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Conductive metal ball bonding with electrostatic discharge detection

  • US 8,066,171 B1
  • Filed: 01/24/2011
  • Issued: 11/29/2011
  • Est. Priority Date: 06/28/2007
  • Status: Expired due to Fees
First Claim
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1. An apparatus for bonding a conductive lead to a conductive terminal of a device by the use of a conductive metal ball, the apparatus comprising:

  • a ball-forming wire comprising a first conductive metal having a first melting temperature;

    a clamping surface having a closed position in contact with the ball-forming wire;

    a wire-clamping actuator coupled to the clamping surface and electrically connected to a clamping signal source;

    a sparking pin comprising a second conductive metal having a second melting temperature higher than the first melting temperature, the sparking pin being electrically connected to a power source;

    a current detection transformer including a magnetic core at least partially encircling the ball-forming wire; and

    an analyzing circuit electrically connected to the current detection transformer, the analyzing circuit including an analog integrated circuit to broaden peaks in an output signal from the current detection transformer.

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