Off-chip vias in stacked chips
First Claim
1. A microelectronic assembly, comprising:
- a first microelectronic element and a second microelectronic element, each of the first and second microelectronic elements having a front face, a rear face remote from the front face, a first edge extending between the front and rear faces, a second edge extending between the front and rear faces and being remote from the first edge, and a plurality of spaced apart traces extending along the front face and beyond at least the first edge, wherein a front face of the second microelectronic element overlies one of the front or rear faces of the first microelectronic element;
an insulating region contacting the first and second edges of the first and second microelectronic elements and at least portions of the traces of the first and second microelectronic elements extending beyond the respective first edges, the insulating region defining first and second side surfaces adjacent the first and second edges of each of the first and second microelectronic elements, the microelectronic assembly further including a plurality of spaced apart openings extending along a side surface selected from the first and second side surfaces; and
a plurality of electrical conductors each having at least a portion disposed in a respective opening of the plurality of openings and extending along the respective openings, the electrical conductors being electrically connected with respective ones of the traces of at least one of the first and second microelectronic elements.
4 Assignments
0 Petitions
Accused Products
Abstract
A microelectronic assembly includes first and second stacked microelectronic elements, each having spaced apart traces extending along a front face and beyond at least a first edge thereof. An insulating region can contact the edges of each microelectronic element and at least portions of the traces of each microelectronic element extending beyond the respective first edges. The insulating region can define first and second side surfaces adjacent the first and second edges of the microelectronic elements. A plurality of spaced apart openings can extend along a side surface of the microelectronic assembly. Electrical conductors connected with respective traces can have portions disposed in respective openings and extending along the respective openings. The electrical conductors may extend to pads or solder balls overlying a face of one of the microelectronic elements.
-
Citations
17 Claims
-
1. A microelectronic assembly, comprising:
-
a first microelectronic element and a second microelectronic element, each of the first and second microelectronic elements having a front face, a rear face remote from the front face, a first edge extending between the front and rear faces, a second edge extending between the front and rear faces and being remote from the first edge, and a plurality of spaced apart traces extending along the front face and beyond at least the first edge, wherein a front face of the second microelectronic element overlies one of the front or rear faces of the first microelectronic element; an insulating region contacting the first and second edges of the first and second microelectronic elements and at least portions of the traces of the first and second microelectronic elements extending beyond the respective first edges, the insulating region defining first and second side surfaces adjacent the first and second edges of each of the first and second microelectronic elements, the microelectronic assembly further including a plurality of spaced apart openings extending along a side surface selected from the first and second side surfaces; and a plurality of electrical conductors each having at least a portion disposed in a respective opening of the plurality of openings and extending along the respective openings, the electrical conductors being electrically connected with respective ones of the traces of at least one of the first and second microelectronic elements. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
-
-
14. A microelectronic device having at least two side external surfaces, said microelectronic device comprising:
-
a first substrate; a first microelectronic element comprising a front face bonded to said first substrate and an opposing rear face;
said first microelectronic element further comprising a plurality of first traces extending along said front face, at least a portion of each said first trace extending beyond a first edge of said first microelectronic element, said first microelectronic element further comprising a second edge opposite said first edge;a first insulating region disposed around said first and second edges of said first microelectronic element; a second microelectronic element comprising a front face facing said opposing rear face of said first microelectronic element, said second microelectronic element further comprising a plurality of second traces extending along said front face of said second microelectronic element, at least a portion of each said second trace extending beyond a first edge of said second microelectronic element, said second microelectronic element further comprising a second edge opposite said first edge of said second microelectronic element, a second insulating region disposed around said first and second edges of said second microelectronic element; and at least one electrical conductor disposed on at least one of said side external surfaces of said microelectronic device, said electrical conductor being in electric contact with a cross-sectional edge of at least one of said plurality of said first and second traces. - View Dependent Claims (15, 16, 17)
-
Specification