Method, apparatus and system for use in processing wafers

• US 8,052,504 B2
• Filed: 07/27/2007
• Issued: 11/08/2011
• Est. Priority Date: 07/02/2004
• Status: Active Grant

• Current Assignee: Revasum, Inc.
• Original Assignee: Strasbaugh Co.
• Inventors: Walsh, Tom, Kalenian, William J., Halley, Dave
• Primary Examiner(s): RACHUBA, MAURINA T
• Application Number:
  US11/829,798
• Publication Number:
  US 20070269986A1
• Time in Patent Office: 1,565 Days
• Field of Search: 451/5, 451/8, 451/41, 451285-290
• US Class Current: 451/5
• CPC Class Codes: B24B 37/30 for single side lapping of plane surfaces
• CPC Class Codes: B24B 37/345 Feeding, loading or unloading work specially adapted to lapping
• CPC Class Codes: H01L 21/67161 characterized by the layout of the process chambers
• CPC Class Codes: H01L 21/67219 comprising at least one polishing chamber polishing apparatuses B24B
• CPC Class Codes: H01L 21/68785 characterised by the mechanical construction of the susceptor, stage or support

Abstract

The present embodiment provides for methods and systems for use in processing objects such as wafers, including polishing and/or grinding wafers. Some embodiments provide systems that include a front-end module and a processing module. The front end module couples with a storage device that stores objects for processing. The front-end module can comprise a single robot, a transfer station, and a plurality of end effectors. The processing module is coupled with the front-end module such that the single robot delivers objects from the storage device to the processing module. The processing module comprising a rotating table, and a spindle with a carrier configured to retrieve the delivered object and process the object on the rotating table.

Claims

1. A system for use in processing wafers, comprising:

a load station that receives wafers to be processed, the load station comprising;

a linear rail assembly providing movement of a portion of the load station in two orthogonal directions;

a wafer chuck;

a wafer guide ring biased with the wafer chuck; and

a load guide ring aligned with the wafer guide ring such that the wafer chuck is separated from the wafer guide ring when the wafer guide ring is moved to contact the load guide ring as the wafer chuck is advanced through the load guide ring to release the wafer from the load station;

wherein the load station further comprises;

a first biasing spring that biases the wafer chuck in contact with the wafer guide ring and allows separation such that the wafer chuck separates from the wafer guide ring.

2. The apparatus of claim 1, wherein the load station comprises a wafer chuck that comprises segmented shoulders providing edge contact support of the wafer in the load station.

3. The system of claim 1, wherein the load guide ring comprises a truncated cone that aligns with the wafer chuck and provides at least some compensation for misalignment between the wafer chuck and the load guide ring.

4. The system of claim 1, wherein the load guide ring comprises a chamfer.

5. The system of claim 4, further comprising:

a spindle; and

a carrier coupled with the spindle, the carrier cooperates with the load station to retrieve wafers from the load station and the carrier comprises a chamfered retaining ring that cooperates with the chamfer of the load guide ring of the load station to align the portion of the load station with the carrier.

6. The system of claim 1, further comprising:

a rotating table;

a first spindle with a first carrier to retrieve one or more of the wafers from the load station and process the wafers on the rotating table;

a first turret coupled with the first spindle to move the first spindle and first carrier between the load station and the rotating table; and

a first turret motor to drive the first turret to move the first spindle.

7. The system of claim 6, further comprising:

a second spindle with a second carrier to retrieve one or more of the wafers from the load station and process the wafers on the rotating table;

a second turret concentric with and positioned within the first turret, the second turret coupled with the second spindle to move the second spindle and second carrier between the load station and the rotating table; and

a second turret motor to drive the second turret to move the second spindle.

8. The system of claim 6, further comprising:

a front-end module comprising a robot that delivers the wafers to the load station, wherein the front-end module further couples with a portable cart that is independent of and couples with the front-end module such that wafers are delivered by the robot from the front end to the portable cart.

9. A system for use in processing wafers, comprising:

a load station that receives wafers to be processed, the load station comprising;

a linear rail assembly providing movement of a portion of the load station in two orthogonal directions;

wherein the load station further comprises a load guide ring comprising one or more recesses providing a tolerance between the load guide ring and a carrier that retrieves a wafer from the load station.

10. The system of claim 9, wherein the recesses are positioned at least partially on an inner circumference of the load guide ring and allow portions of the carrier to extend into the recesses.

11. A system for use in processing wafers, comprising:

a load station that receives wafers to be processed, the load station comprising;

a linear rail assembly providing movement of a portion of the load station in two orthogonal directions;

wherein the load station further comprises a biasing spring such that the biasing spring positions a portion of the load station at a center position, the linear rail assembly allows the portion of the load station to shift relative to the center position when cooperating with a carrier to remove the wafer and the biasing spring returns the portion of the load station to substantially the center position when the carrier retrieves the wafer.

12. A system for use in processing wafers, comprising:

a load station that receives wafers to be processed, the load station comprising;

a linear rail assembly providing movement of a portion of the load station in two orthogonal directions; and

a sensor, comprising;

sensor cap;

a sensor tube cooperated with the sensor cap, the sensor tube couples with a fluid source from which fluid is received forcing the sensor cap in an extended direction toward a wafer when the wafer is positioned in the load station; and

a proximity sensor cooperated with the sensor cap to detect a presence of the wafer.

13. The system of claim 12, wherein the sensor cap comprises a tip from which at least a portion of the fluid exits such that the fluid exiting the tip substantially prevents the sensor cap from contacting the wafer when the wafer is positioned within the load station.