Stacked electronic component package having film-on-wire spacer

• US 8,072,083 B1
• Filed: 01/20/2010
• Issued: 12/06/2011
• Est. Priority Date: 02/17/2006
• Status: Active Grant

• Current Assignee: Amkor Technology Singapore Holding Pte., Ltd. (Amkor Technology Incorporated)
• Original Assignee: Amkor Technology Incorporated
• Inventors: St. Amand, Roger D., Han, ChangSuk, Kim, YounSang, Park, KyungRok, Perelman, Vladimir
• Primary Examiner(s): CHU, CHRIS C
• Application Number:
  US12/657,425
• Time in Patent Office: 685 Days
• Field of Search: 257/E25.013, 257/E25.018, 257/685, 257/686, 257/723, 257/724, 257/773, 257/777, 438/108, 438/109, 361/760
• US Class Current: 257/777
• CPC Class Codes: B81B 2201/0264 Pressure sensors
• CPC Class Codes: B81B 2207/07 Interconnects
• CPC Class Codes: B81C 1/0023 Packaging together an electronic processing unit die and a micromechanical structure die MEMS packages B81B7/0032; MEMS packaging processes B81C1/00261
• CPC Class Codes: B81C 2201/019 Bonding or gluing multiple substrate layers
• CPC Class Codes: G01L 19/0084 to the outside of the housing other details about the housing see G01L19/14
• CPC Class Codes: G01L 19/141 Monolithic housings, e.g. molded or one-piece housings
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/2612 Auxiliary members for layer connectors, e.g. spacers
• CPC Class Codes: H01L 2224/27013 for holding or confining the layer connector, e.g. solder flow barrier
• CPC Class Codes: H01L 2224/274 by blanket deposition of the material of the layer connector
• CPC Class Codes: H01L 2224/29 of an individual layer connector
• CPC Class Codes: H01L 2224/29099 Material
• CPC Class Codes: H01L 2224/29101 the principal constituent melting at a temperature of less than 400°C
• CPC Class Codes: H01L 2224/2919 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/29199 Material of the matrix
• CPC Class Codes: H01L 2224/2929 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/29298 Fillers
• CPC Class Codes: H01L 2224/29299 Base material
• CPC Class Codes: H01L 2224/32014 the layer connector being smaller than the bonding area, e.g. bond pad
• CPC Class Codes: H01L 2224/32145 the bodies being stacked
• CPC Class Codes: H01L 2224/32225 : the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32245 : the item being metallic
• CPC Class Codes: H01L 2224/45144 : Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 : Arched
• CPC Class Codes: H01L 2224/48227 : connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48247 : connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 : the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/48599 : Principal constituent of the connecting portion of the wire connector being Gold (Au)
• CPC Class Codes: H01L 2224/4899 : Auxiliary members for wire connectors, e.g. flow-barriers, reinforcing structures, spacers, alignment aids
• CPC Class Codes: H01L 2224/49175 : Parallel arrangements
• CPC Class Codes: H01L 2224/73265 : Layer and wire connectors
• CPC Class Codes: H01L 2224/83051 : Forming additional members, e.g. dam structures
• CPC Class Codes: H01L 2224/83139 : Guiding structures on the body
• CPC Class Codes: H01L 2224/83191 : wherein the layer connectors are disposed only on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/83192 : wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/83856 : Pre-cured adhesive, i.e. B-stage adhesive
• CPC Class Codes: H01L 2224/85399 : Material
• CPC Class Codes: H01L 2224/8592 : Applying permanent coating, e.g. protective coating
• CPC Class Codes: H01L 2224/92247 : the second connecting process involving a wire connector
• CPC Class Codes: H01L 2225/0651 : Wire or wire-like electrical connections from device to substrate
• CPC Class Codes: H01L 2225/06562 : at least one device in the stack being rotated or offset
• CPC Class Codes: H01L 2225/06575 : Auxiliary carrier between devices, the carrier having no electrical connection structure
• CPC Class Codes: H01L 23/49548 : Cross section geometry H01L23/49562 takes precedence
• CPC Class Codes: H01L 23/49582 : Metallic layers on lead frames
• CPC Class Codes: H01L 23/49816 : Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
• CPC Class Codes: H01L 23/49861 : Lead-frames fixed on or encapsulated in insulating substrates H01L23/4985, H01L23/49805 take precedence
• CPC Class Codes: H01L 24/29 : of an individual layer connector
• CPC Class Codes: H01L 24/32 : of an individual layer connector
• CPC Class Codes: H01L 24/33 : of a plurality of layer connectors
• CPC Class Codes: H01L 24/45 : of an individual wire connector
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/49 : of a plurality of wire connectors
• CPC Class Codes: H01L 24/73 : Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/83 : using a layer connector
• CPC Class Codes: H01L 25/0657 : Stacked arrangements of devices
• CPC Class Codes: H01L 27/14618 : Containers
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00013 : Fully indexed content
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01014 : Silicon [Si]
• CPC Class Codes: H01L 2924/01027 : Cobalt [Co]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/0665 : Epoxy resin
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/1461 : MEMS
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/15747 : Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/1815 : Shape
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19042 : being an inductor
• CPC Class Codes: H01L 2924/19043 : being a resistor
• CPC Class Codes: H01L 2924/3512 : Cracking

