Method of producing a suspension board with circuit
First Claim
Patent Images
1. A method of producing a suspension board with circuit comprising the steps of:
- preparing a circuit board comprising preparing a metal supporting board, forming an insulating pattern on the metal supporting board, and forming a conductive pattern on the insulating pattern;
preparing an optical waveguide;
providing the circuit board with a positioning portion comprising a plurality of positioning protrusions for positioning the optical waveguide with the circuit board; and
disposing the optical waveguide on the circuit board while positioning the optical waveguide with respect to the positioning portion,wherein the step of providing the circuit board with the positioning portion further comprises arranging the positioning protrusions to be on opposite sides of the optical waveguide so as to sandwich the optical waveguide therebetween in order to position the optical waveguide with respect to the circuit board when disposing the optical waveguide on the circuit board, andwherein, in the step of preparing the circuit board, the step of forming the conductive pattern on the insulating pattern is conducted simultaneously with the step of providing the positioning portion, such that the plurality of positioning protrusions are made from a conductive layer.
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Accused Products
Abstract
A suspension board with circuit includes a circuit board containing a metal supporting board, an insulating pattern formed on the metal supporting board, and a conductive pattern formed on the insulating pattern; an optical waveguide disposed on the circuit board; and a positioning portion provided on the circuit board in order to position the optical waveguide with respect to the circuit board.
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Citations
4 Claims
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1. A method of producing a suspension board with circuit comprising the steps of:
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preparing a circuit board comprising preparing a metal supporting board, forming an insulating pattern on the metal supporting board, and forming a conductive pattern on the insulating pattern; preparing an optical waveguide; providing the circuit board with a positioning portion comprising a plurality of positioning protrusions for positioning the optical waveguide with the circuit board; and disposing the optical waveguide on the circuit board while positioning the optical waveguide with respect to the positioning portion, wherein the step of providing the circuit board with the positioning portion further comprises arranging the positioning protrusions to be on opposite sides of the optical waveguide so as to sandwich the optical waveguide therebetween in order to position the optical waveguide with respect to the circuit board when disposing the optical waveguide on the circuit board, and wherein, in the step of preparing the circuit board, the step of forming the conductive pattern on the insulating pattern is conducted simultaneously with the step of providing the positioning portion, such that the plurality of positioning protrusions are made from a conductive layer. - View Dependent Claims (2)
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3. A method of producing a suspension board with circuit comprising the steps of:
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preparing a circuit board comprising preparing a metal supporting board, forming an insulating pattern on the metal supporting board, and forming a conductive pattern on the insulating pattern; preparing an optical waveguide; providing the circuit board with a positioning portion comprising a plurality of positioning protrusions for positioning the optical waveguide with the circuit board; and disposing the optical waveguide on the circuit board while positioning the optical waveguide with respect to the positioning portion, wherein the step of providing the circuit board with the positioning portion further comprises arranging the positioning protrusions to be on opposite sides of the optical waveguide so as to sandwich the optical waveguide therebetween in order to position the optical waveguide with respect to the circuit board when disposing the optical waveguide on the circuit board, and wherein, in the step of preparing the circuit board, the step of forming the insulating pattern on the metal supporting board is conducted simultaneously with the step of providing the positioning portion, such that the plurality of positioning protrusions are made from an insulating base layer. - View Dependent Claims (4)
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Specification