Engineered wood fiber product substrates and their formation by laser processing
First Claim
Patent Images
1. A method of engraving an engineered wood fiber substrate, comprising:
- obtaining a pattern or graphic having different portions to be etched with different amounts of applied energy to produce an effect where at least a first portion of the pattern or graphic is more deeply etched into an engineered wood fiber substrate than at least a second portion;
producing an output to control a laser, the output includes information to etch the first portion of the pattern or graphic more deeply than the second portion; and
etching the pattern or graphic having the first portion more deeply etched than other portions on an engineered wood fiber substrate, wherein at least a section of the first portion or the second portion is etched by the laser at an EDPUT value between 2 watts-sec/mm3 and 159.24 watts-sec/mm3.
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Abstract
A laser is used to a form information indicative of a pattern on a surface of a support piece formed from a compressed wood fiber product substrate. The pattern can be a wood grain. The field of the laser is increased, to allow lazing more of the material at once. According to an embodiment, the field is increased in a way that does not reduce the resolution of the lasing.
61 Citations
28 Claims
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1. A method of engraving an engineered wood fiber substrate, comprising:
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obtaining a pattern or graphic having different portions to be etched with different amounts of applied energy to produce an effect where at least a first portion of the pattern or graphic is more deeply etched into an engineered wood fiber substrate than at least a second portion; producing an output to control a laser, the output includes information to etch the first portion of the pattern or graphic more deeply than the second portion; and etching the pattern or graphic having the first portion more deeply etched than other portions on an engineered wood fiber substrate, wherein at least a section of the first portion or the second portion is etched by the laser at an EDPUT value between 2 watts-sec/mm3 and 159.24 watts-sec/mm3. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 20, 21, 22, 27)
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15. A method of applying a pattern or graphic to an engineered wood fiber substrates, comprising the steps of:
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defining a wood grain pattern to be formed on a surface of a material which comprises wood fiber, the wood grain pattern having different portions which are intended to be etched at different EDPUT values to produce an effect where the different portions of the wood grain pattern are etched at different depths measured from the surface of the material; defining EDPUT values between 2 watts-sec/mm3 and 159.24 watts-sec/mm3 for etching the different portions of the wood grain pattern; producing a controlling output for a laser which is based on the wood grain pattern and the defined EDPUT values which causes the different portions of the wood grain pattern to be formed in the material at different depths; and laser etching the wood grain pattern in the material in one continuous operation. - View Dependent Claims (16, 17, 18, 19, 23, 24, 25, 26, 28)
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Specification