Method for manufacturing a printed circuit board with a thin film capacitor embedded therein having a dielectric film by using laser lift-off, and printed circuit board with a thin film capacitor embedded therein manufactured thereby
First Claim
1. A method for manufacturing a printed circuit board with a thin film capacitor embedded therein, the method comprising:
- forming a dielectric film on a transparent substrate and heat-treating the dielectric film to form a capacitor;
forming a first conductive layer on the heat-treated dielectric film;
stacking a resin coated copper (RCC) film on the conductive layer;
irradiating a laser beam onto a stack formed, from below the transparent substrate, to separate the transparent substrate from the stack;
after the transparent substrate is separated from the stack, forming a second conductive layer with a predetermined pattern on the dielectric film; and
forming an insulating layer and a third conductive layer on the RCC film and the second conductive layer to alternate with each other in a predetermined number.
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Abstract
A method for manufacturing a printed circuit board with a capacitor embedded therein which has a dielectric film using laser lift off, and a capacitor manufactured thereby. In the method, a dielectric film is formed on a transparent substrate and heat-treated. A first conductive layer is formed on the heat-treated dielectric film. A laser beam is irradiated onto a stack formed, from below the transparent substrate, to separate the transparent substrate from the stack. After the transparent substrate is separated from the stack, a second conductive layer is formed with a predetermined pattern on the dielectric film. Also, an insulating layer and a third conductive layer are formed on the first and second conductive layers to alternate with each other in a predetermined number.
72 Citations
16 Claims
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1. A method for manufacturing a printed circuit board with a thin film capacitor embedded therein, the method comprising:
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forming a dielectric film on a transparent substrate and heat-treating the dielectric film to form a capacitor; forming a first conductive layer on the heat-treated dielectric film; stacking a resin coated copper (RCC) film on the conductive layer; irradiating a laser beam onto a stack formed, from below the transparent substrate, to separate the transparent substrate from the stack; after the transparent substrate is separated from the stack, forming a second conductive layer with a predetermined pattern on the dielectric film; and forming an insulating layer and a third conductive layer on the RCC film and the second conductive layer to alternate with each other in a predetermined number. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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Specification