Method for packaging circuits
First Claim
1. A method, comprising:
- curing adhesive to fix a first substrate to a second substrate, and to align first saw streets separating a plurality of first dice on the first substrate with second saw streets separating a plurality of second dice on the second substrate;
forming a plurality of through apertures in the aligned first and second saw streets;
forming electrical connections from the first dice on the first substrate to the second dice on the second substrate, wherein forming the electrical connections includes filling at least some of the plurality of through apertures with a conductive material; and
singulating aligned first and second dice from a remainder of the fixed first and second substrates, the electrical connections being substantially flush with smooth sides of the singulated aligned first and second dice.
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Accused Products
Abstract
A method for packaging integrated circuit chips (die) is described that includes providing a base substrate with package level contacts, coating a base substrate with adhesive, placing dies on the adhesive, electrically connecting the die to the package level contacts, and removing the backside of the base substrate to expose the backside of the package level contacts. Accordingly, an essentially true chip scale package is formed. Multi-chip modules are formed by filling gaps between the chips with an encapsulant. In an embodiment, chips are interconnected by electrical connections between package level contacts in the base substrate. In an embodiment, substrates each having chips are adhered back-to-back with through vias formed in aligned saw streets to interconnect the back-to-back chip assembly.
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Citations
18 Claims
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1. A method, comprising:
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curing adhesive to fix a first substrate to a second substrate, and to align first saw streets separating a plurality of first dice on the first substrate with second saw streets separating a plurality of second dice on the second substrate; forming a plurality of through apertures in the aligned first and second saw streets; forming electrical connections from the first dice on the first substrate to the second dice on the second substrate, wherein forming the electrical connections includes filling at least some of the plurality of through apertures with a conductive material; and singulating aligned first and second dice from a remainder of the fixed first and second substrates, the electrical connections being substantially flush with smooth sides of the singulated aligned first and second dice. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A method, comprising:
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curing adhesive to fix a first substrate to a second substrate, and to align first saw streets separating a plurality of first dice of a first active device surface of the first substrate with second saw streets separating a plurality of second dice of a second active device surface of the second substrate, the first and second active device surfaces forming exterior surfaces; forming a plurality of through apertures in the aligned first and second saw streets; forming electrical connections from the first dice on the first substrate to the second dice on the second substrate, wherein forming the electrical connections includes filling at least some of the plurality of through apertures with a conductive material; and singulating aligned first and second dice from a remainder of the fixed first and second substrates, wherein the singulated aligned first and second dice include smooth sides including the electrical connections being substantially flush with the sides of the singulated aligned first and second dice. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18)
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Specification