Method of fabrication of a FinFET element
First Claim
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1. A method of fabricating a FinFET element comprising:
- providing a substrate;
forming a plurality of silicon fins on the substrate, wherein each of the plurality of fins has a first portion, a second portion underlying the first portion, and a third portion underlying the second portion;
growing a SiGe epitaxial layer on the silicon fins; and
performing a germanium condensation process, wherein the germanium condensation process includes;
transferring germanium from the epitaxial layer to the first portion of each of the silicon fins to form germanium fins (Ge-fins); and
oxidizing the second portion of each of the silicon fins during the transferring germanium, wherein the third portion of each of the plurality of silicon fins remains silicon.
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Abstract
The present disclosure provides a FinFET element and method of fabricating a FinFET element. The FinFET element includes a germanium-FinFET element (e.g., a multi-gate device including a Ge-fin). In one embodiment, the method of fabrication the Ge-FinFET element includes forming silicon fins on a substrate and selectively growing an epitaxial layer including germanium on the silicon fins. A Ge-condensation process may then be used to selectively oxidize the silicon of the Si-fin and transform the Si-fin to a Ge-fin. The method of fabrication provided may allow use of SOI substrate or bulk silicon substrates, and CMOS-compatible processes to form the Ge-FinFET element.
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15 Claims
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1. A method of fabricating a FinFET element comprising:
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providing a substrate; forming a plurality of silicon fins on the substrate, wherein each of the plurality of fins has a first portion, a second portion underlying the first portion, and a third portion underlying the second portion; growing a SiGe epitaxial layer on the silicon fins; and performing a germanium condensation process, wherein the germanium condensation process includes; transferring germanium from the epitaxial layer to the first portion of each of the silicon fins to form germanium fins (Ge-fins); and oxidizing the second portion of each of the silicon fins during the transferring germanium, wherein the third portion of each of the plurality of silicon fins remains silicon. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A method of fabricating a semiconductor device, comprising:
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providing a substrate; forming a silicon fin on the substrate; forming a SiGe layer on the silicon fin; transforming a first portion of the silicon fin to a germanium fin, wherein the transforming includes performing an oxidation to consume silicon of the silicon fin, and wherein the consumed silicon forms a silicon oxide layer on the germanium fin; and oxidizing a second portion of the silicon fin underlying the first portion of the silicon fin during the transforming the first portion of the silicon fin to a germanium fin. - View Dependent Claims (8, 9, 10, 11, 12, 13, 14, 15)
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Specification