Vertical system integration
First Claim
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1. A method of making a stacked integrated circuit, comprising:
- fabricating integrated circuit wafers for a plurality of different functional circuit layers at least to a stage of completing active devices of the integrated circuit wafers, the different functional circuit layers being in the form of one or more integrated circuit dice;
wherein at least one surface of each of the different functional layers is provided with vertical interconnections such that for any two of the different functional layers, intercommunication of corresponding integrated circuit dice of the two different functional layers is enabled by aligning and connecting vertical interconnections of the two different functional lavers;
selecting a subset of the plurality of different functional circuit layers for inclusion in the stacked integrated circuit; and
stacking a selected subset of the plurality of different functional circuit layers, including forming vertical interconnections between adjoining integrated circuit dice.
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Abstract
The Vertical System Integration (VSI) invention herein is a method for integration of disparate electronic, optical and MEMS technologies into a single integrated circuit die or component and wherein the individual device layers used in the VSI fabrication processes are preferably previously fabricated components intended for generic multiple application use and not necessarily limited in its use to a specific application. The VSI method of integration lowers the cost difference between lower volume custom electronic products and high volume generic use electronic products by eliminating or reducing circuit design, layout, tooling and fabrication costs.
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Citations
31 Claims
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1. A method of making a stacked integrated circuit, comprising:
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fabricating integrated circuit wafers for a plurality of different functional circuit layers at least to a stage of completing active devices of the integrated circuit wafers, the different functional circuit layers being in the form of one or more integrated circuit dice; wherein at least one surface of each of the different functional layers is provided with vertical interconnections such that for any two of the different functional layers, intercommunication of corresponding integrated circuit dice of the two different functional layers is enabled by aligning and connecting vertical interconnections of the two different functional lavers; selecting a subset of the plurality of different functional circuit layers for inclusion in the stacked integrated circuit; and stacking a selected subset of the plurality of different functional circuit layers, including forming vertical interconnections between adjoining integrated circuit dice. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31)
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Specification