Flexible printed circuit board for light emitting diode backlight unit and method of fabricating the same
First Claim
1. A flexible printed circuit board (PCB) for a light emitting diode backlight unit, comprising:
- a flexible base film;
a plurality of metal lines on a first surface of the flexible base film;
a cover layer on the metal lines and covering a center portion of the first surface of the flexible base film;
a first gold-plating pattern on the metal lines and at both ends of the first surface of the flexible base film;
a metal pattern on a second surface of the flexible base film and including a first sub-pattern at one end of the second surface, a second sub-pattern at the other end of the second surface and a plurality of third-sub patterns between the first and second sub-patterns of the metal pattern; and
a second gold-plating pattern on the metal pattern and including a fourth sub-pattern on the first sub-pattern, a fifth sub-pattern on the second sub-pattern, and a plurality of sixth-sub patterns each on the third sub-patterns,wherein a first groove between a first double-layered pattern of the first sub-pattern and the fourth sub-pattern and a second double-layered pattern of the third sub-pattern and the sixth sub-pattern, a second groove between a third double-layered pattern of the second sub-pattern and the fifth sub-pattern and a second double-layered pattern of the third sub-pattern and the sixth sub-pattern, and a third groove between adjacent second double-layered patterns respectively expose a portion of the second surface of the flexible base film.
1 Assignment
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Accused Products
Abstract
A flexible printed circuit board (PCB) for a light emitting diode backlight unit includes a flexible base film; a plurality of metal lines on a first surface of the flexible base film; a cover layer on the metal lines and covering a center portion of the first surface of the flexible base film; a first gold-plating pattern on the metal lines and at both ends of the first surface of the flexible base film; a metal pattern on a second surface of the flexible base film and including a first sub-pattern at one end of the second surface, a second sub-pattern at the other end of the second surface and a plurality of third-sub patterns between the first and second sub-patterns of the metal pattern; and a second gold-plating pattern on the metal pattern and including a fourth sub-pattern on the first sub-pattern, a fifth sub-pattern on the second sub-pattern, and a plurality of sixth-sub patterns each on the third sub-patterns, wherein a first groove between a first double-layered pattern of the first sub-pattern and the fourth sub-pattern and a second double-layered pattern of the third sub-pattern and the sixth sub-pattern, a second groove between a third double-layered pattern of the second sub-pattern and the fifth sub-pattern and a second double-layered pattern of the third sub-pattern and the sixth sub-pattern, and a third groove between adjacent second double-layered patterns respectively expose a portion of the second surface of the flexible base film.
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Citations
15 Claims
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1. A flexible printed circuit board (PCB) for a light emitting diode backlight unit, comprising:
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a flexible base film; a plurality of metal lines on a first surface of the flexible base film; a cover layer on the metal lines and covering a center portion of the first surface of the flexible base film; a first gold-plating pattern on the metal lines and at both ends of the first surface of the flexible base film; a metal pattern on a second surface of the flexible base film and including a first sub-pattern at one end of the second surface, a second sub-pattern at the other end of the second surface and a plurality of third-sub patterns between the first and second sub-patterns of the metal pattern; and a second gold-plating pattern on the metal pattern and including a fourth sub-pattern on the first sub-pattern, a fifth sub-pattern on the second sub-pattern, and a plurality of sixth-sub patterns each on the third sub-patterns, wherein a first groove between a first double-layered pattern of the first sub-pattern and the fourth sub-pattern and a second double-layered pattern of the third sub-pattern and the sixth sub-pattern, a second groove between a third double-layered pattern of the second sub-pattern and the fifth sub-pattern and a second double-layered pattern of the third sub-pattern and the sixth sub-pattern, and a third groove between adjacent second double-layered patterns respectively expose a portion of the second surface of the flexible base film. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method of fabricating a flexible PCB for a light emitting diode backlight unit, comprising:
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etching a first metal layer on a first surface of a flexible base film to form a plurality of metal lines and a second metal layer on a second surface of the flexible base film to form a metal pattern including a first sub-pattern at one end of the second surface, a second sub-pattern at the other end of the second surface and a plurality of third-sub patterns between the first and second sub-patterns of the metal pattern; forming a cover layer by forming and pattering a cover material layer on the metal lines, the cover layer covering a center of the first surface of the flexible base film; forming a first gold-plating pattern on the metal lines and at both ends of the first surface of the flexible base film; and forming a second gold-plating pattern including a fourth sub-pattern on the first sub-pattern, a fifth sub-pattern on the second sub-pattern, and a plurality of sixth-sub patterns each on the third sub-patterns, wherein a first groove between a first double-layered pattern of the first sub-pattern and the fourth sub-pattern and a second double-layered pattern of the third sub-pattern and the sixth sub-pattern, a second groove between a third double-layered pattern of the second sub-pattern and the fifth sub-pattern and a second double-layered pattern of the third sub-pattern and the sixth sub-pattern, and a third groove between adjacent second double-layered patterns respectively expose a portion of the second surface of the flexible base film. - View Dependent Claims (9, 10, 11, 12, 13, 14)
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15. A backlight unit for a liquid crystal display module, comprising:
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a reflective sheet; a light guide plate on the reflective sheet; at least one light emitting diode at a side of the light guide plate and on a printed circuit board; a flexible printed circuit board including; a flexible base film; a plurality of metal lines on a first surface of the flexible base film; a cover layer on the metal lines and covering a center portion of the first surface of the flexible base film; a first gold-plating pattern on the metal lines and at both ends of the first surface of the flexible base film; a metal pattern on a second surface of the flexible base film and including a first sub-pattern at one end of the second surface, a second sub-pattern at the other end of the second surface and a plurality of third-sub patterns between the first and second sub-patterns of the metal pattern; and a second gold-plating pattern on the metal pattern and including a fourth sub-pattern on the first sub-pattern, a fifth sub-pattern on the second sub-pattern, and a plurality of sixth-sub patterns each on the third sub-patterns; and a plurality of optical sheets over the light guide plate, wherein a first groove between a first double-layered pattern of the first sub-pattern and the fourth sub-pattern and a second double-layered pattern of the third sub-pattern and the sixth sub-pattern, a second groove between a third double-layered pattern of the second sub-pattern and the fifth sub-pattern and a second double-layered pattern of the third sub-pattern and the sixth sub-pattern, and a third groove between adjacent second double-layered patterns respectively expose a portion of the second surface of the flexible base film, and wherein an end of the flexible printed circuit board connected to the printed circuit board.
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Specification