LED with conductively joined bonding structure
First Claim
Patent Images
1. An LED chip comprising:
- a conductive submount (24);
a bond pad (31) having a total volume less than 3×
10−
5 mm3 conductively joined to said submount;
a first ohmic contact (18) on said bond pad opposite from said submount;
an epitaxial region (12) comprising at least a p-type layer (16) and an n-type layer (14) on said first ohmic contact; and
a second ohmic contact (22) to said epitaxial region opposite from said first ohmic contact.
3 Assignments
0 Petitions
Accused Products
Abstract
An LED is disclosed that includes a conductive submount, a bond pad having a total volume less than 3×10−5 mm3 conductively joined to the submount, a first ohmic contact on the bond pad opposite from the submount, an epitaxial region comprising at least a p-type layer and an n-type layer on the first ohmic contact, and an electrode to the epitaxial region opposite from the first ohmic contact.
-
Citations
18 Claims
-
1. An LED chip comprising:
-
a conductive submount (24); a bond pad (31) having a total volume less than 3×
10−
5 mm3 conductively joined to said submount;a first ohmic contact (18) on said bond pad opposite from said submount; an epitaxial region (12) comprising at least a p-type layer (16) and an n-type layer (14) on said first ohmic contact; and a second ohmic contact (22) to said epitaxial region opposite from said first ohmic contact. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
-
Specification