Method of making RFID devices

• US 8,062,445 B2
• Filed: 08/06/2007
• Issued: 11/22/2011
• Est. Priority Date: 08/06/2007
• Status: Active Grant

• Current Assignee: Avery Dennison Retail Information Services LLC (Avery Dennison Corporation)
• Original Assignee: Avery Dennison Corporation
• Inventors: Kian, Kouroche
• Primary Examiner(s): SELLS, JAMES D
• Application Number:
  US11/834,139
• Publication Number:
  US 20090038735A1
• Time in Patent Office: 1,569 Days
• Field of Search: 156/73.1, 156/290, 156/292, 156/308.2, 156/580.1, 156/580.2, 228/1.1, 228/110.1
• US Class Current: 156/73.1
• CPC Class Codes: G06K 19/07718 the record carrier being manufactured in a continuous process, e.g. using endless rolls
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/07752 using an interposer
• CPC Class Codes: H01L 2224/16 of an individual bump connector

Abstract

A method of making a radio frequency identification (RFID) device includes temporarily adhering an RFID interposer to an antenna, and subsequently ultrasonically welding the interposer leads to the antenna. The temporary adhering may involve use of any of variety of suitable adhering materials, such as an adhesive, wax, or even water. The adhering and the ultrasonic welding may be parts of a process that involves mostly continuous movement of an antenna web that has multiple antennas on it. The adhering material temporarily holds the interposer in place prior to the ultrasonic welding, which is important in a process that involves a moving web. The adhering may be such that there is no material between the conductive material interposer leads, and conductive material of the antenna. This allows the ultrasonic welding to proceed without any need to push intervening material aside.

Claims

1. A method of making an RFID device, the method comprising:

temporarily coupling together a first portion of the RFID device to a second portion of the RFID device while the RFID device is continuously moving, using an adhering material placed on one or both of the portions;

feeding the first and second portions to a buffer zone; and

subsequent to the coupling, ultrasonically welding the portions together while the RFID device is intermittently moving from the buffer zone.

2. The method of claim 1,

wherein the first portion includes an RFID interposer;

wherein the second portion includes an antenna; and

wherein the ultrasonic welding includes welding conductive interposer leads of the interposer to the antenna.

3. The method of claim 2, wherein the antenna has a thickness of less than 10 microns.

4. The method of claim 2, wherein the antenna and the interposer leads are made of the same material.

5. The method of claim 2, wherein the antenna and the interposer leads are made of different materials.

6. The method of claim 5,

wherein one of the antenna and the interposer leads is made of copper;

and

wherein the other of the antenna and the interposer leads is made of aluminum.

7. The method of claim 2, wherein the antenna is part of an antenna web.

8. The method of claim 7,

wherein the interposer is initially part of an interposer web;

and

further comprising;

separating the interposer from the interposer web; and

moving the interposer to the antenna web for the temporarily coupling.

9. The method of claim 1,

wherein the first portion includes an RFID chip;

wherein the second portion includes conductive leads of an RFID interposer or antenna; and

wherein the ultrasonic welding includes welding the chip to the interposer or antenna leads.

10. The method of claim 9,

wherein the adhering material includes an adhesive;

and

wherein the coupling includes adhesively attaching the portions.

11. The method of claim 10, further comprising curing the adhesive after welding the chip to the interposer or the antenna.

12. The method of claim 1, wherein the adhering material includes water.

13. The method of claim 1, wherein the adhering material includes a low-melting-temperature wax.

14. The method of claim 1, further comprising passing the web through a buffer zone between a continuously moving zone, where the coupling is performed, and an intermittently moving zone, where the welding is performed.

15. The method of claim 1, wherein the welding includes welding the portions with a gang welder, as part of a gang welding that welds multiple RFID devices substantially simultaneously.

16. The method of claim 1, wherein the welding includes pressing the portions together.

17. The method of claim 16, wherein the coupling includes placing the adhering material between conductive parts of the portions;

and

wherein the pressing includes squeezing the adhering material out from between the conductive parts of the portions.

18. The method of claim 1, wherein the adhering includes a non-adhesive material.

19. A method of making an RFID device, the method comprising:

advancing a first web containing a plurality of interposers;

separating each of the plurality of interposers from the web;

providing an antenna web having a plurality of antennas;

transporting each of the plurality of interposers to the antenna web;

temporarily coupling together each of the plurality of separated interposers to the antenna web while the antenna web is continuously moving, using an adhering material; and

subsequent to the coupling, ultrasonically gang welding together the plurality of interposers to the antenna web while the antenna web is intermittently moving.