×

Package in package device for RF transceiver module

  • US 8,058,715 B1
  • Filed: 01/09/2009
  • Issued: 11/15/2011
  • Est. Priority Date: 01/09/2009
  • Status: Active Grant
First Claim
Patent Images

1. A semiconductor device, comprising:

  • a substrate having a conductive pattern disposed thereon;

    an RF package electrically connected to the conductive pattern of the substrate, the RF package including a package substrate having an RF shield attached thereto;

    a spacer attached to the RF package and electrically connected to the conductive pattern of the substrate by at least one spacer conductive wire;

    a semiconductor die attached to the spacer and electrically connected to the conductive pattern of the substrate; and

    a package body at least partially encapsulating the RF package, the semiconductor die and the substrate, and partially covering the spacer conductive wire.

View all claims
  • 5 Assignments
Timeline View
Assignment View
    ×
    ×