Semiconductor power conversion apparatus and method of manufacturing the same

• US 8,058,554 B2
• Filed: 02/20/2008
• Issued: 11/15/2011
• Est. Priority Date: 02/22/2007
• Status: Active Grant

• Current Assignee: Toyota Jidosha Kabushiki Kaisha (Toyota Motor Corporation)
• Original Assignee: Toyota Jidosha Kabushiki Kaisha (Toyota Motor Corporation)
• Inventors: Inagaki, Nobuaki, Ohno, Hirotaka, Nakamura, Hideo, Watanabe, Tomoyuki
• Primary Examiner(s): Ngo; Hung
• Application Number:
  US12/526,854
• Publication Number:
  US 20100089607A1
• Time in Patent Office: 1,364 Days
• Field of Search: 174/68.2, 174/71.B, 174/72.B, 174/70.B, 257/691
• US Class Current: 174/68.2
• CPC Class Codes: H01L 2224/0603 Bonding areas having different sizes, e.g. different heights or widths
• CPC Class Codes: H01L 2224/371 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/37124 Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/37147 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/40095 Kinked
• CPC Class Codes: H01L 2224/40137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/40225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/77272 Oven
• CPC Class Codes: H01L 2224/83801 Soldering or alloying
• CPC Class Codes: H01L 2224/84214 using a laser
• CPC Class Codes: H01L 2224/84801 Soldering or alloying
• CPC Class Codes: H01L 2224/84951 Forming additional members, e.g. for reinforcing
• CPC Class Codes: H01L 24/37 of an individual strap connector
• CPC Class Codes: H01L 24/40 of an individual strap connector
• CPC Class Codes: H01L 24/41 of a plurality of strap connectors
• CPC Class Codes: H01L 24/84 using a strap connector
• CPC Class Codes: H01L 25/072 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01023 : Vanadium [V]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/1305 : Bipolar Junction Transistor [BJT]
• CPC Class Codes: H01L 2924/13055 : Insulated gate bipolar transistor [IGBT]
• CPC Class Codes: H01L 2924/1306 : Field-effect transistor [FET]
• CPC Class Codes: H01L 2924/13091 : Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/351 : Thermal stress
• CPC Class Codes: H02M 7/003 : Constructional details, e.g. physical layout, assembly, wiring or busbar connections

Abstract

A bus bar has a lead portion and a bus bar portion which are integrally shaped. The lead portion is provided in such a shape that branches from the bus bar portion. A part of the lead portion forms a connection part directly electrically connected with a transistor electrode and a diode electrode by a connecting material such as solder. The thickness of the lead portion including the connection part is made smaller than the thickness of the bus bar portion. Accordingly, such an interconnection structure can be provided in which the electrode of the semiconductor device and the bus bar are electrically directly connected with each other and thermal stress at the connection part therebetween can be relieved.

Claims

1. A semiconductor power conversion apparatus comprising:

a semiconductor device for performing power conversion; and

a bus bar for electrically connecting an electrode of said semiconductor device and a circuit component external to the semiconductor device with each other, wherein

said bus bar is configured to include a connection section with said electrode and a non-connection section with said electrode that are integrally shaped and to have a thermal stress relief mechanism for relieving thermal stress acting on a connection part formed of a part of said connection section and electrically connected with said electrode without through bonding wire in a state of being opposed to said electrode,

said connection part is formed to have a thickness smaller than that of said non-connection section thereby forming said thermal stress relief mechanism,

said non-connection section is arranged common to a plurality of said semiconductor devices to extend in a first direction, and

said connection section is provided corresponding to each said semiconductor device in such a shape that branches from said non-connection section and extends in a second direction crossing said first direction, and said connection section has at least a portion in thickness smaller than said non-connection section.

2. The semiconductor power conversion apparatus according to claim 1, wherein said connection section is formed such that in addition to said connection part, a thickness of at least part of that portion excluding said connection part is smaller than that of said non-connection section, thereby forming said thermal stress relief mechanism.

3. The semiconductor power conversion apparatus according to claim 1, wherein said connection section has a part shaped to be displaceable in response to thermal stress acting on said connection part, as said thermal stress relief mechanism, in at least a part of a non-connection part with said electrode.

4. The semiconductor power conversion apparatus according to claim 1, wherein said connection section has a part having a shape thinner than a thickness of said non-connection section and shaped to be displaceable in response to thermal stress acting on said connection part, in at least a part of a non-connection part with said electrode.