Abstract

A film-on-wire spacer covers an entire upper surface of a lower electronic component. Accordingly, an upper electronic component is supported above bond pads and lower bond wires of the lower electronic component. This decreases the stress on the upper electronic component, e.g., during wirebonding, and thus decreases the chance of cracking the upper electronic component. Further, the lower bond wires are enclosed in and protected by the film-on-wire spacer. Further, the film-on-wire spacer is thin resulting in a minimum height of the stacked electronic component package.

Claims

1. A stacked electronic component package comprising:

a first electronic component having a first surface and a second surface, the second surface of the first electronic component comprising bond pads;

a film-on-wire spacer coupled to and covering the second surface of the first electronic component including the bond pads, wherein the film-on-wire spacer includes an upper film adhesive, a middle film adhesive, and a lower film adhesive; and

a second electronic component having a first surface coupled to the film-on-wire spacer, the first surface of the second electronic component having a total area different than a total area of the second surface of the first electronic component.

2. The stacked electronic component package of claim 1 further comprising a substrate, the first surface of the first electronic component being coupled to a first surface of the substrate.

3. The stacked electronic component package of claim 2 wherein the substrate comprises first traces on the first surface of the substrate, the stacked electronic component package further comprising:

lower bond wires coupling the bond pads of the first electronic component to respective ones of the first traces; and

upper bond wires coupling bond pads of the second electronic component to respective ones of the first traces.

4. The stacked electronic component package of claim 3 wherein the film-on-wire spacer is on the lower bond wires.

5. The stacked electronic component package of claim 3 wherein the lower bond wires are enclosed by the film-on-wire spacer.

6. The stacked electronic component package of claim 1 wherein the film-on-wire spacer covers the entire first surface of the second electronic component.

7. A stacked electronic component package comprising:

a first electronic component having a first surface and a second surface, the second surface of the first electronic component comprising bond pads;

a film-on-wire spacer coupled to and covering the second surface of the first electronic component including the bond pads, wherein the film-on-wire spacer includes an upper film adhesive, a middle film adhesive, and a lower film adhesive; and

a second electronic component having a first surface coupled to the film-on-wire spacer, the first surface of the second electronic component having a total area greater than a total area of the second surface of the first electronic component, the upper film adhesive of the film-on-wire spacer covering the entire first surface of the second electronic component.

8. The stacked electronic component package of claim 7 wherein the upper film adhesive has sides which are substantially vertical and coincident with sides of the second electronic component.

9. The stacked electronic component package of claim 7 wherein the upper film adhesive overhangs sides of the first electronic component.

10. The stacked electronic component of claim 7 wherein the first surface of the second electronic component is the same size as a first surface of the upper film adhesive.

11. The stacked electronic component package of claim 7 further comprising a substrate, the first surface of the first electronic component being coupled to a first surface of the substrate.

12. The stacked electronic component package of claim 11 wherein the substrate comprises first traces on the first surface of the substrate, the stacked electronic component package further comprising:

lower bond wires coupling the bond pads of the first electronic component to respective ones of the first traces; and

upper bond wires coupling bond pads of the second electronic component to respective ones of the first traces.

13. The stacked electronic component package of claim 12 wherein the film-on-wire spacer is on the lower bond wires.

14. A stacked electronic component package comprising:

a first electronic component having a first surface and a second surface, the second surface of the first electronic component comprising bond pads;

a lower film adhesive coupled to and covering the second surface of the first electronic component including the bond pads;

a middle film adhesive coupled to the lower film adhesive;

an upper film adhesive coupled to the middle film adhesive; and

a second electronic component having a first surface coupled to the upper film adhesive, the first surface of the second electronic component having a total area greater than a total area of the second surface of the first electronic component.

15. The stacked electronic component package of claim 14 wherein a film-on-wire spacer includes the upper film adhesive, the middle film adhesive, and the lower film adhesive.

16. The stacked electronic component package of claim 14 wherein sides of the first electronic component, sides of the lower film adhesive, and sides of the middle film adhesive are substantially vertical and coincident with one another.

17. The stacked electronic component package of claim 16 wherein the upper film adhesive has sides which are substantially vertical and coincident with sides of the second electronic component.