Overmolded semiconductor package with an integrated antenna

• US 8,058,714 B2
• Filed: 09/25/2008
• Issued: 11/15/2011
• Est. Priority Date: 09/25/2008
• Status: Active Grant

• Current Assignee: Skyworks Solutions Incorporated
• Original Assignee: Skyworks Solutions Incorporated
• Inventors: Noll, Thomas, Lee, Gye-An
• Primary Examiner(s): DINH, TRINH VO
• Application Number:
  US12/284,938
• Publication Number:
  US 20100073255A1
• Time in Patent Office: 1,146 Days
• Field of Search: None
• US Class Current: 257/678
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 2924/15313 being a land array, e.g. LGA
• CPC Class Codes: H01L 2924/19041 being a capacitor
• CPC Class Codes: H01L 2924/19042 being an inductor
• CPC Class Codes: H01L 2924/19043 being a resistor
• CPC Class Codes: H01L 2924/19105 in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01L 2924/19107 off-chip wires
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H01Q 1/40 Radiating elements coated with or embedded in protective material
• CPC Class Codes: H01Q 1/44 using equipment having another main function to serve additionally as an antenna , e.g. means for giving an antenna an aesthetic aspectH01Q1/27 - H01Q1/34 take precedence
• CPC Class Codes: H01Q 23/00 Antennas with active circuits or circuit elements integrated within them or attached to them

Abstract

According to an exemplary embodiment, an overmolded semiconductor package includes at least one semiconductor die situated over a package substrate. The overmolded semiconductor package further includes a mold compound overlying the at least one semiconductor die and the package substrate. The overmolded semiconductor package further includes a conductive layer situated on an outer surface of the mold compound and having an opening. The overmolded semiconductor package further includes an antenna feed line situated in the mold compound and having a portion exposed in the opening in the conductive layer, thereby providing an antenna input on the outer surface of the mold compound.

Claims

1. An overmolded semiconductor package comprising:

at least one semiconductor die situated over a package substrate;

a mold compound overlying said at least one semiconductor die and said package substrate;

a conductive layer situated on an outer surface of said mold compound;

an antenna feed line situated in said mold compound and having a portion exposed in an opening in said conductive layer so as to provide an antenna input on said outer surface of said mold compound.

2. The overmolded semiconductor package of claim 1 further comprising an antenna situated over said conductive layer and connected to said antenna feed line.

3. The overmolded semiconductor package of claim 2 further comprising an insulative layer situated between said antenna and said conductive layer.

4. The overmolded semiconductor package of claim 2 further comprising a bond pad situated over said package substrate, wherein said antenna feed line couples said antenna to said bond pad.

5. The overmolded semiconductor package of claim 1 further comprising a bond pad situated over said package substrate, wherein said antenna feed line is coupled to said bond pad.

6. The overmolded semiconductor package of claim 1, wherein said antenna feed line is coupled to said at least one semiconductor die.

7. The overmolded semiconductor package of claim 1, wherein said conductive layer comprises a conductive polymer.

8. The overmolded semiconductor package of claim 1, wherein said conductive layer forms a ground plane on said outer surface of said mold compound.

9. The overmolded semiconductor package of claim 1, wherein said antenna feed line is electrically shielded in said mold compound.

10. The overmolded semiconductor package of claim 1, wherein said outer surface is a top surface of said mold compound.

11. An overmolded semiconductor package comprising:

at least one semiconductor die situated over a package substrate;

a support structure situated over said package substrate and said at least one semiconductor die;

an antenna situated on said support structure;

a mold compound overlying said at least one semiconductor die, said package substrate, and said support structure;

an antenna feed line situated in said mold compound; and

a conductive layer situated over a top surface of said mold compound, said conductive layer having an opening situated over said antenna.

12. The overmolded semiconductor package of claim 11, wherein said antenna feed line is coupled to said antenna.

13. The overmolded semiconductor package of claim 11, wherein said antenna feed line couples said antenna to said package substrate.

14. The overmolded semiconductor package of claim 11, wherein said antenna feed line couples said antenna to said at least one semiconductor die.

15. The overmolded semiconductor package of claim 11, wherein said antenna is situated on a top surface of said support structure.

16. The overmolded semiconductor package of claim 11, wherein said antenna is situated on a bottom surface of said support structure.

17. The overmolded semiconductor package of claim 11, wherein said mold compound is situated under said support structure.

18. The overmolded semiconductor package of claim 11, wherein said conductive layer includes a conductive paint.

19. The overmolded semiconductor package of claim 11, wherein said support structure includes a polymer.

20. An overmolded semiconductor package comprising:

at least one semiconductor die situated over a package substrate;

a support structure situated over said package substrate and said at least one semiconductor die, said support structure being formed of a polymer;

an antenna situated on said support structure;

a mold compound overlying said at least one semiconductor die, said package substrate, and said support structure; and

an antenna feed line situated in said mold compound.