Semiconductor chip assembly with post/base heat spreader and substrate
First Claim
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1. A semiconductor chip assembly, comprising:
- a semiconductor device;
an adhesive that includes an opening;
a heat spreader that includes a post and a base, wherein the post is adjacent to the base and extends above the base in an upward direction, and the base extends below the post in a downward direction opposite the upward direction and extends laterally from the post in lateral directions orthogonal to the upward and downward directions;
a substrate that includes a pad and a dielectric layer, wherein an aperture extends through the substrate; and
a terminal;
wherein the semiconductor device is mounted on the heat spreader, overlaps the post, is electrically connected to the pad and thereby electrically connected to the terminal, and is thermally connected to the post and thereby thermally connected to the base;
wherein the adhesive is mounted on and extends above the base, extends into a gap in the aperture between the post and the substrate, extends across the dielectric layer in the gap, extends laterally from the post to or beyond the terminal and is sandwiched between the post and the dielectric layer and between the base and the substrate;
wherein the substrate is mounted on the adhesive and extends above the base; and
wherein the post extends into the opening and the aperture and is coplanar with the adhesive above the dielectric layer, and the base extends below the semiconductor device, the adhesive and the substrate.
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Accused Products
Abstract
A semiconductor chip assembly includes a semiconductor device, a heat spreader, a substrate and an adhesive. The semiconductor device is electrically connected to the substrate and thermally connected to the heat spreader. The heat spreader includes a post and a base. The post extends upwardly from the base into an opening in the adhesive and an aperture in the substrate, and the base extends laterally from the post. The adhesive extends between the post and the substrate and between the base and the substrate. The assembly provides signal routing between a pad and a terminal.
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Citations
45 Claims
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1. A semiconductor chip assembly, comprising:
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a semiconductor device; an adhesive that includes an opening; a heat spreader that includes a post and a base, wherein the post is adjacent to the base and extends above the base in an upward direction, and the base extends below the post in a downward direction opposite the upward direction and extends laterally from the post in lateral directions orthogonal to the upward and downward directions; a substrate that includes a pad and a dielectric layer, wherein an aperture extends through the substrate; and a terminal; wherein the semiconductor device is mounted on the heat spreader, overlaps the post, is electrically connected to the pad and thereby electrically connected to the terminal, and is thermally connected to the post and thereby thermally connected to the base; wherein the adhesive is mounted on and extends above the base, extends into a gap in the aperture between the post and the substrate, extends across the dielectric layer in the gap, extends laterally from the post to or beyond the terminal and is sandwiched between the post and the dielectric layer and between the base and the substrate; wherein the substrate is mounted on the adhesive and extends above the base; and wherein the post extends into the opening and the aperture and is coplanar with the adhesive above the dielectric layer, and the base extends below the semiconductor device, the adhesive and the substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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21. A semiconductor chip assembly, comprising:
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a semiconductor device; an adhesive that includes an opening; a heat spreader that includes a post, a base and a cap, wherein the post is adjacent to and integral with the base, extends above the base in an upward direction and thermally connects the base and the cap, the base extends below the post in a downward direction opposite the upward direction and extends laterally from the post in lateral directions orthogonal to the upward and downward directions, and the cap extends above and is adjacent to and covers in the upward direction and extends laterally in the lateral directions from a top of the post; and a substrate that includes a pad, a terminal, a routing line and a dielectric layer, wherein the pad, the terminal and the routing line contact and extend above the dielectric layer, an electrically conductive path between the pad and the terminal includes the routing line, and an aperture extends through the substrate; wherein the semiconductor device is mounted on the cap, overlaps the post, is electrically connected to the pad and thereby electrically connected to the terminal, and is thermally connected to the cap and thereby thermally connected to the base; wherein the adhesive is mounted on and extends above the base, extends into a gap in the aperture between the post and the substrate, extends across the dielectric layer in the gap, is sandwiched between the post and the dielectric layer in the gap, is sandwiched between the base and the substrate outside the gap, surrounds the post in the lateral directions, is overlapped by the pad, the terminal and the routing line, extends laterally from the post to or beyond the terminal and extends to peripheral edges of the assembly; wherein the substrate is mounted on the adhesive and extends above the base; and wherein the post extends into the opening and the aperture and above the dielectric layer and is coplanar with the adhesive above the dielectric layer, the cap contacts and overlaps the adhesive and is coplanar with the pad and the terminal above the dielectric layer and the base extends below the semiconductor device, the adhesive and the substrate, covers the post, the cap, the adhesive and the substrate in the downward direction and extends to peripheral edges of the assembly. - View Dependent Claims (22, 23, 24, 25)
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26. A semiconductor chip assembly, comprising:
