×

Power semiconductor heatsinking

  • US 8,072,761 B2
  • Filed: 05/14/2009
  • Issued: 12/06/2011
  • Est. Priority Date: 05/14/2009
  • Status: Active Grant
First Claim
Patent Images

1. A heatsink comprising:

  • a thermally conductive body including a plurality of fins configured to conduct and dissipate heat, the body being configured to receive a circuit board containing a plurality of heat-producing electrical components along a width of the body;

    a pivot mechanism pivotally coupled to the body and configured and disposed to contact the plurality of heat-producing electrical components; and

    a bias device connected to the body and the pivot mechanism and configured to change from a first state to a second state to cause the pivot mechanism to rotate relative to the body to move a contact portion of the pivot mechanism toward the body;

    the heatsink being configured to receive the heat-producing electrical components between the contact portion of the pivot mechanism and the body;

    the bias device being configured to bias the contact portion of the pivot mechanism to urge the heat-producing electrical components against the body when the bias device is in the second state; and

    wherein the bias device comprises a first member pivotally coupled to a second member, the first member pivotally coupled to the body at a first pivot point, the second member pivotally coupled to the pivot arm at a second pivot point, and a combined length of the first and second members is greater than a distance between the first and second pivot points when the bias device is in the first state.

View all claims
  • 2 Assignments
Timeline View
Assignment View
    ×
    ×