5. The semiconductor power conversion apparatus according to claim 1, wherein

said non-connection section has an electrical connection portion with said circuit component, and

said connection section is shaped to branch from said non-connection section and to be thinner than said non-connection section.

6. The semiconductor power conversion apparatus according to claim 1, further comprising:

a fixed post formed of an insulating material for attaching said non-connection section; and

a circuit board mounted on said fixed post with said non-connection section interposed, wherein

said non-connection section has a protrusion portion provided integrally with said non-connection section on that surface opposite to a surface having said fixed post attached thereon, and

said circuit board has

a mounting hole having said protrusion portion fitted therein and

a conductive portion configured such that electrical connection is established between said non-connection section and a circuit component on said circuit board by connecting said protrusion portion to said mounting hole.

7. The semiconductor power conversion apparatus according to claim 1, wherein

said bus bar further includes

a first protection coat formed by covering a surface of a non-connection part with said electrode with an insulating material and

a second protection coat formed by heat-curing an insulating material coated on a surface of said connection part with said electrode in a state of being connected with said electrode.

8. The semiconductor power conversion apparatus according to claim 1, wherein said bus bar further includes a protection coat formed by heat-curing an insulating material coated on the surfaces of said connection section and said non-connection section in a state of being connected with said electrode.

9. The semiconductor power conversion apparatus according to claim 1, wherein

said semiconductor device is configured such that current between first and second current electrodes is controlled according to a potential or current of a control electrode, and

said bus bar electrically connects said control electrode with said circuit component.

10. The semiconductor power conversion apparatus according to claim 1, wherein

said semiconductor device is configured such that current between first and second current electrodes is controlled according to a potential or current of a control electrode, and

said bus bar electrically connects one of said first and second current electrodes with said circuit component.

11. The semiconductor power conversion apparatus according to claim 1, wherein said bus bar is electrically connected with electrodes of a plurality of said semiconductor devices in common.

12. A method of manufacturing a semiconductor power conversion apparatus comprising:

a first process of electrically connecting a bus bar with an electrode of a semiconductor device, said bus bar being configured to include a connection section with said electrode of said semiconductor device and a non-connection section with said electrode that are integrally shaped, said connection section having a thermal stress relief mechanism for relieving thermal stress acting on a connection part with said electrode;

said connection part being electrically connected with said electrode without through bonding wire in a state of being opposed to said electrode; and

a second process for forming an insulating protection coat for said connection part of said bus bar with said electrode formed through said first process, wherein

said connection part is formed to have a thickness smaller than that of said non-connection section thereby forming said thermal stress relief mechanism,

said non-connection section is arranged common to a plurality of said semiconductor devices to extend in a first direction, and

said connection section is provided corresponding to each said semiconductor device in such a shape that branches from said non-connection section and extends in a second direction crossing said first direction, and said connection section has at least a portion in thickness smaller than said non-connection section.

13. The method of manufacturing a semiconductor power conversion apparatus according to claim 12, wherein

a first protection coat is provided prior to said first process, and being formed by previously covering with an insulating material a surface of non-connection part with said electrode of said bus bar, and

said second process includes

a first sub-process of coating with an insulating material a surface of said connection part with said electrode in a state of being connected with said electrode, and

a second sub-process of forming a second protection coat by heat-curing a coating formed through said first sub-process.

14. The method of manufacturing a semiconductor power conversion apparatus according to claim 13, wherein in said first sub-process, the surface of said connection part is coated with an insulating material by spraying a sol-like insulating resin.

15. The method of manufacturing a semiconductor power conversion apparatus according to claim 13, wherein

said second process includes

a first sub-process of charging a gel-like insulating material for soaking said semiconductor device and said bus bar,

a second sub-process of exhausting and recovering said insulating material so that a coating of the insulating material is left on the surfaces of said connection section and said non-connection section of said bus bar, and

a third sub-process of heat-curing the coating formed through said second sub-process thereby forming a protection coat.

16. The method of manufacturing a semiconductor power conversion apparatus according to claim 12:

wherein in said first process, said non-connection section is attached to a fixed post formed of an insulating material,

said method further comprising

a third process of mounting a circuit board on said fixed post with said non-connection section interposed,

said third process including

a first sub-process of fitting a protrusion portion in a mounting hole provided in said circuit board, said protrusion portion being provided integrally with said non-connection section on that surface opposite to a surface of said non-connection section having said fixed post attached thereon, and

a second sub-process of connecting said protrusion portion with a conductive portion provided on a side surface of said mounting hole and electrically connected to a circuit component on said circuit board, thereby electrically connecting said conductive portion and said protrusion portion with each other.