Method of fabricating microelectromechanical systems devices
First Claim
1. A method of fabricating microelectromechanical systems devices, the method comprising the steps of:
- providing a silicon substrate having a plurality of microelectromechanical systems elements formed on a first surface thereof,applying a guard layer defining a plurality of recesses to the silicon substrate such that respective microelectromechanical systems elements are located within respective recesses;
segmenting the silicon substrate into discrete parts;
bonding an adhesive layer to a second surface of the silicon substrate, the second surface being opposite said first surface and the adhesive layer being curable in the presence of light;
segmenting the guard layer into discrete parts corresponding to the discrete parts of the silicon substrate thereby forming individual microelectromechanical systems devices; and
selectively exposing the adhesive layer to a light source allowing removal of individual microelectromechanical systems devices.
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Accused Products
Abstract
A method of fabricating microelectromechanical systems devices is disclosed. A silicon substrate having a plurality of microelectromechanical systems elements formed on a first surface thereof is provided. A guard layer defining a plurality of recesses is applied to the silicon substrate such that respective microelectromechanical systems elements are located within respective recesses. The silicon substrate is then segmented into discrete parts and an adhesive layer is bonded to a second surface of the silicon substrate. The guard layer is next segmented into discrete parts corresponding to the discrete parts of the silicon substrate, thereby forming individual microelectromechanical systems devices. Finally, the adhesive layer is selectively exposed to a light source allowing removal of individual microelectromechanical systems devices.
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Citations
7 Claims
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1. A method of fabricating microelectromechanical systems devices, the method comprising the steps of:
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providing a silicon substrate having a plurality of microelectromechanical systems elements formed on a first surface thereof, applying a guard layer defining a plurality of recesses to the silicon substrate such that respective microelectromechanical systems elements are located within respective recesses; segmenting the silicon substrate into discrete parts; bonding an adhesive layer to a second surface of the silicon substrate, the second surface being opposite said first surface and the adhesive layer being curable in the presence of light; segmenting the guard layer into discrete parts corresponding to the discrete parts of the silicon substrate thereby forming individual microelectromechanical systems devices; and selectively exposing the adhesive layer to a light source allowing removal of individual microelectromechanical systems devices. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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Specification