Electrical device and method of manufacturing electrical devices using film embossing techniques to embed integrated circuits into film

• US 8,067,253 B2
• Filed: 12/21/2005
• Issued: 11/29/2011
• Est. Priority Date: 12/21/2005
• Status: Expired due to Fees

• Current Assignee: Avery Dennison Corporation
• Original Assignee: Avery Dennison Corporation
• Inventors: Ferguson, Scott Wayne, Mehrabi, Ali, Mehrabi, Reza
• Primary Examiner(s): ZARNEKE, DAVID A
• Application Number:
  US11/314,988
• Publication Number:
  US 20070141760A1
• Time in Patent Office: 2,169 Days
• Field of Search: 438/26, 438/64
• US Class Current: 438/26
• CPC Class Codes: B29C 2035/0822 using IR radiation
• CPC Class Codes: B29C 2035/0827 using UV radiation
• CPC Class Codes: B29C 2035/0855 using microwave
• CPC Class Codes: B29C 2043/3615 Forming elements, e.g. mandrels or rams or stampers or pistons or plungers or punching devices
• CPC Class Codes: B29C 35/0888 using transparant moulds
• CPC Class Codes: B29C 43/18 incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles B29C43/206 takes precedence
• CPC Class Codes: B32B 2519/02 RFID tags
• CPC Class Codes: G06K 19/07745 Mounting details of integrated circuit chips
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/07752 using an interposer
• CPC Class Codes: H01L 21/50 Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device antennas per se H01Q
• CPC Class Codes: H01L 2224/04105 Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
• CPC Class Codes: H01L 2224/20 Structure, shape, material or disposition of high density interconnect preforms
• CPC Class Codes: H01L 2224/82 by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 23/5389 the chips being integrally enclosed by the interconnect and support structures
• CPC Class Codes: H01L 24/19 Manufacturing methods of high density interconnect preforms
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01019 : Potassium [K]
• CPC Class Codes: H01L 2924/01027 : Cobalt [Co]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01059 : Praseodymium [Pr]
• CPC Class Codes: H01L 2924/01065 : Terbium [Tb]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/07802 : not being an ohmic electrical conductor
• CPC Class Codes: H01L 2924/07811 : Extrinsic, i.e. with electrical conductive fillers
• CPC Class Codes: H01L 2924/12041 : LED
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19042 : being an inductor
• CPC Class Codes: H01L 2924/19043 : being a resistor

Abstract

An electrical device and method of making same is provided wherein a chip or other electrical component is embedded in a substrate. The substrate may be a thermoplastic material capable of deforming around the chip and at least partially encasing the chip when heat and/or pressure is applied to the substrate. Electromagnetic radiation such a near infrared radiation can be used to heat the substrate. The substrate may include a compressible layer that can be compressed and/or crushed to form a recess into which the chip can be inserted. Once embedded, the chip or electrical component is secured by the substrate and may be coupled to another electrical component. A method of making an RFID transponder is also provided wherein an RFID chip is embedded in a substrate using heat and/or pressure, an antenna structure is applied to the substrate, and the RFID chip and antenna structure are coupled together.

Claims

1. A method of making an RFID device comprising:

providing a substrate web having antenna structures;

placing a chip having an upper surface on top of a the substrate;

softening a region of the substrate by applying heat to the substrate;

deforming said region of the substrate;

embedding the chip into the substrate while the substrate is at an elevated temperature such that the upper surface of the chip is substantially level with the substrate;

cooling the substrate to partially encase the chip within the substrate; and

coupling the upper surface of the chip to one of the antenna structures on the substrate to form a RFID inlay having substantially planar upper and lower surfaces.

2. A method as set forth in claim 1, wherein the placing a chip on a substrate includes placing a chip that is part of an RFID interposer that includes interposer leads mounted to the chip.

3. A method as set forth in claim 1, wherein the placing a chip on the substrate includes placing the chip on the substrate that is a thermoplastic material.

4. A method as set forth in claim 1, wherein the applying heat to the substrate includes applying electromagnetic radiation to at least one of the chip and the substrate.

5. A method as set forth in claim 4, wherein the applying electromagnetic radiation includes applying thermal radiation.

6. A method as set forth in claim 1, wherein the embedding includes pressing the chip into the substrate with rollers.

7. A method as set forth in claim 1, wherein the coupling includes printing a conductive material onto the substrate.

8. A method as set forth in claim 1, wherein the chip and substrate have a uniform profile.

9. A method as set forth in claim 8, wherein the chip is provided with bumps that extend upwardly from the uniform profile.

10. A method as set forth in claim 9, wherein the bumps are connected to the antenna.