Method and system for a transformer-based high performance cross-coupled low noise amplifier

• US 8,073,417 B2
• Filed: 12/31/2006
• Issued: 12/06/2011
• Est. Priority Date: 12/06/2006
• Status: Active Grant

• Current Assignee: Avago Technologies International Sales Pte Limited (Broadcom, Inc.)
• Original Assignee: Broadcom Corporation (Broadcom, Inc.)
• Inventors: Chang, Yuyu, Behzad, Arya
• Primary Examiner(s): Nguyen, Simon
• Application Number:
  US11/618,835
• Publication Number:
  US 20080139158A1
• Time in Patent Office: 1,801 Days
• Field of Search: 455/279.1, 455/286, 455/292, 455/296, 455/311, 455/323, 455/333, 455/341
• US Class Current: 455/280
• CPC Class Codes: H03F 2200/294 the amplifier being a low noise amplifier [LNA]
• CPC Class Codes: H03F 2200/451 the amplifier being a radio frequency amplifier
• CPC Class Codes: H03F 2200/534 Transformer coupled at the input of an amplifier
• CPC Class Codes: H03F 2203/45318 the AAC comprising a cross coupling circuit, e.g. two extra transistors cross coupled
• CPC Class Codes: H03F 2203/45386 the AAC comprising one or more coils in the source circuit
• CPC Class Codes: H03F 2203/45544 the IC comprising one or more capacitors, e.g. coupling capacitors
• CPC Class Codes: H03F 2203/45638 the LC comprising one or more coils
• CPC Class Codes: H03F 3/19 with semiconductor devices only
• CPC Class Codes: H03F 3/45188 Non-folded cascode stages
• CPC Class Codes: H04B 1/18 Input circuits, e.g. for coupling to an antenna or a transmission line coupling networks between antennas or lines and receivers independent of the nature of the receiver H03H

Abstract

Aspects of a method and system for a transformer-based high performance cross-coupled low noise amplifier may include one or more circuits that integrate within a single chip, a balun with a low-noise amplifier. A DC current biasing path for the low-noise amplifier may be provided through the integrated balun. The low-noise amplifier may be configured as a cross-coupled low-noise amplifier, where the balun may be directly coupled to the cross-coupled low-noise amplifier. The balun may comprise two or more inductors, wherein one or more of the inductors may provide an electrical path for allowing a DC bias current to flow to ground. Integrating a balun on a single chip with a low-noise amplifier may allow the use of a single received signal input terminal. The biasing voltage may be selected to optimize performance of the low-noise amplifier.

Claims

1. A method for processing signals within a communication system, the method comprising:

amplifying a received signal within a single chip, which comprises an integrated balun and a differential input low-noise amplifier;

wherein said integrated balun provides a DC bias path for said differential input low-noise amplifier.

2. The method according to claim 1, wherein said low-noise amplifier is configured as a cross-coupled low-noise amplifier.

3. The method according to claim 2, wherein said balun is directly coupled to said cross-coupled low-noise amplifier.

4. The method according to claim 1, wherein said balun comprises two or more inductors.

5. The method according to claim 4, wherein one or more of said inductors provide an electrical path for allowing a DC bias current to flow to ground.

6. The method according to claim 1, wherein said single chip comprises a single received signal input terminal.

7. The method according to claim 1, comprising selecting a biasing voltage to optimize performance of said low-noise amplifier.

8. A system for a communications receiver circuit, the system comprising:

one or more circuits integrated within a single chip, said one or more circuits comprising an integrated balun with a differential input low-noise amplifier;

wherein said integrated balun provides a DC bias path for said differential input low-noise amplifier.

9. The system according to claim 8, wherein said low-noise amplifier is configured as a cross-coupled low-noise amplifier.

10. The system according to claim 9, wherein said balun is directly coupled to said cross-coupled low-noise amplifier.

11. The system according to claim 8, wherein said balun comprises two or more inductors.

12. The system according to claim 11, wherein one or more of said inductors provide an electrical path for allowing a DC bias current to flow to ground.

13. The system according to claim 8, wherein said single chip comprises a single received signal input terminal.

14. The system according to claim 8, wherein said one or more circuits selects a biasing voltage to optimize performance of said low-noise amplifier.

15. A system for processing communication signals, the system comprising:

a single chip comprising an integrated balun and a differential input low-noise amplifier that amplifies a received signal;

wherein said integrated balun provides a DC bias path for said differential input low-noise amplifier.

16. The system according to claim 15, wherein said low-noise amplifier is configured as a cross-coupled low-noise amplifier.

17. The system according to claim 16, wherein said balun is directly coupled to said cross-coupled low-noise amplifier.

18. The system according to claim 15, wherein said balun comprises two or more inductors.

19. The system according to claim 18, wherein one or more of said inductors provide an electrical path for allowing a DC bias current to flow to ground.

20. The system according to claim 15, wherein said single chip comprises a single received signal input terminal.

21. The system according to claim 15, comprising one or more circuits that select a biasing voltage to optimize performance of said low-noise amplifier.