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Chip scale power converter package having an inductor substrate

  • US 8,058,960 B2
  • Filed: 03/27/2007
  • Issued: 11/15/2011
  • Est. Priority Date: 03/27/2007
  • Status: Active Grant
First Claim
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1. A power converter package comprising:

  • an inductor substrate having an electrically conductive path formed from a plurality of line segments disposed on a surface, defining a spirangle inductor, the spirangle inductor comprising the plurality of line segments being straight line segments, the plurality of straight line segments maximizing an inductance of the spirangle inductor, the spirangle inductor being a predetermined angled spirangle originating at a first end and making a number of turns to a second end, wherein the plurality of straight line segments occupy substantially the same plane; and

    a power integrated circuit bonded onto the spiranqle inductor substrate and in superimposition with a region of said surface, with a subset of said plurality of line segments lying outside of said region, and a plurality of contacts on said surface being outside of the spirangle inductor being connected respectively to a plurality of contacts on said surface being connected to the power integrated circuit and enclosed by the spirangle inductor by a cross over metal layer without connecting to an end of the spirangle inductor.

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