Method of making a semiconductor chip assembly with a post/base heat spreader and horizontal signal routing
First Claim
1. A method of making a semiconductor chip assembly, comprising:
- providing a post, a base, an adhesive and a substrate, whereinthe substrate includes a first conductive layer, a second conductive layer and a dielectric layer therebetween,the post is adjacent to the base, extends above the base in an upward direction, extends through an opening in the adhesive and extends into an aperture in the substrate,the base extends below the post in a downward direction opposite the upward direction and extends laterally from the post in lateral directions orthogonal to the upward and downward directions,the adhesive is mounted on and extends above the base, is sandwiched between the base and the substrate and is non-solidified,the substrate is mounted on and extends above the adhesive, the first conductive layer extends above the dielectric layer, the dielectric layer extends above the second conductive layer, anda gap is located in the aperture between the post and the substrate;
thenflowing the adhesive into and upward in the gap;
solidifying the adhesive;
thenproviding a pad and a terminal, including;
grinding the post, the adhesive and the first conductive layer such that the post, the adhesive and the first conductive layer are laterally aligned with one another at a top lateral surface that faces in the upward direction; and
thenremoving selected portions of the first conductive layer;
thenmounting a semiconductor device on a heat spreader that includes the post and the base, wherein the semiconductor device overlaps the post, the substrate includes the pad, the terminal, a routing line and first and second vias, the pad and the terminal include selected portions of the first conductive layer, the routing line includes a selected portion of the second conductive layer and the vias each extend through the dielectric layer;
electrically connecting the semiconductor device to the pad, thereby electrically connecting the semiconductor device to the terminal, wherein an electrically conductive path between the pad and the terminal includes the first via, the routing line and the second via; and
thermally connecting the semiconductor device to the post, thereby thermally connecting the semiconductor device to the base.
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Accused Products
Abstract
A method of making a semiconductor chip assembly includes providing a post and a base, mounting an adhesive on the base including inserting the post through an opening in the adhesive, mounting a substrate on the adhesive including inserting the post into an aperture in the substrate to form a gap in the aperture between the post and the substrate, then flowing the adhesive into and upward in the gap, solidifying the adhesive, then mounting a semiconductor device on a heat spreader that includes the post and the base, electrically connecting the semiconductor device to the substrate and thermally connecting the semiconductor device to the heat spreader. The substrate includes first and second conductive layers and a dielectric layer therebetween and provides horizontal signal routing between a pad and a terminal at the first conductive layer.
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Citations
25 Claims
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1. A method of making a semiconductor chip assembly, comprising:
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providing a post, a base, an adhesive and a substrate, wherein the substrate includes a first conductive layer, a second conductive layer and a dielectric layer therebetween, the post is adjacent to the base, extends above the base in an upward direction, extends through an opening in the adhesive and extends into an aperture in the substrate, the base extends below the post in a downward direction opposite the upward direction and extends laterally from the post in lateral directions orthogonal to the upward and downward directions, the adhesive is mounted on and extends above the base, is sandwiched between the base and the substrate and is non-solidified, the substrate is mounted on and extends above the adhesive, the first conductive layer extends above the dielectric layer, the dielectric layer extends above the second conductive layer, and a gap is located in the aperture between the post and the substrate;
thenflowing the adhesive into and upward in the gap; solidifying the adhesive;
thenproviding a pad and a terminal, including; grinding the post, the adhesive and the first conductive layer such that the post, the adhesive and the first conductive layer are laterally aligned with one another at a top lateral surface that faces in the upward direction; and
thenremoving selected portions of the first conductive layer;
thenmounting a semiconductor device on a heat spreader that includes the post and the base, wherein the semiconductor device overlaps the post, the substrate includes the pad, the terminal, a routing line and first and second vias, the pad and the terminal include selected portions of the first conductive layer, the routing line includes a selected portion of the second conductive layer and the vias each extend through the dielectric layer; electrically connecting the semiconductor device to the pad, thereby electrically connecting the semiconductor device to the terminal, wherein an electrically conductive path between the pad and the terminal includes the first via, the routing line and the second via; and thermally connecting the semiconductor device to the post, thereby thermally connecting the semiconductor device to the base. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A method of making a semiconductor chip assembly, comprising:
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providing a post and a base, wherein the post is adjacent to and integral with the base and extends above the base in an upward direction, and the base extends below the post in a downward direction opposite the upward direction and extends laterally from the post in lateral directions orthogonal to the upward and downward directions; providing an adhesive, wherein an opening extends through the adhesive; providing a substrate that includes first and second conductive layers, first and second vias and a dielectric layer, wherein the dielectric layer is between the conductive layers, a routing line includes a selected portion of the second conductive layer, the vias each extend through the dielectric layer between the first conductive layer and the routing line, and an aperture extends through the substrate; mounting the adhesive on the base, including inserting the post through the opening, wherein the adhesive extends above the base and the post extends through the opening; mounting the substrate on the adhesive, including inserting the post into the aperture, wherein the substrate extends above the adhesive, the first conductive layer extends above the dielectric layer, the dielectric layer extends above the second conductive layer, the post extends through the opening into the aperture, the adhesive is sandwiched between the base and the substrate and is non-solidified, and a gap is located in the aperture between the post and the substrate;
thenapplying heat to melt the adhesive; moving the base and the substrate towards one another, thereby moving the post upward in the aperture and applying pressure to the molten adhesive between the base and the substrate, wherein the pressure forces the molten adhesive to flow into and upward in the gap and the post and the molten adhesive extend above the dielectric layer; applying heat to solidify the molten adhesive, thereby mechanically attaching the post and the base to the substrate;
thengrinding the post, the adhesive and the first conductive layer such that the post, the adhesive and the first conductive layer are laterally aligned with one another at a top lateral surface that faces in the upward direction;
thenproviding a pad and a terminal that include selected portions of the first conductive layer, including removing selected portions of the first conductive layer; providing a cap on the post that extends above and is adjacent to and covers in the upward direction and extends laterally in the lateral directions from a top of the post and that overlaps and is adjacent to the adhesive;
thenmounting a semiconductor device on the cap, wherein a heat spreader includes the post, the base and the cap and the semiconductor device overlaps the post; electrically connecting the semiconductor device to the pad, thereby electrically connecting the semiconductor device to the terminal, wherein an electrically conductive path between the pad and the terminal includes in sequence the first via, the routing line and the second via; and thermally connecting the semiconductor device to the cap, thereby thermally connecting the semiconductor device to the base. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19, 20)
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21. A method of making a semiconductor chip assembly, comprising:
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providing a post and a base, wherein the post is adjacent to and integral with the base and extends above the base in an upward direction, and the base extends below the post in a downward direction opposite the upward direction and extends laterally from the post in a lateral plane orthogonal to the upward and downward directions; providing an adhesive, wherein an opening extends through the adhesive; providing a substrate that includes first and second conductive layers, first and second vias and a dielectric layer, wherein the dielectric layer is between the conductive layers, a routing line includes a selected portion of the second conductive layer, the vias each extend through the dielectric layer between the first conductive layer and the routing line, and an aperture extends through the substrate; mounting the adhesive on the base, including inserting the post through the opening, wherein the adhesive extends above the base and the post extends through the opening; mounting the substrate on the adhesive, including inserting the post into the aperture, wherein the substrate extends above the adhesive, the first conductive layer extends above the dielectric layer, the dielectric layer extends above the second conductive layer, the post extends through the opening into the aperture, the adhesive is sandwiched between the base and the substrate and is non-solidified, and a gap is located in the aperture between the post and the substrate;
thenapplying heat to melt the adhesive; moving the base and the substrate towards one another, thereby moving the post upward in the aperture and applying pressure to the molten adhesive between the base and the substrate, wherein the pressure forces the molten adhesive to flow into and upward in the gap and the post and the molten adhesive extend above the dielectric layer; applying heat to solidify the molten adhesive, thereby mechanically attaching the post and the base to the substrate;
thengrinding the adhesive without grinding the post;
thengrinding the post, the adhesive and the first conductive layer such that the post, the adhesive and the first conductive layer are laterally aligned with one another at a top lateral surface that faces in the upward direction;
thendepositing a third conductive layer on the post, the adhesive and the first conductive layer;
thenproviding a pad and a terminal that include selected portions of the first and third conductive layers, including removing selected portions of the first and third conductive layers; providing a cap on the post that includes a selected portion of the third conductive layer, including removing selected portions of the third conductive layer, wherein the cap extends above and is adjacent to and covers in the upward direction and extends laterally in the lateral directions from a top of the post;
thenmounting a semiconductor device on the cap, wherein a heat spreader includes the post, the base and the cap and the semiconductor device overlaps the post; electrically connecting the semiconductor device to the pad, thereby electrically connecting the semiconductor device to the terminal, wherein an electrically conductive path between the pad and the terminal includes in sequence the first via, the routing line and the second via; and thermally connecting the semiconductor device to the cap, thereby thermally connecting the semiconductor device to the base. - View Dependent Claims (22, 23, 24, 25)
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Specification