Broadband high power amplifier

• US 8,076,975 B1
• Filed: 04/06/2011
• Issued: 12/13/2011
• Est. Priority Date: 11/23/2004
• Status: Active Grant

• Current Assignee: Gula Consulting Limited Liability Company (Intellectual Ventures LLC)
• Original Assignee: BAE Systems Information and Electronic Systems Integration Incorporated (BAE Systems Plc)
• Inventors: Lender, Robert J. Jr., Actis, Robert
• Primary Examiner(s): Choe, Henry
• Application Number:
  US13/081,279
• Time in Patent Office: 251 Days
• Field of Search: 330/286, 330/53, 330/54
• US Class Current: 330/286
• CPC Class Codes: H03F 2200/36 the amplifier comprising means for increasing the bandwidth
• CPC Class Codes: H03F 3/607 using FET's

Abstract

A broadband high power amplifier architecture is disclosed. One example configuration includes a first plurality of distributed amplification cells connected in a first string, wherein a conductive trace operatively coupling outputs of the first string cells is a stepped structure, such that the associated inductance successively decreases from a first cell to a last cell of the first string. The amplifier further includes a second plurality of distributed amplification cells connected in a second string, wherein a conductive trace operatively coupling outputs of the second string cells is a stepped structure, such that the associated inductance successively decreases from a first cell to a last cell of the second string. A combiner combines output signals of the first and second strings. Additional strings and/or stages can be provided, and the degree of combining will depend, for example, on factors such as the application and desired output power.

Claims

1. A high power amplifier device, comprising:

a first plurality of distributed amplification cells connected in a first string, wherein a conductive trace operatively coupling outputs of the first string cells is a stepped structure, such that the associated inductance successively decreases from a first cell to a last cell of the first string;

a second plurality of distributed amplification cells connected in a second string, wherein a conductive trace operatively coupling outputs of the second string cells is a stepped structure, such that the associated inductance successively decreases from a first cell to a last cell of the second string; and

a combiner for combining output signals of the first and second strings.

2. The device of claim 1 wherein each of the first and second strings comprises transistors, and each stepped structure is configured to mitigate parasitic capacitance associated with the transistors of that string.

3. The device of claim 2 wherein the transistors are field effect transistors.

4. The device of claim 1 wherein the stepped structure associated with the first string is configured such that voltage input to one cell of the first string is within 5% of voltage input to the other cells of the first string.

5. The device of claim 1 wherein the first string is a string pair and the second string is a string pair.

6. The device of claim 5 wherein the stepped structure associated with the first string is a shared output line that combines each cell output of the string pair of the first string to provide a first string output, and the stepped structure associated with the second string is a shared output line that combines each cell output of the string pair of the second string to provide a second string output.

7. The device of claim 6 wherein each cell includes a transistor and at least one of the shared output lines is a drain line.

8. The device of claim 6 wherein the combiner combines the first string output and the second string output to provide a first intermediate power output, the device further comprising:

a third plurality of distributed amplification cells connected in a third string, wherein a conductive trace operatively coupling outputs of the third string cells is a stepped structure, such that the associated inductance successively decreases from a first cell to a last cell of the third string;

a fourth plurality of distributed amplification cells connected in a fourth string, wherein a conductive trace operatively coupling outputs of the fourth string cells is a stepped structure, such that the associated inductance successively decreases from a first cell to a last cell of the fourth string;

a second combiner for combining output signals of the third and fourth strings to provide a second intermediate power output; and

a third combiner for combining the first and second intermediate power outputs.

9. The device of claim 1 wherein a second conductive trace for providing input signal to the first string cells is a second stepped structure, such that the associated inductance successively increases from the first cell to the last cell of the first string, and a second conductive trace for providing input signal to the second string cells is a second stepped structure, such that the associated inductance successively increases from the first cell to the last cell of the second string.

10. The device of claim 9 wherein the first string is a string pair and the second string is a string pair, and the second stepped structure associated with the first string is a shared input line that provides input signal to cells of the first string pair, and the second stepped structure associated with the second string is a shared input line that provides input signal to cells of the second string pair, wherein each cell includes a transistor and at least one of the shared input lines is a gate line.

11. The device of claim 1 further comprising:

an input stage for dividing an input signal and providing a portion of that input signal to each of the first and second strings, the input stage including a plurality of distributed amplification cells connected in an input stage string, wherein a conductive trace operatively coupling outputs of the input stage string cells is a stepped structure, such that the associated inductance successively decreases from a first cell to a last cell of the input stage string.

