Phosphor coating systems and methods for light emitting structures and packaged light emitting diodes including phosphor coating
First Claim
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1. A method, comprising:
- applying a layer of binder material onto an LED structure; and
atomizing a luminescent solution comprising an optical material suspended in a solution using a flow of pressurized gas and spraying the atomized luminescent solution, as a step that is separate from applying the layer of the binder material, onto the LED structure including the layer of binder material using the flow of pressurized gas.
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Abstract
Methods are disclosed including applying a layer of binder material onto an LED structure. A luminescent solution including an optical material suspended in a solution is atomized using a flow of pressurized gas, and the atomized luminescent solution is sprayed onto the LED structure including the layer of binder material using the flow of pressurized gas.
214 Citations
16 Claims
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1. A method, comprising:
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applying a layer of binder material onto an LED structure; and atomizing a luminescent solution comprising an optical material suspended in a solution using a flow of pressurized gas and spraying the atomized luminescent solution, as a step that is separate from applying the layer of the binder material, onto the LED structure including the layer of binder material using the flow of pressurized gas. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A method, comprising:
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applying a layer of binder material onto an LED structure; and atomizing a luminescent solution comprising an optical material suspended in a solution using a flow of pressurized gas and spraying the atomized luminescent solution onto the LED structure including the layer of binder material using the flow of pressurized gas; wherein the luminescent solution comprises wavelength conversion particles suspended in a volatile solvent, the method further comprising evaporating a solvent from the luminescent solution to provide a layer of wavelength conversion particles on the LED structure, wherein evaporating the solvent from the luminescent solution comprises baking the luminescent solution and/or exposing the luminescent solution to ultraviolet light.
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11. A method, comprising:
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applying a layer of binder material onto an LED structure; and atomizing a luminescent solution comprising an optical material suspended in a solution using a flow of pressurized gas and spraying the atomized luminescent solution onto the LED structure including the layer of binder material using the flow of pressurized gas; energizing the LED structure to cause the LED structure to emit light; testing optical characteristics of the light emitted by the LED structure; and if the optical characteristics are not within a predetermined binning threshold, spraying additional luminescent solution comprising a phosphor suspended in a solution onto the LED structure, evaporating the additional luminescent solution to provide an additional layer of phosphor on the LED structure, and applying an additional layer of binder material onto the LED structure.
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12. A method, comprising:
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applying a layer of binder material onto an LED structure; and atomizing a luminescent solution comprising an optical material suspended in a solution using a flow of pressurized gas and spraying the atomized luminescent solution onto the LED structure including the layer of binder material using the flow of pressurized gas; wherein the LED structure comprises an LED wafer, the method further comprising; forming a plurality of electrical contacts on a surface of the LED wafer; and forming a plurality of sacrificial patterns on respective ones of the plurality of electrical contacts; wherein applying the layer of binder material comprises applying the layer of binder material to the sacrificial patterns and onto exposed surfaces of the LED wafer between the sacrificial patterns. - View Dependent Claims (13, 14)
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15. A method of forming a semiconductor light emitting device, comprising:
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applying a layer of binder material onto an LED structure; atomizing a luminescent solution comprising an optical material suspended in a solution using a flow of pressurized gas and spraying the atomized luminescent solution, as a step that is separate from applying the layer of the binder material, onto the LED structure including the layer of binder material using the flow of pressurized gas to provide a first layer of optical material; curing the layer of binder material; testing a light emission characteristic of the LED structure; and if the light emission characteristic of the LED structure is not acceptable, applying a second layer of optical material on the LED structure. - View Dependent Claims (16)
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Specification