Optoelectronic component with flip-chip mounted optoelectronic device

• US 8,049,161 B2
• Filed: 07/16/2010
• Issued: 11/01/2011
• Est. Priority Date: 11/25/1998
• Status: Expired due to Fees

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: Heiks, Noel A., Sherrer, David W.
• Primary Examiner(s): LE, QUE TAN
• Application Number:
  US12/837,734
• Publication Number:
  US 20110062455A1
• Time in Patent Office: 473 Days
• Field of Search: 250/239, 250/214.R, 250/214.1, 250/216, 385 7- 12, 257 80- 85, 257433-436
• US Class Current: 250/239
• CPC Class Codes: G02B 6/4201 Packages, e.g. shape, construction, internal or external details
• CPC Class Codes: G02B 6/4204 the coupling comprising intermediate optical elements, e.g. lenses, holograms encapsulated active devices H01S5/02208, H01L33/52
• CPC Class Codes: G02B 6/4214 the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device G02B6/4246 takes precedence
• CPC Class Codes: G02B 6/4231 with intermediate elements, e.g. rods and balls, between the elements
• CPC Class Codes: G02B 6/4232 using the surface tension of fluid solder to align the elements, e.g. solder bump techniques flip-chip mounting techniques in assembly of semiconductor devices H01L24/81
• CPC Class Codes: G02B 6/4246 Bidirectionally operating package structures
• CPC Class Codes: G02B 6/4249 comprising arrays of active devices and fibres
• CPC Class Codes: G02B 6/4257 having a supporting carrier or a mounting substrate or a mounting plate G02B6/3648 takes precedence
• CPC Class Codes: G02B 6/4274 Electrical aspects G02B6/4263 and G02B6/4265 take precedence
• CPC Class Codes: G02B 6/4292 the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements

Abstract

Provided are optoelectronic components which include an optoelectronic device and a structure for self-aligning the optoelectronic device. Also provided are optoelectronic modules and methods of forming optoelectronic components.

Claims

1. An optoelectronic component, comprising:

a substrate comprising a first surface and a second surface opposite the first surface;

at least one hole through the substrate, extending from the first surface to the second surface;

an electrical conductor member which is disposed on the first surface and the second surface and extends from the first surface to the second surface through the at least one hole;

at least one light emitting diode flip-chip mounted to the electrical conductor member on the first surface;

a heat sink which is connected to the substrate, and conducts heat away from the light emitting diode; and

an encapsulant disposed over the light emitting diode, wherein the encapsulant forms a surface over the light emitting diode.

2. The optoelectronic component of claim 1, wherein the heat sink is formed on and contacts the second surface of the substrate.

3. The optoelectronic component of claim 1, wherein the at least one hole has a cross sectional area which varies along a direction parallel to a thickness of the substrate.

4. The optoelectronic component of claim 3, wherein the heat sink is insulated from the electrical conductor member.

5. The optoelectronic component of claim 4, wherein the at least one hole has a cross-sectional area in a trapezoidal shape.

6. The optoelectronic component of claim 4, wherein the at least one hole has a cross-sectional area in an hourglass shape.

7. The optoelectronic component of claim 1, wherein the at least one hole comprises a first hole and a second hole.

8. The optoelectronic component of claim 7, wherein the electrical conductor member comprises a first conductor extending from the first surface to the second surface through the first hole and a second conductor extending from the first surface to the second surface through the second hole.

9. The optoelectronic component of claim 8, further comprising solder bumps disposed between the light emitting diode and the electrical conductor.

10. The optoelectronic component of claim 8, wherein the light emitting diode is flip-chip mounted on the first surface with no intervening layers between the light emitting diode and the electrical conductor member.

11. The optoelectronic component of claim 10, wherein the heat sink is insulated from the electrical conductor member.

12. The optoelectronic component of claim 11, wherein the at least one hole has a cross sectional area which varies along a direction parallel to a thickness of the substrate.