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a semiconductor device; an adhesive that includes an opening; a heat spreader that includes a post and a base, wherein the post is adjacent to and integral with the base and extends above the base in an upward direction, and the base extends below the post in a downward direction opposite the upward direction and extends laterally from the post in lateral directions orthogonal to the upward and downward directions; a substrate that includes a pad and a dielectric layer, wherein an aperture extends through the substrate; and a terminal; wherein the semiconductor device is mounted on the heat spreader, overlaps the post, is electrically connected to the pad and thereby electrically connected to the terminal, and is thermally connected to the post and thereby thermally connected to the base; wherein the adhesive is mounted on and extends above the base, contacts the post and the base, extends into a gap in the aperture between the post and the substrate, extends laterally from the post to or beyond the terminal and is sandwiched between the post and the dielectric layer and between the base and the substrate; wherein the substrate is mounted on the adhesive and extends above the base; and wherein the post extends into the opening and the aperture and above and below the aperture and is coplanar with the adhesive above and below the dielectric layer, and the base extends below the semiconductor device, the adhesive and the substrate. - View Dependent Claims (27, 28, 29, 30)
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31. A semiconductor chip assembly, comprising:
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a semiconductor device; an adhesive that includes an opening; a heat spreader that includes a post and a base, wherein the post is adjacent to and integral with the base and extends above the base in an upward direction, and the base extends below the post in a downward direction opposite the upward direction and extends laterally from the post in lateral directions orthogonal to the upward and downward directions; a substrate that includes a pad and a dielectric layer, wherein an aperture extends through the substrate; and a terminal; wherein the semiconductor device is mounted on the heat spreader, overlaps the post, is electrically connected to the pad and thereby electrically connected to the terminal, and is thermally connected to the post and thereby thermally connected to the base; wherein the adhesive is mounted on and extends above the base, extends into a gap in the aperture between the post and the substrate, extends laterally from the post to or beyond the terminal and contacts and is sandwiched between the post and the dielectric layer in the gap and between the base and the dielectric layer outside the gap; wherein the substrate is mounted on the adhesive, extends above the base and is spaced from the post and the base; and wherein the post extends into the opening and the aperture and is coplanar with the adhesive above and below the dielectric layer, and the base extends below the semiconductor device, the adhesive and the substrate. - View Dependent Claims (32, 33, 34, 35)
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36. A semiconductor chip assembly, comprising:
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a semiconductor device; an adhesive that includes an opening; a heat spreader that includes a post and a base, wherein the post is adjacent to and integral with the base and extends above the base in an upward direction, and the base extends below the post in a downward direction opposite the upward direction and extends laterally from the post in lateral directions orthogonal to the upward and downward directions; a substrate that includes a pad and a dielectric layer, wherein an aperture extends through the substrate; and a terminal; wherein the semiconductor device is mounted on the heat spreader, overlaps the post, is electrically connected to the pad and thereby electrically connected to the terminal, and is thermally connected to the post and thereby thermally connected to the base; wherein the adhesive is mounted on and extends above the base, extends into a gap in the aperture between the post and the substrate, extends across the dielectric layer in the gap, extends laterally from the post to or beyond the terminal and contacts and is sandwiched between the post and the dielectric layer in the gap and between the base and the dielectric layer outside the gap; wherein the substrate is mounted on the adhesive, extends above the base and is spaced from the post and the base; and wherein the post extends into the opening and the aperture and above and below the aperture and is coplanar with the adhesive above and below the dielectric layer, and the base extends below the semiconductor device, the adhesive and the substrate. - View Dependent Claims (37, 38, 39, 40)
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41. A semiconductor chip assembly, comprising:
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a semiconductor device; an adhesive that includes an opening; a heat spreader that includes a post and a base, wherein the post is adjacent to and integral with the base and extends above the base in an upward direction, and the base extends below the post in a downward direction opposite the upward direction and extends laterally from the post in lateral directions orthogonal to the upward and downward directions; a conductive trace that includes a pad and a terminal; and a substrate that includes a dielectric layer, wherein an aperture extends through the dielectric layer; wherein the semiconductor device is mounted on the heat spreader, overlaps the post, is electrically connected to the pad and thereby electrically connected to the terminal, and is thermally connected to the post and thereby thermally connected to the base; wherein the adhesive is mounted on and extends above the base, fills a gap in the aperture between the post and the dielectric layer, extends above and below the dielectric layer and does not overlap the dielectric layer, extends laterally from the post to or beyond the terminal and contacts and is sandwiched between the post and the dielectric layer in the gap and between the base and the dielectric layer outside the gap; wherein the pad contacts the dielectric layer and overlaps the adhesive and the dielectric layer; wherein the substrate is mounted on the adhesive, extends above the base and is spaced from the post and the base; and wherein the post extends into the opening and the aperture and above and below the dielectric layer and is coplanar with the adhesive above and below the dielectric layer and the base covers the semiconductor device, the post, the pad, the substrate and the adhesive in the downward direction and extends to peripheral edges of the assembly. - View Dependent Claims (42, 43, 44, 45)
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Specification