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Lamp seat for a light emitting diode and capable of heat dissipation, and method of manufacturing the same

  • US 8,053,787 B2
  • Filed: 11/21/2007
  • Issued: 11/08/2011
  • Est. Priority Date: 06/28/2007
  • Status: Active Grant
First Claim
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1. A lamp seat adapted for a light emitting diode, comprising:

  • a metal substrate having opposite first and second surfaces and formed with first and second through holes that extend from said first surface to said second surface and that are spaced apart from each other, said metal substrate further having first and second annular surrounding walls that define said first and second through holes, respectively;

    a heat-conductive first insulating layer having first, second and third layer portions that are formed respectively over said first and second surfaces and said first annular surrounding wall of said metal substrate;

    first and second conductive patterns formed on said first layer portion of said first insulating layer;

    third and fourth conductive patterns formed on said second layer portion of said first insulating layer;

    a first conductive layer disposed in said first through hole in said metal substrate, formed over said third layer portion of said first insulating layer, and interconnecting integrally and electrically said first and third conductive patterns;

    a second conductive layer disposed in said second through hole in said metal substrate, formed on said second annular surrounding wall of said metal substrate, and interconnecting integrally and electrically said second and fourth conductive patterns; and

    a heat-conductive second insulating layer having first and second openings and formed over said first layer portion of said first insulating layer such that corresponding parts of said first and second conductive patterns are exposed respectively via said first and second openings and are adapted to be connected electrically and respectively to positive and negative electrodes of the light emitting diode;

    a heat-conductive third insulating layer formed over said second annular surrounding wall of said metal substrate such that said third insulating layer is sandwiched between said second annular surrounding wall of said metal substrate and said second conductive layer, and interconnects integrally said first and second layer portions of said first insulating layer; and

    a heat-conductive fourth insulating layer formed over said second layer portion of said first insulating layer such that a portion of said third conductive pattern and a portion of said fourth conductive pattern are exposed outwardly of said fourth insulating layer without extending through said fourth insulating layer, are spaced apart from said first and second through holes in said metal substrate and are adapted for heat transmission and electrical connection with an external power source.

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