ACF attachment for radiation detector
First Claim
Patent Images
1. A device, comprising:
- a radiation detector comprising;
a semiconductor substrate having opposing front and rear surfaces;
a cathode electrode located on the front surface of said semiconductor substrate; and
a plurality of anode electrodes on the rear surface of said semiconductor substrate;
a printed circuit board; and
a polymeric film disposed between the printed circuit board and the anode electrodes, wherein the polymeric film comprises electrically conductive wires electrically connecting the radiation detector with the printed circuit board.
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Accused Products
Abstract
A device includes (a) radiation detector including a semiconductor substrate having opposing front and rear surfaces, a cathode electrode located on the front surface of said semiconductor substrate, and a plurality of anode electrodes on the rear surface of said semiconductor substrate, (b) a printed circuit board, and (c) an electrically conductive polymeric film disposed between circuit board and the anode electrodes. The polymeric film contains electrically conductive wires. The film bonds and electrically connects the printed circuit board and anode electrodes.
55 Citations
26 Claims
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1. A device, comprising:
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a radiation detector comprising; a semiconductor substrate having opposing front and rear surfaces; a cathode electrode located on the front surface of said semiconductor substrate; and a plurality of anode electrodes on the rear surface of said semiconductor substrate; a printed circuit board; and a polymeric film disposed between the printed circuit board and the anode electrodes, wherein the polymeric film comprises electrically conductive wires electrically connecting the radiation detector with the printed circuit board. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A device, comprising:
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a radiation detector comprising; a semiconductor substrate having opposing front and rear surfaces; a cathode electrode located on the front surface of said semiconductor substrate; and a plurality of anode electrodes on the rear surface of said semiconductor substrate; a printed circuit board; and a polymeric film disposed between the printed circuit board and the anode electrodes, wherein the polymeric film comprises electrically conductive wires electrically connecting the radiation detector with the printed circuit board, wherein the polymeric film is an anisotropic conductive film, and wherein the wires are metallic nanowires. - View Dependent Claims (10, 11)
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12. A method of electrically connecting a radiation detector to a printed circuit board, comprising:
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providing a radiation detector comprising; a semiconductor substrate having opposing front and rear surfaces; a cathode electrode located on the front surface of said semiconductor substrate; and a plurality of anode electrodes on the rear surface of said semiconductor substrate; providing a printed circuit board; providing an electrically conductive polymeric film comprising electrically conductive wires in a polymer matrix between the printed circuit board and the plurality of anodes; and bonding the radiation detector to the printed circuit board using at least one of a bonding temperature of 135°
C. or less or a compressive force of about 35 psi or less. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24)
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25. A method of electrically connecting a radiation detector to a printed circuit board, comprising:
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providing a radiation detector comprising; a semiconductor substrate having opposing front and rear surfaces; a cathode electrode located on the front surface of said semiconductor substrate; and a plurality of anode electrodes on the rear surface of said semiconductor substrate; providing a printed circuit board; providing an electrically conductive polymeric film comprising electrically conductive wires in a polymer matrix between the printed circuit board and the plurality of anodes; and bonding the radiation detector to the printed circuit board using a bonding temperature of 135°
C. or less and a compressive force of about 35 psi or less,wherein the electrically conductive wires electrically connect the anode electrodes to the printed circuit board, and wherein the wires are metallic nanowires. - View Dependent Claims (26)
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Specification