Packages, biochip kits and methods of packaging
First Claim
Patent Images
1. A package comprising:
- a support on which a plurality of biochips are disposed; and
a cover bonded to the support and defining a reaction space for each of the plurality of biochips together with the support, the cover including at least one inlet/outlet,wherein the reaction space includes a top surface, a bottom surface, and sidewalls, the top surface of the reaction space is formed by the cover, the bottom surface of the reaction space is formed by the support, and the sidewalls of the reaction space are formed by a combination of the support and the cover.
1 Assignment
0 Petitions
Accused Products
Abstract
A package having an improved yield is provided. The package includes a support on which a plurality of biochips are disposed, and a cover bonded to the support and defining a reaction space for each of the plurality of biochips together with the support, the cover including at least one inlet/outlet.
8 Citations
29 Claims
-
1. A package comprising:
-
a support on which a plurality of biochips are disposed; and a cover bonded to the support and defining a reaction space for each of the plurality of biochips together with the support, the cover including at least one inlet/outlet, wherein the reaction space includes a top surface, a bottom surface, and sidewalls, the top surface of the reaction space is formed by the cover, the bottom surface of the reaction space is formed by the support, and the sidewalls of the reaction space are formed by a combination of the support and the cover. - View Dependent Claims (2)
-
-
3. A package comprising:
-
a support on which a plurality of biochips are disposed; a spacer bonded to the support and having a plurality of openings corresponding to the plurality of biochips, each of the plurality of openings exposing a biochip, wherein the spacer comprises an inlet/outlet; and a cover bonded to the spacer and defining a reaction space for each of the plurality of biochips together with the support and the spacer. - View Dependent Claims (4, 5, 6, 7, 8)
-
-
9. A biochip kit comprising:
-
a substrate on which a biochip is disposed; and a cover bonded to the substrate and defining a reaction space over the biochip together with the substrate, the cover including at least one inlet/outlet, wherein the reaction space includes a top surface, a bottom surface, and sidewalls, the top surface of the reaction space is formed by the cover, the bottom surface of the reaction space is formed by the substrate, and the sidewalls of the reaction space are formed by a combination of the substrate and the cover. - View Dependent Claims (10, 11)
-
-
12. A biochip kit comprising:
-
a substrate on which a biochip is disposed; a spacer bonded to the substrate and having an opening corresponding to the biochip, the opening exposing the biochip, wherein the spacer comprises an inlet/outlet; and a cover bonded to the spacer and defining a reaction space over the biochip together with the substrate and the spacer, the cover including at least one inlet/outlet. - View Dependent Claims (13, 14, 15, 16, 17, 18)
-
-
19. A packaging method comprising:
-
providing a support on which a plurality of biochips are disposed; and bonding a cover to the support to form a package, the cover including at least one inlet/outlet and defining a reaction space for each of the plurality of biochips together with the support, wherein the cover includes a plurality of cover protrusions, each corresponding to each of the plurality of biochips and wherein the reaction space includes a top surface, a bottom surface, and sidewalls, the cover protrusions being sidewalls of the reaction space. - View Dependent Claims (20)
-
-
21. A biochip kit packaging method comprising:
-
providing a support on which a plurality of biochips are disposed; bonding a cover to the support to form a package, the cover including at least one inlet/outlet and defining a reaction space for each of the plurality of biochips together with the support; and cutting the package to separate the plurality of biochips, each biochip having a discrete reaction space.
-
-
22. A packaging method comprising:
-
providing a support on which a plurality of biochips are disposed; bonding a spacer having a plurality of openings corresponding to the plurality of biochips, each of the plurality of openings exposing each of the plurality of biochips, the spacer being inlet/outlet; and bonding a cover to the spacer to form a package, the cover defining a reaction space for each of the plurality of biochips together with the support and the spacer. - View Dependent Claims (23, 24, 25)
-
-
26. A biochip kit packaging method comprising:
-
providing a support on which a plurality of biochips are disposed bonding a spacer having a plurality of openings corresponding to the plurality of biochips, each of the plurality of openings exposing each of the plurality of biochips; bonding a cover to the spacer to form a package, the cover defining a reaction space for each of the plurality of biochips together with the support and the spacer; and cutting the package to separate the plurality of biochips, each biochip having a discrete reaction space. - View Dependent Claims (27, 28, 29)
-
Specification