Glass package that is hermetically sealed with a frit and method of fabrication

• US 8,063,560 B2
• Filed: 09/15/2006
• Issued: 11/22/2011
• Est. Priority Date: 04/16/2003
• Status: Active Grant

• Current Assignee: Corning Incorporated
• Original Assignee: Corning Incorporated
• Inventors: Schroeder, Joseph F. III, Aitken, Bruce G., Streltsov, Alexander, Morena, Robert, Miller, Richard J. II, Hagy, Henry E., Carberry, Joel P., DeMartino, Steven E., Widjaja, Sujanto, Lamberson, Lisa A.
• Primary Examiner(s): Williams; Joseph L
• Application Number:
  US11/521,888
• Publication Number:
  US 20070007894A1
• Time in Patent Office: 1,894 Days
• Field of Search: 313/512, 313504-506, 501/15, 501/17, 501/20, 445 23- 25
• US Class Current: 313/512
• CPC Class Codes: C03C 27/005 with compositions containing more than 50% lead oxide by weight
• CPC Class Codes: C03C 27/06 Joining glass to glass by processes other than fusing fusing C03B23/20; units for use as elements for closing wall or like openings and comprising two or more parallel glass panes in spaced relationship, the panes being permanently secured together E06B3/66
• CPC Class Codes: C03C 3/072 containing boron
• CPC Class Codes: C03C 3/17 containing aluminium or beryllium
• CPC Class Codes: C03C 3/19 containing boron
• CPC Class Codes: C03C 3/21 containing titanium, zirconium, vanadium, tungsten or molybdenum
• CPC Class Codes: C03C 8/24 Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
• CPC Class Codes: C03C 8/245 containing more than 50% lead oxide, by weight
• CPC Class Codes: H10K 50/8426 Peripheral sealing arrangements, e.g. adhesives, sealants
• CPC Class Codes: H10K 59/8722 Peripheral sealing arrangements, e.g. adhesives, sealants

Abstract

A hermetically sealed glass package and method for manufacturing the hermetically sealed glass package are described herein using an OLED display as an example. Basically, the hermetically sealed OLED display is manufactured by providing a first substrate plate and a second substrate plate and depositing a frit onto the second substrate plate. OLEDs are deposited on the first substrate plate. An irradiation source (e.g., laser, infrared light) is then used to heat the frit which melts and forms a hermetic seal that connects the first substrate plate to the second substrate plate and also protects the OLEDs. The frit is glass that was doped with at least one transition metal and possibly a CTE lowering filler such that when the irradiation source heats the frit, it softens and forms a bond. This enables the frit to melt and form the hermetic seal while avoiding thermal damage to the OLEDs.

Claims

1. A frit comprising a non-lead based glass doped with at least one transition metal, and a coefficient of thermal expansion (CTE) lowering filler.

2. The fit according to claim 1 wherein the CTE lowering filler is an additive filler.

3. The frit according to claim 1 wherein the CTE lowering filler is an inversion filler.

4. The frit according to claim 1 wherein the at least one transition metal is selected from the group consisting of iron, copper, vanadium and neodymium.

5. The frit according to claim 2 wherein the CTE lowering filler is a lithium alumino-silicate.

6. The frit according to claim 3 wherein the CTE lowering filler is Co—

Mg pyrophosphate.

7. The fit according to claim 1 wherein the non-lead based glass is selected from the group of glasses consisting of a titano-vanadium glass, an iron-vanadium glass, a zinc-vanadium glass, a Sn—

Zn-phosphate glass, a mixed alkali zinc-phosphate glass, and a vanadium-phosphate glass.

8. The fit according to claim 1 wherein the frit comprises a coefficient of thermal expansion of about 36.3×

10<sup>−

7</sup>/°

C. between room temperature and 250°

C.

9. The frit according to claim 1 wherein the frit has a glass transition temperature T_g less than 325°

C. and a CTE less than about 130×

10<sup>−

7</sup>/°

C. between room temperature and 250°

C.

10. The frit according to claim 1 wherein the frit has a substantially zero percent transmittance in the wavelength range between about 800 nm and about 1500 nm.

11. The fit according to claim 1 wherein the non-lead-based glass comprises:

K₂O (0-10 mole %)

Fe₂O₃ (0-20 mole %)

Sb₂O₃ (0-40 mole %)

P₂O₅ (20-40 mole %)

V₂O₅ (30-60 mole %)

TiO₂ (0-20 mole %)

Al₂O₃ (0-5 mole %)

B₂O₃ (0-5 mole %)

WO₃ (0-5 mole %)

Bi₂O₃ (0-5 mole %).

12. The fit according to claim 1 wherein the non-lead-based glass comprises:

K₂O (0-10 mole %)

Fe₂O₃ (0-20 mole %)

Sb₂O₃ (0-20 mole %)

ZnO (0-20 mole %)

P₂O₅ (20-40 mole %)

V₂O₅ (30-60 mole %)

TiO₂ (0-20 mole %)

Al₂O₃ (0-5 mole %)

B₂O₃ (0-5 mole %)

WO₃ (0-5 mole %)

Bi₂O₃ (0-5 mole %).

13. The fit according to claim 1 wherein the non-lead-based glass consists essentially of:

Sb₂O₃ (7.4 mole %)

ZnO (17.6 mole %)

P₂O₅ (16.5 mole %)

V₂O₅ (46.6 mole %)

TiO₂ (1.0 mole %)

Al₂O₃ (1.0 mole %).

