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Integrated circuits and power supplies

  • US 8,077,437 B2
  • Filed: 11/07/2005
  • Issued: 12/13/2011
  • Est. Priority Date: 11/08/2004
  • Status: Active Grant
First Claim
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1. A semiconductor-on-insulator integrated circuit die comprising a substrate bearing a power conditioning circuit, the power conditioning circuit comprising at least two power devices, one of said power devices being a lateral power device, another of said power devices being a vertical power device.

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