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Electrostatic discharge structures and methods of manufacture

  • US 8,054,597 B2
  • Filed: 06/23/2009
  • Issued: 11/08/2011
  • Est. Priority Date: 06/23/2009
  • Status: Active Grant
First Claim
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1. A structure comprising:

  • an electrostatic discharge (ESD) network that is electrically connected in series to a through wafer via,wherein the ESD network includes an inductive coil that is positioned under a bond pad and the inductive coil has a resistance of less than about 10 ohms and is structured to carry a current of about 1 amp to about 10 amps.

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