RFID device and method of forming

• US 8,072,333 B2
• Filed: 05/23/2007
• Issued: 12/06/2011
• Est. Priority Date: 12/31/2002
• Status: Active Grant

• Current Assignee: Avery Dennison Retail Information Services LLC (Avery Dennison Corporation)
• Original Assignee: Avery Dennison Corporation
• Inventors: Ferguson, Scott Wayne, Edwards, David N., Liu, Peikang, Munn, Jason, Forster, Ian J., Linder, Samuel A., Weakley, Thomas Craig, Puleston, David, Kennedy, Steven C., Dang, Christine U.
• Primary Examiner(s): Wu, Daniel
• Assistant Examiner(s): Tang, Son M
• Application Number:
  US11/752,482
• Publication Number:
  US 20070216534A1
• Time in Patent Office: 1,658 Days
• Field of Search: 340/572.8, 340/572.1, 340/572.7, 343/799.MS, 343/873, 343/895, 438/128, 361/736, 298/29
• US Class Current: 340/572.7
• CPC Class Codes: G06K 19/07745 Mounting details of integrated circuit chips
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/07752 using an interposer
• CPC Class Codes: G06K 19/07756 the connection being non-galvanic, e.g. capacitive
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01046 Palladium [Pd]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/1461 MEMS
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H01Q 1/2225 used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 7/00 Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
• CPC Class Codes: Y10T 29/49124 On flat or curved insulated base, e.g., printed circuit, etc.

Abstract

A radio frequency identification (RIFD) inlay includes an electrical connection between a chip and an antenna. The electrical connection includes conductive interposer leads and a capacitive connection. The capacitive connection may involve putting the antenna and the interposer leads into close proximity, with dielectric pads therebetween, to allow capacitive coupling between the antenna and the interposer leads. The dielectric pads may include a non-conductive adhesive and a high dielectric material, such as a titanium oxide. The connections provide a convenient, fast, and effective way to operatively couple antennas and interposers. The RFID inlay may be part of an RFID label or RFID tag.

Claims

1. A method of making a radio frequency identification (RFID) device, the method comprising:

placing an antenna on a substrate in a roll to roll process;

providing dielectric pads that have a dielectric constant that is a non-constant function of the thickness of the dielectric pads; and

capacitively coupling a chip that is part of an interposer having interposer leads to the antenna with the dielectric pads positioned between the interposer leads and the antenna.

2. The method of claim 1, wherein the capacitively coupling includes capacitively coupling the interposer leads to the antenna.

3. The method of claim 2, wherein the capacitively coupling includes mechanically coupling the interposer leads to the antenna with dielectric pads between the interposer leads and the antenna.

4. The method of claim 3, wherein dielectric pads include a pressure sensitive adhesive, and wherein the mechanical coupling includes pressing the interposer and the antenna together.

5. The method of claim 1, wherein the capacitively coupling includes capacitively coupling the interposer leads to the chip.

6. A method of making a radio frequency identification (RFID) device, the method comprising:

placing an antenna on a substrate;

providing a strap, the strap having a chip and conducive leads;

placing a dielectric layer between the conductive leads and the antenna; and

self-compensating capacitively coupling the strap to the antenna with the dielectric layer between the conductive leads and the antenna.

7. The method of claim 6, wherein the conductive leads are tapered.

8. The method of claim 6, wherein the dielectric layer has a dielectric constant that is a non-constant function of thickness.

9. The method of claim 8, wherein the dielectric layer includes one of dielectric adhesives and non-conductive polymers.

10. The method of claim 6, wherein the RFID device is one of a RFID inlay, tag or label.

11. The method of claim 10, wherein the RFID device includes a label facestock and an adhesive layer.

12. The method of claim 6, wherein the method is used in a roll-to-roll process.

13. The method of claim 6, including a further step of placing an adhesive on the dielectric layer prior to the step of placing the dielectric layer.

14. The method of claim 6, including a further step of determining a thickness of the dielectric layer based impedance matching between the interposer and antenna, prior to the step of placing the dielectric layer.

15. The method of claim 6, wherein the conductive leads have reduced conductive material portions.

16. The method of claim 15, wherein the reduced conductive material portions have apertures, gaps or openings.

17. A method for making a radio frequency identification (RFID) device, the method comprising:

placing an antenna on a substrate;

providing a conductive interposer, the conductive interposer having a chip and conducive leads in which a portion of the conductive leads are tapered;

placing a dielectric layer between the tapered portions of the conductive leads and the antenna; and

capacitively coupling the strap to the antenna with the dielectric layer between the conductive leads and the antenna.

18. The method of claim 17, wherein the dielectric layer has a plurality of particles dispersed in the dielectric layer.

19. The method of claim 18, wherein the dielectric layer has a dielectric constant and the plurality of particles affect the dielectric constant.