Electronic element package and method of manufacturing the same

• US 8,077,447 B2
• Filed: 12/07/2007
• Issued: 12/13/2011
• Est. Priority Date: 12/12/2006
• Status: Active Grant

• Current Assignee: Panasonic Corporation (Panasonic Holdings Corporation)
• Original Assignee: Panasonic Corporation (Panasonic Holdings Corporation)
• Inventors: Higashi, Kazushi, Ishitani, Shinji
• Primary Examiner(s): Williams, Hezron E
• Assistant Examiner(s): Shah, Samir M
• Application Number:
  US11/952,173
• Publication Number:
  US 20080137270A1
• Time in Patent Office: 1,467 Days
• Field of Search: 735/143.6, 734/93, 735/141.6, 735/79, 295/92, 361/679.01
• US Class Current: 361/679.01
• CPC Class Codes: B81B 2201/025 Inertial sensors not provided for in B81B2201/0235 - B81B2201/0242
• CPC Class Codes: B81B 7/007 Interconnections between the MEMS and external electrical signals
• CPC Class Codes: G01P 1/023 for acceleration measuring devices
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: Y10T 29/49 Method of mechanical manufacture

Abstract

An electronic element package includes a plate-like sensor substrate with a detector formed thereon, and a plate-like first cover substrate and a plate-like second cover substrate joined directly or indirectly to a top surface and a bottom surface, respectively, of the sensor substrate so that the sensor substrate is located between the first and second cover substrates, the sensor substrate including, a frame surrounding the detector via a space, beams joining the detector to the frame, and an electrode disposed on the frame and electrically connected to the detector, one of the first cover substrate and the second cover substrate having a through-hole which contacts an electrode. The electronic element package enables a reduction in thickness and offers improved reliability.

Claims

1. An electronic element package comprising

a plate-like sensor substrate having a detector formed thereon, and a plate-like first cover substrate and a plate-like second cover substrate joined directly or indirectly to a top surface and a bottom surface, respectively, of the sensor substrate so that the sensor substrate is located between the first and second cover substrates,

the sensor substrate comprising:

at least a first detecting portion and a second detecting portion as the detector;

a frame surrounding but spaced from the detector;

at least two beams joining the detector to the frame; and

an electrode on the frame and electrically connected to the detector,

one of the first cover substrate and the second cover substrate including a through-hole having an inner wall whose end surface contacts at least a part of the electrode,

wherein the first detecting portion and the second detecting portion are coplanar; and

wherein portions of a surface of the cover substrates located opposite the sensor substrate are recessed, and positioned in association with the detecting portions.

2. The electronic element package according to claim 1, wherein the electrode is in an area surrounded by a partial side of the frame which is located opposite the detector via the space and an outer periphery of the frame.

3. The electronic element package according to claim 1, wherein the sensor substrate is formed thinner in a portion thereof occupied by the detector than in a periphery thereof.