Manufacturing method for RFID tag

• US 8,062,926 B2
• Filed: 11/05/2008
• Issued: 11/22/2011
• Est. Priority Date: 11/07/2007
• Status: Expired due to Fees

• Current Assignee: Fujitsu Limited
• Original Assignee: Fujitsu Limited
• Inventors: Kobae, Kenji, Kobayashi, Hiroshi
• Primary Examiner(s): Bugg; George
• Assistant Examiner(s): Lai; Anne
• Application Number:
  US12/265,209
• Publication Number:
  US 20090115611A1
• Time in Patent Office: 1,112 Days
• Field of Search: 438/106, 438/108, 438/118, 438/119, 156/163, 156/165, 156/292, 156/295, 257/778, 340/572.1, 340/572.7, 340/572.8, 298/31, 298/32, 298/42, 298/43
• US Class Current: 438/108
• CPC Class Codes: G06K 19/07728 the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/0775 arrangements for connecting the integrated circuit to the antenna
• CPC Class Codes: H01L 21/56 Encapsulations, e.g. encapsulation layers, coatings
• CPC Class Codes: H01L 21/568 Temporary substrate used as encapsulation process aid H01L21/4832 and H01L21/566 take precedence
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/27013 for holding or confining the layer connector, e.g. solder flow barrier
• CPC Class Codes: H01L 2224/29012 in top view
• CPC Class Codes: H01L 2224/29034 the layer connector covering only portions of the surface to be connected
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/75 Apparatus for connecting with bump connectors or layer connectors
• CPC Class Codes: H01L 2224/75252 in the upper part of the bonding apparatus, e.g. in the bonding head
• CPC Class Codes: H01L 2224/81005 being a temporary or sacrificial substrate
• CPC Class Codes: H01L 2224/81191 wherein the bump connectors are disposed only on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/83051 Forming additional members, e.g. dam structures
• CPC Class Codes: H01L 2224/83192 wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/83194 Lateral distribution of the layer connectors
• CPC Class Codes: H01L 24/29 of an individual layer connector
• CPC Class Codes: H01L 24/32 : of an individual layer connector
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: Y10T 29/49149 : by metal fusion bonding

Abstract

An RFID tag manufacturing method is including application process in which a heat-curable adhesive is applied to an area where a circuit chip is placed on a base to which antennae are wired so as to be connected with the circuit chip, placement process in which the circuit chip is placed where the adhesive is applied, and thereby the circuit chip is connected with the antennae, covering process in which the circuit chip placed on the base is covered with a sheet member having an adhesive layer on its surface, such that the adhesive layer faces the base, and heat and pressure applying process in which pressure is applied to the sheet member toward the base, and heat and pressure are applied to the circuit chip from above the sheet member, thereby curing the adhesive and fixing the circuit chip and the sheet member on the base.

Claims

1. A manufacturing method for an RFID tag, comprising:

an application process in which a heat-curable adhesive is applied to an area where a circuit chip is placed on a base to which antennae are wired so as to be connected with the circuit chip to be placed;

a placement process in which the circuit chip is placed in the area where the adhesive is applied in the application process, and thereby the circuit chip is connected with the antennae;

a covering process in which the circuit chip placed on the base is covered with a sheet member having an adhesive layer on its surface, such that the adhesive layer faces the base; and

a heat and pressure applying process in which pressure is applied to the sheet member toward the base, and heat and pressure are applied to the circuit chip from above the sheet member, thereby curing the adhesive and fixing the circuit chip and the sheet member on the base;

wherein the application process is a process in which the adhesive is applied so that the quantity of adhesive is sufficient for the adhesive to be applied to a position equal to or exceeding a height of the circuit chip when the chip is placed on the base, and wherein the heat and pressure applying process is a process in which the heat and pressure are applied to the circuit chip and the sheet member by using a heat pressure head, the heat pressure head having a first surface corresponding to an area above the circuit chip, a second surface corresponding to an area outside of the circuit chip, extending and surrounding the first surface and higher than the first surface, and a third surface located inside the second surface and surrounding the first surface and lower than the first surface.

2. The manufacturing method according to claim 1, wherein the application process is a process in which the adhesive is applied over an area wider than an area of the circuit chip.

3. The manufacturing method according to claim 1, wherein the application process is a process in which the adhesive is applied so that the quantity of adhesive is sufficient for the adhesive to be applied to a position equal to or exceeding a height of the circuit chip when the chip is placed on the base.

4. The manufacturing method according to claim 1, wherein the covering process is a process in which for use as the sheet member, a sheet member made of PET film or paper is used.

5. The manufacturing method according to claim 1, wherein the heat and pressure applying process is a process in which pressure applied to an area above the circuit chip is higher than pressure applied to an area outside of the circuit chip.

6. The manufacturing method according to claim 1, wherein the heat and pressure applying process is a process in which an area above the circuit chip is heated at a temperature higher than an area outside of the circuit chip.

7. The manufacturing method according to claim 1, wherein the heat and pressure applying process is a process in which the heat and pressure are applied to the circuit chip and the sheet member by using a heat pressure head, the heat pressure head having a first surface corresponding to an area above the circuit chip and a second surface corresponding to an area outside of the circuit chip, extending and surrounding the first surface and higher than the first surface.

8. A manufacturing method for an RFID tag, comprising:

an application process in which a heat-curable adhesive is applied to an area where a circuit chip is placed on a base to which antennae are wired so as to be connected with the circuit chip to be placed;

a placement process in which the circuit chip is placed in the area where the adhesive is applied in the application process, and thereby the circuit chip is connected with the antennae;

a covering process in which the circuit chip placed on the base is covered with a sheet member having an adhesive layer on its surface, such that the adhesive layer faces the base; and

a heat and pressure applying process in which pressure is applied to the sheet member toward the base, and heat and pressure are applied to the circuit chip from above the sheet member, thereby curing the adhesive and fixing the circuit chip and the sheet member on the base, wherein the heat and pressure applying process is a process in which heat and pressure are applied to the circuit chip and the sheet member by using a heat and pressure head, the heat and pressure head having a first area corresponding to an area above the circuit chip and a second area surrounding the first area and disposed so as to allow the first area to be inserted or pulled.

9. The manufacturing method according to claim 8, wherein the application process is a process in which the adhesive is applied over an area wider than an area of the circuit chip.

10. The manufacturing method according to claim 8, wherein the application process is a process in which the adhesive is applied so that the quantity of adhesive is sufficient for the adhesive to be applied to a position equal to or exceeding a height of the circuit chip when the chip is placed on the base.

11. The manufacturing method according to claim 8, wherein the covering process is a process in which for use as the sheet member, a sheet member made of PET film or paper is used.

12. The manufacturing method according to claim 8, wherein the heat and pressure applying process is a process in which pressure applied to an area above the circuit chip is higher than pressure applied to an area outside of the circuit chip.

13. The manufacturing method according to claim 8, wherein the heat and pressure applying process is a process in which an area above the circuit chip is heated at a temperature higher than an area outside of the circuit chip.

14. The manufacturing method according to claim 8, wherein the heat and pressure applying process is a process in which the heat and pressure are applied to the circuit chip and the sheet member by using a heat pressure head, the heat pressure head having a first surface corresponding to an area above the circuit chip and a second surface corresponding to an area outside of the circuit chip, extending and surrounding the first surface and higher than the first surface.