Electronic component and method of manufacturing the same
First Claim
1. An electronic component incorporating a passive element, comprising:
- a first conductive layer electrically connected to the passive element;
a top insulation layer formed on the first conductive layer;
an external electrode that is electrically connected to the first conductive layer through a contact hole formed in the top insulation layer and that is formed to spread only on a top surface of the top insulation layer such that the external electrode partially covers the top surface of the top insulation layer;
a first insulation layer formed between the first conductive layer and the top insulation layer; and
a second conductive layer electrically connected to the first conductive layer through a contact hole formed in the first insulation layer, wherein the external electrode is electrically connected to the first conductive layer through the second conductive layer,wherein the passive element is formed on the first insulation layer on which the second conductive layer is formed,the external electrode is a thin film patterned and formed by a thin film process,the electronic component has an overall shape of a rectangular parallelepiped, a longer side of the rectangular parallelepiped having a length less than 1.0 mm when viewed in a direction normal to the top insulating layer; and
wherein the entirety of the passive element is formed on the first insulation layer.
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Accused Products
Abstract
The invention relates to a surface mount type electronic component mounted on a printed circuit board or hybrid IC (HIC) and a method of manufacturing the same and provides an electronic component which can be formed with a small size and a low height at a low cost and a method of manufacturing the same. A common mode choke coil as the electronic component has an overall shape in the form of rectangular parallelepiped that is provided by forming an insulation layer, a coil layer (not shown) formed with a coil conductor, and external electrodes electrically connected to the coil conductor in the order listed on a silicon substrate using thin film forming techniques. The external electrodes are formed to spread on a top surface (mounting surface) of the insulation layer.
82 Citations
12 Claims
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1. An electronic component incorporating a passive element, comprising:
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a first conductive layer electrically connected to the passive element; a top insulation layer formed on the first conductive layer; an external electrode that is electrically connected to the first conductive layer through a contact hole formed in the top insulation layer and that is formed to spread only on a top surface of the top insulation layer such that the external electrode partially covers the top surface of the top insulation layer; a first insulation layer formed between the first conductive layer and the top insulation layer; and a second conductive layer electrically connected to the first conductive layer through a contact hole formed in the first insulation layer, wherein the external electrode is electrically connected to the first conductive layer through the second conductive layer, wherein the passive element is formed on the first insulation layer on which the second conductive layer is formed, the external electrode is a thin film patterned and formed by a thin film process, the electronic component has an overall shape of a rectangular parallelepiped, a longer side of the rectangular parallelepiped having a length less than 1.0 mm when viewed in a direction normal to the top insulating layer; and wherein the entirety of the passive element is formed on the first insulation layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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Specification