Microchip assembly including an inductor and fabrication method

• US 8,053,890 B2
• Filed: 12/19/2006
• Issued: 11/08/2011
• Est. Priority Date: 12/05/2006
• Status: Active Grant

• Current Assignee: Infineon Technologies AG
• Original Assignee: Infineon Technologies AG
• Inventors: Seippel, Dietolf, Puma, Giuseppe Li
• Primary Examiner(s): WILLIAMS, ALEXANDER O
• Application Number:
  US11/641,604
• Publication Number:
  US 20080130257A1
• Time in Patent Office: 1,785 Days
• Field of Search: 257/734, 257/668, 257/774, 257/531, 257/723, 257/686, 257/777, 361/782, 295/921
• US Class Current: 257/734
• CPC Class Codes: H01F 17/0006 Printed inductances printed coils for dynamo-electric machines H02K3/26; printed circuits H05K
• CPC Class Codes: H01F 2017/0046 with a conductive path having a bridge
• CPC Class Codes: H01F 2021/125 Printed variable inductor with taps, e.g. for VCO
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/13099 Material
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 23/5227 Inductive arrangements or effects of, or between, wiring layers other inductive arrangements H01L23/645
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 23/645 Inductive arrangements H01L23/647, H01L23/66 take precedence
• CPC Class Codes: H01L 24/16 of an individual bump connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00011 Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01082 Lead [Pb]
• CPC Class Codes: H01L 2924/014 Solder alloys
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/15787 : Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01L 2924/1902 : including thick film passive components
• CPC Class Codes: H01L 2924/19042 : being an inductor
• CPC Class Codes: H01L 2924/19043 : being a resistor
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: Y10T 29/49002 : Electrical device making

Abstract

An assembly includes a substrate, a chip mounted on the substrate, a voltage controlled oscillator circuit including an inductor and further circuit elements. The inductor is mounted on or in the substrate, and the further circuit elements are mounted on or in the chip. An assembly is disclosed that includes a substrate including a first metallization plane and a second metallization plane, a chip mounted on the substrate, and an inductor mounted on or in the substrate. The inductor includes a first inductor portion in the first metallization plane and a second inductor portion in the second metallization plane. An assembly is also disclosed including a substrate, a chip mounted onto the substrate, and a transformer formed at least in part on or in the substrate.

Claims

1. An assembly, comprising:

a substrate;

a chip mounted on the substrate and electrically connected thereto by contact elements;

a voltage-controlled oscillator circuit, including an inductor and a circuit element; and

wherein the inductor comprises one or more windings integrated within one or more metallization planes in the substrate and electrically connected to the circuit elements by the contact elements, and the circuit element is integrated with the chip, and wherein the one or more windings include cross over structures where one winding portion overlaps another winding portion between vias of the substrate.

2. The assembly of claim 1, wherein the voltage controlled oscillator circuit includes an LC oscillator circuit, the LC oscillator circuit comprising the inductor.

3. The assembly of claim 1, wherein the chip is mounted onto the substrate with the contact elements facing the substrate.

4. An assembly comprising:

a substrate;

a chip mounted on the substrate by way of a plurality of connection elements comprising a ball grid array operable to mount the chip on the substrate; and

a voltage-controlled oscillator circuit, including an inductor and a circuit element,

wherein the inductor is integrated with the substrate and includes cross over structures where one inductor portion overlaps another inductor portion between vias of the substrate, and wherein the circuit element is integrated with the chip, and wherein the inductor is electrically connected with the circuit element through a connection to two of the plurality of connection elements.

5. The assembly of claim 4, wherein the substrate includes at least one metallization plane, and the inductor includes at least one winding arranged in the metallization plane.

6. The assembly of claim 5, wherein the substrate comprises a first metallization plane and a second metallization plane, and the inductor comprises a first winding in the first metallization plane and a second winding in the second metallization plane.

7. A method for fabricating an assembly, comprising:

providing a substrate;

providing a chip;

providing a voltage-controlled oscillator circuit including an inductor and a circuit element;

forming the inductor having windings integral with one or more metallization planes in the substrate, wherein the windings form cross over structures where one winding portion overlaps another winding portion between vias of the substrate;

forming the circuit element integral with the chip;

forming contact elements and mounting the chip onto the substrate with the contact elements; and

electrically connecting the inductor to the circuit elements with the contact elements.

8. The method of claim 7, further comprising mounting the chip onto the substrate with the contact elements facing the substrate.

9. A method for fabricating an assembly, the method comprising

providing a substrate;

providing a chip;

forming a plurality of connection elements to mount the chip on the substrate;

providing a voltage-controlled oscillator circuit including an inductor and a circuit element;

mounting the chip onto the substrate;

forming the inductor integral with the substrate, wherein the inductor comprises cross over structures where one inductor portion overlaps another inductor portion between vias of the substrate;

forming the circuit element integral with the chip; and

connecting the inductor to the connection elements to thereby electrically connect the inductor to the circuit element.

10. An assembly, comprising:

a substrate;

a chip mounted on the substrate and electrically connected thereto by contact elements; and

a voltage-controlled oscillator circuit, including an inductor and a circuit element;

wherein the inductor comprises one or more windings integrated within one or more metallization planes in the substrate and electrically connected to the circuit elements by the contact elements, and the circuit element is housed within the chip, and wherein the one or more windings form cross over structures between vias of the substrate.

11. The assembly of claim 10, wherein the chip is mounted onto the substrate with the contact elements facing the substrate.

12. The assembly of claim 10, wherein the substrate comprises a first metallization plane and a second metallization plane, and the inductor comprises a first winding in the first metallization plane and a second winding in the second metallization plane.