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Coaxial through chip connection

  • US 8,067,312 B2
  • Filed: 04/16/2010
  • Issued: 11/29/2011
  • Est. Priority Date: 06/14/2005
  • Status: Active Grant
First Claim
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1. A method comprising:

  • etching a substrate to form an annulus trench;

    introducing a first electrically-conductive material into the annulus trench;

    etching a via trench into the substrate in an area surrounded by the annulus trench;

    introducing a second electrically-conductive material into the via trench, wherein the second electrically-conductive material is electrically isolated from the first electrically-conductive material; and

    thinning the substrate to expose the first and second electrically-conductive materials.

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