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Substrate-level assembly for an integrated device, manufacturing process thereof and related integrated device

  • US 8,049,287 B2
  • Filed: 04/14/2008
  • Issued: 11/01/2011
  • Est. Priority Date: 10/14/2005
  • Status: Expired
First Claim
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1. A substrate-level assembly, comprising:

  • a device substrate of semiconductor material, having a top face and housing a first integrated device provided with an active area adjacent to the top face;

    a capping substrate coupled to the device substrate above the top face so as to cover the first integrated device in such a manner that a first empty space is provided in a position corresponding to the active area; and

    electrical-contact elements for electrical connection of the first integrated device outside of the substrate-level assembly.

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