Package in package device for RF transceiver module
First Claim
1. A semiconductor device, comprising:
- a substrate having a conductive pattern disposed thereon;
an RF package electrically connected to the conductive pattern of the substrate, the RF package including a package substrate having an RF shield attached thereto;
a spacer attached to the RF package and electrically connected to the conductive pattern of the substrate by at least one spacer conductive wire;
a semiconductor die attached to the spacer and electrically connected to the conductive pattern of the substrate; and
a package body at least partially encapsulating the RF package, the semiconductor die and the substrate, and partially covering the spacer conductive wire.
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Accused Products
Abstract
In accordance with the present invention, there is provided multiple embodiments of a package-in-package semiconductor device including an RF package and a semiconductor die which are provided in a stacked arrangement and are each electrically connected to an underlying substrate through the use of conductive wires alone or in combination with conductive bumps. In certain embodiments of the present invention, the RF package and the semiconductor die are separated from each other by an intervening spacer which is fabricated from aluminum, or from silicon coated with aluminum. If included in the semiconductor device, the spacer is also electrically connected to the substrate, preferably through the use of conductive wires. The RF package, the semiconductor die, the spacer (if included) and a portion of the substrate are at least partially covered or encapsulated by a package body of the semiconductor device.
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Citations
12 Claims
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1. A semiconductor device, comprising:
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a substrate having a conductive pattern disposed thereon; an RF package electrically connected to the conductive pattern of the substrate, the RF package including a package substrate having an RF shield attached thereto; a spacer attached to the RF package and electrically connected to the conductive pattern of the substrate by at least one spacer conductive wire; a semiconductor die attached to the spacer and electrically connected to the conductive pattern of the substrate; and a package body at least partially encapsulating the RF package, the semiconductor die and the substrate, and partially covering the spacer conductive wire. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A semiconductor device, comprising:
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a substrate having a conductive pattern disposed thereon; an RF package electrically connected to the conductive pattern of the substrate, the RF package including a package substrate having an RF shield attached thereto; a spacer attached to the RF package and electrically connected to the conductive pattern of the substrate by at least one spacer conductive wire; a semiconductor die attached to the spacer by a film-over-wire which partially covers the spacer conductive wire, the semiconductor die being electrically connected to the conductive pattern of the substrate; and a package body at least partially encapsulating the RF package, the spacer, the semiconductor die and the substrate, and partially covering the spacer conductive wire. - View Dependent Claims (11)
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12. A semiconductor device, comprising:
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a substrate; an RF package including a package substrate having an RF shield attached thereto, the RF shield being attached to the substrate of the semiconductor device by an adhesive layer, the RF package being electrically connected to the substrate by at least one package conductive wire; a spacer attached to the package substrate by a first film-over-wire which partially covers the package conductive wire, the spacer being electrically connected to the substrate by at least one spacer conductive wire; a semiconductor die attached to the spacer by a second film-over-wire which partially covers the spacer conductive wire, the semiconductor die being electrically connected to the substrate; and a package body at least partially encapsulating the RF package, the semiconductor die, the package conductive wire, the spacer conductive wire, and the substrate.
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Specification