13. The optoelectronic component of claim 12, wherein the heat sink is formed on and contacts the second surface of the substrate.

14. The optoelectronic component of claim 13, wherein the encapsulant comprises a rounded protrusion.

15. The optoelectronic component of claim 1, wherein the encapsulant comprises a lens.

16. The optoelectronic component of claim 13, wherein the at least one hole has a cross sectional area in a trapezoidal or hourglass shape.

17. The optoelectronic component of claim 1, wherein the encapsulant comprises a rounded protrusion.

18. The optoelectronic component of claim 1, wherein the surface of the encapsulant is a molded face comprising an optical element formed from the encapsulant.

19. The optoelectronic component of claim 18, wherein the optical element is a lens.

20. The optoelectronic component of claim 19, wherein the heat sink is insulated from the electrical conductor member.

21. The optoelectronic component of claim 1, wherein the substrate is a wafer-level light emitting diode substrate.

22. The optoelectronic component of claim 1, wherein the at least one light emitting diode comprises a plurality of light emitting diodes.

23. An optoelectronic assembly, comprising the optoelectronic component of claim 1.

24. The optoelectronic assembly of claim 23, further comprising a driver.

25. An optoelectronic assembly, comprising the optoelectronic component of claim 11.

26. The optoelectronic assembly of claim 25, further comprising a driver.

27. An optoelectronic component, comprising:

a substrate comprising a front surface, a back surface and at least one via hole formed through the substrate extending from the front surface to the back surface;

an optoelectronic device flip-chip mounted on the front surface;

an electrical conductor member which is disposed on the front surface and the back surface and extending from the front surface to the back surface through the at least one via hole; and

an encapsulant disposed over the optoelectronic device, wherein the encapsulant forms a surface over the optoelectronic device.

28. The optoelectronic component of claim 27, wherein the optoelectronic device is a light emitting diode.

29. The optoelectronic component of claim 28, wherein the at least one via hole has a cross sectional area which varies along a direction parallel to a thickness of the substrate.

30. The optoelectronic component of claim 29, wherein the at lease one via hole has a cross sectional area in a trapezoidal or hourglass shape.

31. The optoelectronic component of claim 30, further comprising a heat sink conducts heat away from the light emitting diode.

32. The optoelectronic component of claim 31, wherein the heat sink is formed on and contacts the back surface.

33. The optoelectronic component of claim 31, wherein the encapsulant comprises rounded protrusion.

34. The optoelectronic component of claim 33, wherein the heat sink is insulated from said electrical conductor member.

35. The optoelectronic component of claim 31, wherein the surface of the encapsulant comprises an optical element.

36. The optoelectronic component of claim 31, wherein the optical element is a lens.

37. The optoelectronic component of claim 36, wherein the heat sink is insulated from said electrical conductor member.

38. The optoelectronic component of claim 29, wherein the at least one via hole comprises a first via hole and a second via hole.

39. The optoelectronic component of claim 38, wherein the electrical conductor member comprises a first conductor extending from the front surface to the back surface through the first via hole and a second conductor extending from the first surface to the second surface through the second via hole.

40. The optoelectronic component of claim 39, further comprising solder bumps disposed between the light emitting diode and the first conductor, and between the light emitting diode and the second conductor.

41. The optoelectronic component of claim 40, wherein the light emitting diode is directly flip-chip mounted on the front surface.

42. The optoelectronic component of claim 41, wherein a cross sectional area of at least one of the first and the second said via holes varies along a direction parallel to a thickness of the substrate.

43. The optoelectronic component of claim 42, wherein the cross-sectional area of the at least one of the first and the second via holes has a trapezoidal or hourglass shape.

44. The optoelectronic component of claim 43, wherein the heat sink is insulated from said electrical conductor member.

45. An optoelectronic assembly, comprising the optoelectronic component of claim 28.

46. The optoelectronic assembly of claim 45, further comprising a driver.