Hermetic light-emitting device

• US 8,075,152 B2
• Filed: 04/19/2010
• Issued: 12/13/2011
• Est. Priority Date: 10/29/2009
• Status: Expired due to Fees

• Current Assignee: Industrial Technology Research Institute
• Original Assignee: Industrial Technology Research Institute
• Inventors: Chen, Yao Shun, Tain, Ra Min
• Primary Examiner(s): Ton, Anabel
• Application Number:
  US12/762,461
• Publication Number:
  US 20110103059A1
• Time in Patent Office: 603 Days
• Field of Search: 362/249.02, 362/249.11, 362/800, 362/101
• US Class Current: 362/101
• CPC Class Codes: F21V 29/763 the planes containing the fins or blades having the direction of the light emitting axis
• CPC Class Codes: F21V 31/005 Sealing arrangements therefor
• CPC Class Codes: F21V 5/007 Array of lenses or refractors for a cluster of light sources, e.g. for arrangement of multiple light sources in one plane combination of two or more refractors F21V5/008
• CPC Class Codes: F21Y 2105/10 comprising a two-dimensional array of point-like light-generating elements
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: Y10S 362/80 Light emitting diode

Abstract

A hermetic light-emitting device includes a heat dissipation member including a first surface, a second surface and a first through-hole formed between the first and second surfaces. A circuit substrate has a plurality of conductive traces and a second through-hole disposed corresponding to the first through-hole. A light-emitting element is disposed on the circuit substrate and electrically connected to the plurality of conductive traces. A plurality of electrical wires pass through the first and second through-holes and connect to the plurality of conductive traces to externally supply electrical power to the light-emitting element. A sealing material fills the first and second through-holes. A seal pad member includes a pad opening and is disposed on the first surface of the heat dissipation member and surrounding the circuit substrate. A cover member is disposed over the light-emitting element and against the seal pad member.

Claims

1. A hermetic light-emitting device, comprising:

a heat dissipation member comprising a first through-hole, at least one fin member, a first surface, and a second surface opposite to the first surface, wherein the at least one fin member is disposed on the second surface, and the first through-hole is formed between the first surface and the second surface;

a circuit substrate including a plurality of conductive traces and a second through-hole disposed corresponding to the first through-hole;

at least one light-emitting element disposed on the circuit substrate and electrically connected to the plurality of conductive traces, wherein the circuit substrate is disposed adjacent to the first surface of the heat dissipation member with the at least one light-emitting element positioned opposite to the heat dissipation member;

a plurality of electrical wires passing through the first and second through-holes, electrically connected to the plurality of conductive traces so as to externally supply electrical power to the at least one light-emitting element;

a sealing material filling the first and second through-holes;

a seal pad member including a pad opening and disposed on the first surface of the heat dissipation member, wherein the circuit substrate is disposed in the pad opening; and

a cover member disposed over the at least one light-emitting element and against the seal pad member.

2. The hermetic light-emitting device of claim 1, wherein the at least one light-emitting element is a solid-state light-emitting device.

3. The hermetic light-emitting device of claim 2, wherein the solid-state light-emitting device comprises a light emitting diode.

4. The hermetic light-emitting device of claim 1, further comprising a thermal interface material disposed between the heat dissipation member and the circuit substrate.

5. The hermetic light-emitting device of claim 4, wherein the thermal interface material comprises a thermal conductive sheet.

6. The hermetic light-emitting device of claim 4, wherein the thermal interface material comprises a thermal paste.

7. The hermetic light-emitting device of claim 1, wherein the circuit substrate comprises a metal core printed circuit board.

8. The hermetic light-emitting device of claim 1, further comprising a lens assembly disposed on the at least one light-emitting element and including at least one lens disposed corresponding to the at least one light-emitting element.

9. The hermetic light-emitting device of claim 1, wherein the circuit substrate includes an electrically non-conductive substrate;

or the circuit substrate includes an electrically conductive substrate, and the circuit substrate further comprises a dielectric layer disposed below the plurality of conductive traces.

10. A hermetic light-emitting device, comprising:

a heat dissipation member comprising a first through-hole, at least one fin member, a first surface, and a second surface opposite to the first surface, wherein the at least one fin member is disposed on the second surface, and the first through-hole is formed between the first surface and the second surface;

a circuit substrate including a plurality of conductive traces and a second through-hole disposed corresponding to the first through-hole;

at least one light-emitting element disposed on the circuit substrate and electrically connected to the plurality of conductive traces, wherein the circuit substrate is disposed adjacent to the first surface of the heat dissipation member with the at least one light-emitting element positioned opposite to the heat dissipation member;

a plurality of electrical wires passing through the first and second through-holes, electrically connected to the plurality of conductive traces so as to externally supply electrical power to the at least one light-emitting element;

a sealing material filling the first and second through-holes; and

a frame member including a frame opening and disposed on the first surface of the heat dissipation member, wherein the circuit substrate is disposed in the frame opening.

11. The hermetic light-emitting device of claim 10, wherein the at least one light-emitting element is a solid-state light-emitting device.

12. The hermetic light-emitting device of claim 11, wherein the solid-state light-emitting device comprises a light emitting diode.

13. The hermetic light-emitting device of claim 10, further comprising a first seal pad member disposed between the frame member and the first surface of the heat dissipation member.

14. The hermetic light-emitting device of claim 13, further comprising a cover member disposed on the frame member and a second seal pad member disposed between the frame member and the cover member.

15. The hermetic light-emitting device of claim 10, further comprising a thermal interface material disposed between the heat dissipation member and the circuit substrate.

16. The hermetic light-emitting device of claim 15, wherein the thermal interface material comprises a thermal conductive sheet.

17. The hermetic light-emitting device of claim 15, wherein the thermal interface material comprises a thermal paste.

18. The hermetic light-emitting device of claim 10, further comprising a lens assembly disposed on the at least one light-emitting element and including at least one lens disposed corresponding to the at least one light-emitting element.

19. The hermetic light-emitting device of claim 10, wherein the circuit substrate comprises a metal core printed circuit board.

20. The hermetic light-emitting device of claim 10, wherein the circuit substrate includes an electrically non-conductive substrate;

or the circuit substrate includes an electrically conductive substrate, and the circuit substrate further comprises a dielectric layer disposed below the plurality of conductive traces.