System and method for creating a focus-exposure model of a lithography process

• US 8,065,636 B2
• Filed: 05/18/2010
• Issued: 11/22/2011
• Est. Priority Date: 08/08/2005
• Status: Active Grant

• Current Assignee: ASML Netherlands BV (ASML Holding NV)
• Original Assignee: ASML Netherlands BV (ASML Holding NV)
• Inventors: Ye, Jun, Chen, Luoqi, Cao, Yu, Liu, Hua-Yu
• Primary Examiner(s): Levin; Naum
• Application Number:
  US12/782,666
• Publication Number:
  US 20100229147A1
• Time in Patent Office: 553 Days
• Field of Search: 716/50, 430/5
• US Class Current: 716/50
• CPC Class Codes: G03F 7/705 Modelling or simulating from physical phenomena up to complete wafer processes or whole workflow in wafer productions
• CPC Class Codes: G03F 7/70516 Calibration of components of the microlithographic apparatus, e.g. light sources, addressable masks or detectors
• CPC Class Codes: G03F 7/70625 Dimensions, e.g. line width, critical dimension [CD], profile, sidewall angle or edge roughness
• CPC Class Codes: G03F 7/70641 Focus

Abstract

A system and a method for creating a focus-exposure model of a lithography process are disclosed. The system and the method utilize calibration data along multiple dimensions of parameter variations, in particular within an exposure-defocus process window space. The system and the method provide a unified set of model parameter values that result in better accuracy and robustness of simulations at nominal process conditions, as well as the ability to predict lithographic performance at any point continuously throughout a complete process window area without a need for recalibration at different settings. With a smaller number of measurements required than the prior-art multiple-model calibration, the focus-exposure model provides more predictive and more robust model parameter values that can be used at any location in the process window.

Claims

1. A computer-implemented method for creating a model of a lithography process, comprising:

defining a set of model parameters and a set of fitting parameters having variable values for the model, the set of model parameters defining a process window for the lithography process in a parameter space;

selecting a set of initial values for the set of fitting parameters;

selecting a plurality of sampling locations within the process window, the plurality of sampling locations being a subset of all possible process conditions within the process window;

generating, using the computer, simulated results of the lithography process at each of the plurality of sampling locations within the process window using the model with the set of initial values by simulating the lithography process with varying values of the model parameters corresponding to the plurality of sampling locations within the process window while holding constant the initial values;

comparing, using the computer, the simulated results with actual results of the lithography process at the plurality of sampling locations within the process window to produce a total difference measure between the simulated results and the actual results at the plurality of sampling locations;

modifying, using the computer, the set of fitting parameter values and generating additional simulated results at each of the plurality of sampling locations within the process window to identify optimum fitting parameter values such that the total difference measure between the actual results and simulated results produced using the optimum fitting parameter values is below a predetermined threshold; and

finalizing the model by including the optimum fitting parameter values in the model, the finalized model being capable of simulating the lithography process at any location within the entire process window.

2. The method of claim 1, wherein the model is used to simulate the lithography process at a single location within the process window.

3. The method of claim 1, wherein the model is used to simulate the lithography process at a location within the process window that is not one of the plurality of sampling locations by applying parameter values corresponding to the location within the process window to the model in accordance with first principles without changing the optimum fitting parameter values.

4. The method of claim 1, wherein the set of model parameters further includes one or more first principle parameters.

5. The method of claim 4, wherein the one or more first principle parameters includes one or more of illumination source, numerical aperture, and optical aberrations.

6. The method of claim 1, further comprising including a resist model module in the model of the lithography process.

7. The method of claim 1, further comprising including a mask model module in the model of the lithography process.

8. The method of claim 1, wherein the plurality of sampling locations include sampling locations at nominal exposure and a corresponding plurality of varying values of focus.

9. The method of claim 1, further comprising:

selecting a set of test patterns for a test mask, wherein the set of test patterns covers a full range of proximity interactions that are characteristic of the lithography process;

printing the set of test patterns on a wafer to form a set of test structures; and

using the set of test structures to produce the actual results.

10. The method of claim 1, wherein the simulated results and the actual results are critical dimension measurements.

11. The method of claim 1, wherein the total difference measure is a root mean square difference.

12. The method of claim 1, wherein the model parameters comprise focus and exposure, and wherein the model comprises a focus-exposure model.

13. The method of claim 1, wherein the model parameters include one or both of an optical parameter and a resist parameter.

14. A non-transitory computer-readable medium storing instructions for causing a computer to create a model of a lithography process by performing:

storing a set of model parameters and a set of fitting parameters having variable values for the model, the set of model parameters defining a process window for the lithography process in a parameter space;

storing a set of initial values for the set of fitting parameters;

storing a plurality of sampling locations within the process window, the plurality of sampling locations being a subset of all possible process conditions within the process window;

generating simulated results of the lithography process at each of the plurality of sampling locations using the model with the set of initial values by simulating the lithography process with varying values of the model parameters corresponding to the plurality of sampling locations while holding the initial values constant;

comparing the simulated results with actual results of the lithography process at the plurality of sampling locations to produce a total difference measure between the simulated results and the actual results at the plurality of sampling locations;

modifying the set of fitting parameter values and generating additional simulated results at each of the plurality of sampling locations such that the total difference measure between the actual results produced using the optimum fitting parameter values is below a predetermined threshold; and

finalizing the model by including the optimum fitting parameter values in the model, the finalized model being capable of simulating the lithography process at any location within the process window.

15. The non-transitory computer-readable medium of claim 14, wherein the model is used to simulate the lithography process at a single location within the process window.

16. The non-transitory computer-readable medium of claim 14, wherein the model is used to simulate the lithography process at a location within the process window that is not one of the plurality of sampling locations by applying parameter values corresponding to the location within the process window to the model in accordance with first principles without changing the optimum fitting parameter values.

17. The non-transitory computer-readable medium of claim 14, wherein the set of model parameters further includes one or more first principle parameters.

18. The non-transitory computer-readable medium of claim 17, wherein the one or more first principle parameters includes one or more of illumination source, numerical aperture, and optical aberrations.

19. The non-transitory computer-readable medium of claim 14, wherein the instructions further cause the computer to include a resist model module in the model of the lithography process.

20. The non-transitory computer-readable medium of claim 14, wherein the instructions further cause the computer to include a mask model module in the model of the lithography process.

21. The non-transitory computer-readable medium of claim 14, wherein the plurality of sampling locations includes sampling locations at nominal exposure and a corresponding plurality of varying values of focus.

22. The non-transitory computer-readable medium of claim 14, wherein the total difference measure is a root mean square difference.

23. The non-transitory computer-readable medium of claim 14, wherein the model parameters comprise focus and exposure, and wherein the model comprises a focus-exposure model.

24. The non-transitory computer-readable medium of claim 14, wherein the model parameters include one or both of an optical parameter and a resist parameter.