14. The fit according to claim 1 which, when disposed between first and second glass substrates and irradiated through one or more of the substrates by an irradiation source having a wavelength between about 800 nm and 2000 nm, absorbs more light from the irradiation source when compared to light absorbed by the substrates.

15. The fit according to claim 14 wherein the fit is melted and forms a hermetic seal between the first and second substrates.

16. A frit comprising a coefficient of thermal expansion (CTE) lowering filler and a glass comprising:

K₂O (0-10 mole %)

Fe₂O₃ (0-20 mole %)

Sb₂O₃ (0-40 mole %)

P₂O₅ (20-40 mole %)

V₂O₅ (30-60 mole %)

TiO₂ (0-20 mole %)

Al₂O₃ (0-5 mole %)

B₂O₃ (0-5 mole %)

WO₃ (0-5 mole %)

Bi₂O₃ (0-5 mole %).

17. The fit according to claim 16 wherein the CTE lowering filler is an additive filler.

18. The fit according to claim 16 wherein the CTE lowering filler is an inversion filler.

19. The fit according to claim 16 wherein the filler is a lithium alumino-silicate.

20. The fit according to claim 16 wherein the filler is Co—

Mg pyrophosphate.

21. The frit according to claim 16 wherein the CTE of the fit is less than about 130×

10<sup>−

7</sup>/°

C. between room temperature and 250°

C.

22. The frit according to claim 16 wherein a glass transition temperature T_g of the fit is less than about 325°

C.

29. The frit according to claim 21 wherein a glass transition temperature T_g of the frit is less than about 325°

C.

23. A frit comprising a coefficient of thermal expansion (CTE) lowering filler and a glass comprising:

K₂O (0-10 mole %)

Fe₂O₃ (0-20 mole %)

Sb₂O₃ (0-20 mole %)

ZnO (0-20 mole %)

P₂O₅ (20-40 mole %)

V₂O₅ (30-60 mole %)

TiO₂ (0-20 mole %)

Al₂O₃ (0-5 mole %)

B₂O₃ (0-5 mole %)

WO₃ (0-5 mole %)

Bi₂O₃ (0-5 mole %).

24. The fit according to claim 23 wherein the CTE lowering filler is an additive filler.

25. The fit according to claim 23 wherein the CTE lowering filler is an inversion filler.

26. The frit according to claim 23 wherein the filler is a lithium alumino-silicate.

27. The fit according to claim 23 wherein the filler is Co—

Mg pyrophosphate.

28. The frit according to claim 23 wherein the CTE of the frit is less than about 130×

10<sup>−

7</sup>/°

C. between room temperature and 250°

C.

30. A frit comprising a coefficient of thermal expansion (CTE) lowering filler and a glass consisting essentially of:

Sb₂O₃ (7.4 mole %)

ZnO (17.6 mole %)

P₂O₅ (16.5 mole %)

V₂O₅ (46.6 mole %)

TiO₂ (1.0 mole %)

Al₂O₃ (1.0 mole %).

31. The fit according to claim 30 wherein a ratio of glass to filler is 75%:

25%.

32. A fit comprising a coefficient of thermal expansion (CTE) lowering filler and a glass comprising at least one transition metal selected from the group of glasses consisting of a titano-vanadium glass, an iron-vanadium glass, a zinc-vanadium glass, a Sn—

Zn-phosphate glass, a mixed alkali zinc-phosphate glass, a vanadium-phosphate glass, a Pb-borate glass, and a mixed alkali zinc-phosphate glass with vanadium and lead, and wherein the frit has a coefficient of thermal expansion (CTE) less than about 140×

10<sup>−

7</sup>/°

C. between about room temperature and 250°

C., and a glass transition temperature T_g less than about 350°

C.

33. The frit according to claim 32 wherein the CTE lowering filler is an additive filler.

34. The fit according to claim 32 wherein the CTE lowering filler is an inversion filler.

35. The fit according to claim 32 wherein the CTE lowering filler is a lithium alumino-silicate.

36. The fit according to claim 32 wherein the CTE lowering filler is Co—

Mg pyrophosphate.

37. The fit according to claim 32 wherein the glass comprises:

K₂O (0-10 mole %)

Fe₂O₃ (0-20 mole %)

Sb₂O₃ (0-40 mole %)

P₂O₅ (20-40 mole %)

V₂O₅ (30-60 mole %)

TiO₂ (0-20 mole %)

Al₂O₃ (0-5 mole %)

B₂O₃ (0-5 mole %)

WO₃ (0-5 mole %)

Bi₂O₃ (0-5 mole %).

38. The frit according to claim 37 wherein the ratio of glass to filler is 70%:

30%.

39. The fit according to claim 32 wherein the glass comprises:

K₂O (0-10 mole %)

Fe₂O₃ (0-20 mole %)

Sb₂O₃ (0-20 mole %)

ZnO (0-20 mole %)

P₂O₅ (20-40 mole %)

V₂O₅ (30-60 mole %)

TiO₂ (0-20 mole %)

Al₂O₃ (0-5 mole %)

B₂O₃ (0-5 mole %)

WO₃ (0-5 mole %)

Bi₂O₃ (0-5 mole %).

40. The frit according to claim 32 which, when disposed between first and second glass substrates and irradiated through one or more of the substrates by an irradiation source having a wavelength between about 800 nm and 2000 nm, melts and forms a hermetic seal between the substrates.

41. The frit according to claim 32 wherein the frit is free of cadmium.