Ejection nozzle arrangement having dynamic and static structures

• US 8,061,812 B2
• Filed: 11/16/2010
• Issued: 11/22/2011
• Est. Priority Date: 07/15/1997
• Status: Expired due to Fees

• Current Assignee: Memjet Technology Ltd. (Memjet Limited)
• Original Assignee: Silverbrook Research Pty Limited
• Inventors: Silverbrook, Kia
• Primary Examiner(s): JACKSON, JUANITA DIONNE
• Application Number:
  US12/947,610
• Publication Number:
  US 20110063375A1
• Time in Patent Office: 371 Days
• Field of Search: 347/20, 347/40, 347/42, 347/44, 347/47, 347/49, 347/54, 347/56, 347 61- 67, 347 84- 87
• US Class Current: 347/54
• CPC Class Codes: B41J 2/14 Structure thereof only for on-demand ink jet heads
• CPC Class Codes: B41J 2/14427 Structure of ink jet print heads with thermal bend detached actuators
• CPC Class Codes: B41J 2/1601 Production of bubble jet print heads B41J2/1606, B41J2/162 take precedence
• CPC Class Codes: B41J 2/1623 bonding and adhesion
• CPC Class Codes: B41J 2/1626 etching
• CPC Class Codes: B41J 2/1628 dry etching
• CPC Class Codes: B41J 2/1629 wet etching
• CPC Class Codes: B41J 2/1631 photolithography
• CPC Class Codes: B41J 2/1632 machining
• CPC Class Codes: B41J 2/1635 dividing the wafer into individual chips
• CPC Class Codes: B41J 2/1637 molding
• CPC Class Codes: B41J 2/1639 sacrificial molding
• CPC Class Codes: B41J 2/1642 thin film formation by CVD [chemical vapor deposition]
• CPC Class Codes: B41J 2/1643 thin film formation by plating
• CPC Class Codes: B41J 2/1645 thin film formation by spincoating
• CPC Class Codes: B41J 2/1646 thin film formation by sputtering
• CPC Class Codes: B41J 2/1648 Production of print heads with thermal bend detached actuators
• CPC Class Codes: B41J 2/16585 for paper-width or non-reciprocating print heads
• CPC Class Codes: B41J 2/17513 Inner structure
• CPC Class Codes: B41J 2/17596 Ink pumps, ink valves
• CPC Class Codes: B41J 2002/041 : Electromagnetic transducer
• CPC Class Codes: B41J 2002/14346 : Ejection by pressure produced by thermal deformation of ink chamber, e.g. buckling
• CPC Class Codes: B41J 2002/14435 : Moving nozzle made of thermal bend detached actuator
• CPC Class Codes: B41J 2202/21 : Line printing
• CPC Class Codes: B82Y 30/00 : Nanotechnology for materials or surface science, e.g. nanocomposites
• CPC Class Codes: G06F 21/79 : in semiconductor storage media, e.g. directly-addressable memories
• CPC Class Codes: G06F 21/86 : Secure or tamper-resistant housings
• CPC Class Codes: G06F 2221/2129 : Authenticate client device independently of the user
• CPC Class Codes: G06K 1/121 : by printing code marks applying code marks to labels B65C9/46; marking or coding completed packages B65B61/26
• CPC Class Codes: G06K 19/06037 : multi-dimensional coding
• CPC Class Codes: G06K 7/14 : using light without selection of wavelength, e.g. sensing reflected white light G06K7/10831 - G06K7/1097 take precedence
• CPC Class Codes: G06K 7/1417 : 2D bar codes
• CPC Class Codes: G11C 11/56 : using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency
• CPC Class Codes: H04N 1/2154 : the still video camera incorporating a hardcopy reproducing device, e.g. a printer
• CPC Class Codes: H04N 2101/00 : Still video cameras
• CPC Class Codes: H04N 23/00 : Cameras or camera modules comprising electronic image sensors; Control thereof
• CPC Class Codes: H04N 5/2628 : Alteration of picture size, shape, position or orientation, e.g. zooming, rotation, rolling, perspective, translation

Abstract

An ejection nozzle arrangement is provided having a fluid chamber having a wall and a fluid port, an arm extending through an aperture in the wall, a dynamic structure cantilevered from the wall adjacent the aperture, a static structure cantilevered from the wall adjacent the dynamic structure. The arm is connected to the dynamic and static structures at a point distal from the aperture such that thermal expansion of the dynamic structure moves the arm upwards in the chamber to eject fluid from the chamber through the port.

Claims

1. An ejection nozzle arrangement comprising:

a fluid chamber having a wall and a fluid port;

an arm extending through an aperture in the wall;

a dynamic structure cantilevered from the wall adjacent the aperture;

a static structure cantilevered from the wall adjacent the dynamic structure,

wherein the arm is connected to the dynamic and static structures at a point distal from the aperture such that thermal expansion of the dynamic structure moves the arm upwards in the chamber to eject fluid from the chamber through the port.

2. A nozzle arrangement as claimed in claim 1, in which CMOS dielectric layers are positioned about the chamber with CMOS micro-processing drive circuitry positioned on the CMOS dielectric layers.

3. A nozzle arrangement as claimed in claim 2, in which a metal diffusion barrier is positioned in the dielectric layers.

4. A nozzle arrangement as claimed in claim 1, in which the static structure defines a fixed part of the wall and the dynamic structure defines a movable part of the wall connected to the port.

5. A nozzle arrangement as claimed in claim 4, in which the movable part of the wall overlaps the fixed part of the wall.

6. A nozzle arrangement as claimed in claim 5, in which the fixed part of the wall defines an inwardly directed lip that extends into the chamber and an outwardly directed, re-entrant portion that terminates in a radially extending rim, and the moveable part terminates at a free edge so that the re-entrant portion and the free edge define a fluidic seal in the wall.