12. The device of claim 1 wherein the device is an integrated circuit chip.

13. An integrated circuit, comprising:

a first plurality of distributed amplification cells operatively coupled in a first string pair, wherein a conductive trace associated with the first string pair is a stepped structure, such that the associated inductance successively decreases from a first cell to a last cell of the first string pair, and wherein the stepped structure associated with the first string pair is a shared output line that combines each cell output of the first string pair to provide a first string pair output;

a second plurality of distributed amplification cells operatively coupled in a second string pair, wherein a conductive trace associated with the second string pair is a stepped structure, such that the associated inductance successively decreases from a first cell to a last cell of the second string pair, and wherein the stepped structure associated with the second string pair is a shared output line that combines each cell output of the second string pair to provide a second string pair output; and

a combiner for combining the first and second string pair outputs.

14. The integrated circuit of claim 13 wherein each of the first and second string pairs comprises transistors, and each stepped structure is configured to mitigate parasitic capacitance associated with the transistors of that string, and at least one of the shared output lines is a drain line.

15. The integrated circuit of claim 14 wherein the transistors are field effect transistors.

16. The integrated circuit of claim 14 wherein the stepped structure associated with the first string pair is configured such that voltage input to one cell of the first string pair is within 5% of voltage input to the other cells of the first string pair.

17. The integrated circuit of claim 13 wherein the combiner combines the first and second string pair outputs to provide a first intermediate power output, the integrated circuit further comprising:

a third plurality of distributed amplification cells operatively coupled in a third string pair, wherein a conductive trace associated with the third string pair is a stepped structure, such that the associated inductance successively decreases from a first cell to a last cell of the third string pair;

a fourth plurality of distributed amplification cells operatively coupled in a fourth string pair, wherein a conductive trace associated with the fourth string pair is a stepped structure, such that the associated inductance successively decreases from a first cell to a last cell of the fourth string pair;

a second combiner for combining output signals of the third and fourth string pairs to provide a second intermediate power output; and

a third combiner for combining the first and second intermediate power outputs.

18. The integrated circuit of claim 13 wherein a second conductive trace associated with the first string pair is a second stepped structure, such that the associated inductance successively increases from the first cell to the last cell of the first string pair, and wherein the second stepped structure associated with the first string pair is a shared input line that provides input signal to cells associated with the first string pair, and wherein each cell includes a transistor and the shared input line is a gate line.

19. The integrated circuit of claim 13 further comprising:

an input stage for dividing an input signal and providing a portion of that input signal to each of the first and second string pairs, the input stage including a plurality of distributed amplification cells operatively coupled in an input stage string, wherein a conductive trace associated with the input stage string is a stepped structure, such that the associated inductance successively decreases from a first cell to a last cell of the input stage string.

20. An integrated circuit, comprising:

a first plurality of distributed amplification cells operatively coupled in a first string pair, wherein a conductive trace associated with the first string is a stepped structure, such that the associated inductance successively decreases from a first cell to a last cell of the first string pair, and wherein the stepped structure associated with the first string is a shared output line that combines each cell output of the first string pair to provide a first string pair output;

a second plurality of distributed amplification cells operatively coupled in a second string pair, wherein a conductive trace associated with the second string pair is a stepped structure, such that the associated inductance successively decreases from a first cell to a last cell of the second string pair, and wherein the stepped structure associated with the second string pair is a shared output line that combines each cell output of the second string pair to provide a second string pair output;

a third plurality of distributed amplification cells operatively coupled in a third string pair, wherein a conductive trace associated with the third string pair is a stepped structure, such that the associated inductance successively decreases from a first cell to a last cell of the third string pair, and wherein the stepped structure associated with the third string pair is a shared output line that combines each cell output of the third string pair to provide a third string pair output;

a fourth plurality of distributed amplification cells operatively coupled in a fourth string pair, wherein a conductive trace associated with the fourth string pair is a stepped structure, such that the associated inductance successively decreases from a first cell to a last cell of the fourth string pair, and wherein the stepped structure associated with the fourth string pair is a shared output line that combines each cell output of the fourth string pair to provide a fourth string pair output;

a first combiner for combining the first and second string pair outputs to provide a first intermediate power output;

a second combiner for combining the third and fourth string pair outputs to provide a second intermediate power output; and

a third combiner for combining the first and second intermediate power outputs;

wherein each of the first, second, third, and fourth string pairs comprises transistors, and wherein the stepped structure associated with the first string pair is configured such that voltage input to one cell of the first string pair is within 5% of voltage input to the other cells of the first string pair.