Light emitting device, light emitting device and package, and lighting system

• US 8,053,805 B2
• Filed: 12/09/2010
• Issued: 11/08/2011
• Est. Priority Date: 12/11/2009
• Status: Active Grant

• Current Assignee: Suzhou Lekin Semiconductor Company Limited
• Original Assignee: LG Innotek Company Limited (LG Corporation)
• Inventors: Choi, Byeong Kyun, Choo, Sung Ho, Lim, Woo Sik, Kim, Sung Kyoon
• Primary Examiner(s): Fourson, III; George
• Application Number:
  US12/964,454
• Publication Number:
  US 20110140161A1
• Time in Patent Office: 334 Days
• Field of Search: 257/99, 257/E33.065
• US Class Current: 257/99
• CPC Class Codes: H01L 2224/04042 Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
• CPC Class Codes: H01L 2224/0603 Bonding areas having different sizes, e.g. different heights or widths
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/49107 on the semiconductor or solid-state body
• CPC Class Codes: H01L 24/05 of an individual bonding area
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/12036 PN diode
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 33/38 with a particular shape
• CPC Class Codes: H01L 33/387 with a plurality of electrode regions in direct contact with the semiconductor body and being electrically interconnected by another electrode layer

Abstract

Provided are a light emitting device, a light emitting device package, and a lighting system. The light emitting device comprises a light emitting structure layer comprising a first conductive type semiconductor layer, a second conductive type semiconductor layer, and an active layer between the first conductive type semiconductor layer and the second conductive type semiconductor layer, and an electrode comprising a pad part and a finger part on the light emitting structure layer. The pad part comprises a pattern in which at least one opening is defined, and the finger part comprises a pattern electrically connected to the pad part and linearly extending from the pad part.

Claims

1. A light emitting device comprising:

a light emitting structure layer including a first conductive semiconductor layer, an active layer and a second conductive semiconductor layer; and

an electrode including a pad part and a finger part on the light emitting structure layer, wherein the pad part includes a pattern having a spiral shape, and the finger part comprises a pattern electrically connected to the pad part and linearly extending from the pad part.

2. The light emitting device of claim 1, wherein the electrode is disposed on at least one of the first conductive type semiconductor layer and the second conductive type semiconductor layer.

3. The light emitting device of claim 1, wherein a transparent electrode layer on at least portion between the electrode and the light emitting structure layer.

4. The light emitting device of claim 1, wherein the pad part and the finger part have the same pattern width as each other.

5. The light emitting device of claim 1, comprising an electrode pad on the pad part.