractive index is overlapped with a film portion of a relatively low refractive index.

6. The method for manufacturing the LED light emitter with the heat sink holder as recited in claim 4, wherein the base is formed incrementally by electrical coating.