Chip scale power converter package having an inductor substrate
First Claim
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1. A power converter package comprising:
- an inductor substrate having an electrically conductive path formed from a plurality of line segments disposed on a surface, defining a spirangle inductor, the spirangle inductor comprising the plurality of line segments being straight line segments, the plurality of straight line segments maximizing an inductance of the spirangle inductor, the spirangle inductor being a predetermined angled spirangle originating at a first end and making a number of turns to a second end, wherein the plurality of straight line segments occupy substantially the same plane; and
a power integrated circuit bonded onto the spiranqle inductor substrate and in superimposition with a region of said surface, with a subset of said plurality of line segments lying outside of said region, and a plurality of contacts on said surface being outside of the spirangle inductor being connected respectively to a plurality of contacts on said surface being connected to the power integrated circuit and enclosed by the spirangle inductor by a cross over metal layer without connecting to an end of the spirangle inductor.
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Abstract
A chip scale power converter package having an inductor substrate and a power integrated circuit flipped onto the inductor substrate is disclosed. The inductor substrate includes a high resistivity substrate having a planar spiral inductor formed thereon.
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Citations
36 Claims
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1. A power converter package comprising:
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an inductor substrate having an electrically conductive path formed from a plurality of line segments disposed on a surface, defining a spirangle inductor, the spirangle inductor comprising the plurality of line segments being straight line segments, the plurality of straight line segments maximizing an inductance of the spirangle inductor, the spirangle inductor being a predetermined angled spirangle originating at a first end and making a number of turns to a second end, wherein the plurality of straight line segments occupy substantially the same plane; and a power integrated circuit bonded onto the spiranqle inductor substrate and in superimposition with a region of said surface, with a subset of said plurality of line segments lying outside of said region, and a plurality of contacts on said surface being outside of the spirangle inductor being connected respectively to a plurality of contacts on said surface being connected to the power integrated circuit and enclosed by the spirangle inductor by a cross over metal layer without connecting to an end of the spirangle inductor. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A chip scale inductor substrate comprising:
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a high resistivity substrate having a plurality of contacts disposed on a region thereof; and a conductive path formed from a plurality of line segments surrounding said region and defining a spirangle inductor on a surface of the substrate, the spirangle inductor comprising the plurality of line segments being straight line segments, the plurality of straight line segments maximizing an inductance of the spirangle inductor, the spirangle inductor being a predetermined angled spirangle originating at a first end and making a number of turns to a second end, wherein the plurality of straight line segments occupy substantially the same plane, with a subset of said plurality of line segments being outside said region, and a plurality of contacts on said surface being outside of the spirangle inductor being connected respectively to a plurality of contacts on said surface being connected to the power integrated circuit and enclosed by the spirangle inductor by a cross over metal layer without connecting to an end of the spirangle inductor. - View Dependent Claims (10, 11, 12, 13, 14, 15)
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16. A method of fabricating a chip scale power converter package comprising:
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providing a substrate having a surface; fabricating a plurality of spirangle inductors on the substrate to form a plurality of inductor substrates, with each of said spirangle inductors having a plurality of line segments, each spirangle inductor comprising the plurality of line segments being straight line segments, the plurality of straight line segments maximizing an inductance of the spirangle inductor, the spirangle inductor being a predetermined angled spirangle originating at a first end and making a number of turns to a second end, wherein the plurality of straight line segments occupy substantially the same plane; bonding an integrated circuit onto each spirangle inductor substrate in superimposition with a region of said surface, with a subset of said plurality of line segments being outside said region, and a plurality of contacts on said surface being outside of the spirangle inductor being connected respectively to a plurality of contacts on said surface being connected to the power integrated circuit and enclosed by the spirangle inductor by a cross over metal layer without connecting to an end of the spirangle inductor; and dicing the plurality of inductor substrates. - View Dependent Claims (17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35)
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36. A power converter package comprising:
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an inductor substrate having an electrically conductive path formed from a plurality of line segments disposed on a surface, defining a spirangle inductor, the spirangle inductor comprising the plurality of line segments being straight line segments, the plurality of straight line segments maximizing an inductance of the spirangle inductor, the spirangle inductor being a predetermined angled spirangle having at least a four angle spirangle with the spirangle inductor originating at a first end and making a number of turns to a second end in a contiguous and unitary fashion, wherein the plurality of straight line segments occupy the general same plane with the plane being generally parallel to the inductor substrate; and a power integrated circuit bonded onto the spirangle inductor substrate, and in superimposition with a region of said surface, with a subset of said plurality of line segments lying outside of said region, and a plurality of contacts on said surface being outside of the spirangle inductor being connected respectively to a plurality of contacts on said surface being connected to the power integrated circuit and enclosed by the spirangle inductor by a cross over metal layer without connecting to an end of the spirangle inductor; and a magnetic element associated with the spirangle inductor, the magnetic element increasing the inductance per unit area of the spirangle inductor and the magnetic element providing shielding of stray magnetic fields, wherein the power converter package is used for greater than or equal to 5 MHz frequency applications.
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Specification