Wafer level package structure, and sensor device obtained from the same package structure
First Claim
1. A wafer level package structure comprising:
- a semiconductor wafer having a plurality of sensor units, each of which comprises a frame having an opening, a movable portion held in said opening to be movable relative to said frame, and a detecting portion configured to output an electric signal according to a positional displacement of said movable portion;
a first package wafer bonded to one of opposite surfaces of said semiconductor wafer; and
a second package wafer bonded to the other surface of said semiconductor wafer;
wherein said frame of each of said sensor units has a first surface-activated region formed on a surface facing the first package wafer over an entire circumference thereof so as to surround said movable portion, and a second surface-activated region formed on a surface facing the second package wafer over an entire circumference thereof so as to surround said movable portion,the bonding between said semiconductor wafer and the first package wafer is a solid-phase direct bonding without diffusion between said first surface-activated region and a surface-activated region formed on the first package wafer, andthe bonding between said semiconductor wafer and the second package wafer is a solid-phase direct bonding without diffusion between said second surface-activated region and a surface-activated region formed on the second package wafer,wherein at least one of said first surface-activated region and said second surface-activated region comprises a ring-like outer surface-activated region formed over the entire circumference of said frame so as to surround said movable portion, and a ring-like inner surface-activated region formed at an inner side of said outer surface-activated region over the entire circumference of said frame so as to surround said movable portion, andwherein said wafer level package structure further comprises an auxiliary sealing portion for connecting between said outer surface-activated region and said inner surface-activated region, and wherein said auxiliary sealing portion is formed at plural locations spaced from each other by a predetermined distance in the circumferential direction of said frame.
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Accused Products
Abstract
A wafer level package structure with a plurality of compact sensors such as acceleration sensors and gyro sensors is provided. This package structure is composed of a semiconductor wafer with plural sensor units, and a pair of package wafers bonded to both surfaces of the semiconductor wafer. Each of the sensor units has a frame having an opening, a movable portion held in the opening to be movable relative to the frame, and a detecting portion for outputting an electric signal according to a positional displacement of the movable portion. Since the semiconductor wafer is bonded to each of the package wafers by a solid-phase direct bonding without diffusion between a surface-activated region formed on the frame and a surface-activated region formed on the package wafer, it is possible to prevent that variations in sensor characteristics occur due to residual stress at the bonding interface.
46 Citations
22 Claims
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1. A wafer level package structure comprising:
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a semiconductor wafer having a plurality of sensor units, each of which comprises a frame having an opening, a movable portion held in said opening to be movable relative to said frame, and a detecting portion configured to output an electric signal according to a positional displacement of said movable portion; a first package wafer bonded to one of opposite surfaces of said semiconductor wafer; and a second package wafer bonded to the other surface of said semiconductor wafer; wherein said frame of each of said sensor units has a first surface-activated region formed on a surface facing the first package wafer over an entire circumference thereof so as to surround said movable portion, and a second surface-activated region formed on a surface facing the second package wafer over an entire circumference thereof so as to surround said movable portion, the bonding between said semiconductor wafer and the first package wafer is a solid-phase direct bonding without diffusion between said first surface-activated region and a surface-activated region formed on the first package wafer, and the bonding between said semiconductor wafer and the second package wafer is a solid-phase direct bonding without diffusion between said second surface-activated region and a surface-activated region formed on the second package wafer, wherein at least one of said first surface-activated region and said second surface-activated region comprises a ring-like outer surface-activated region formed over the entire circumference of said frame so as to surround said movable portion, and a ring-like inner surface-activated region formed at an inner side of said outer surface-activated region over the entire circumference of said frame so as to surround said movable portion, and wherein said wafer level package structure further comprises an auxiliary sealing portion for connecting between said outer surface-activated region and said inner surface-activated region, and wherein said auxiliary sealing portion is formed at plural locations spaced from each other by a predetermined distance in the circumferential direction of said frame. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A wafer level package structure comprising:
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a semiconductor wafer having a plurality of sensor units, each of which comprises a frame having an opening, a movable portion held in said opening to be movable relative to said frame, and a detecting portion configured to output an electric signal according to a positional displacement of said movable portion; a first package wafer bonded to one of opposite surfaces of said semiconductor wafer; and a second package wafer bonded to the other surface of said semiconductor wafer; wherein said frame of each of said sensor units has a first surface-activated region formed on a surface facing the first package wafer over an entire circumference thereof so as to surround said movable portion, and a second surface-activated region formed on a surface facing the second package wafer over an entire circumference thereof so as to surround said movable portion, the bonding between said semiconductor wafer and the first package wafer is a solid-phase direct bonding without diffusion between said first surface-activated region and a surface-activated region formed on the first package wafer, and the bonding between said semiconductor wafer and the second package wafer is a solid-phase direct bonding without diffusion between said second surface-activated region and a surface-activated region formed on the second package wafer, and wherein each of said sensor units has an integrated circuit operable in collaboration with said detecting portion, and said integrated circuit is disposed adjacent to said opening of said frame, and electrically connected to a through-hole wiring formed in the first package wafer. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20, 21, 22)
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Specification