Product including power supply circuit board

• US 8,081,119 B2
• Filed: 09/22/2008
• Issued: 12/20/2011
• Est. Priority Date: 04/26/2006
• Status: Active Grant

• Current Assignee: Murata Manufacturing Co Limited
• Original Assignee: Murata Manufacturing Co Limited
• Inventors: Kato, Noboru, Kimura, Ikuhei
• Primary Examiner(s): Duong, Dieu H
• Application Number:
  US12/234,949
• Publication Number:
  US 20090009007A1
• Time in Patent Office: 1,184 Days
• Field of Search: 343/700.MS, 343/80, 343/820, 343/850, 343/860
• US Class Current: 343/700.MS
• CPC Class Codes: G06K 19/0701 at least one of the integrated circuit chips comprising an arrangement for power management
• CPC Class Codes: G06K 19/0723 the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01Q 1/2208 associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems methods or arrangements for sensing record carriers, e.g. for reading patterns G06K7/00; record carrier for use with machines and with at least a part designed to carry digital markings G06K19/00
• CPC Class Codes: H01Q 1/2216 used in interrogator/reader equipment
• CPC Class Codes: H01Q 1/2283 mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 11/08 Helical antennas
• CPC Class Codes: H01Q 7/00 Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
• CPC Class Codes: H01Q 9/27 Spiral antennas
• CPC Class Codes: H05K 1/0239 Signal transmission by AC coupling
• CPC Class Codes: H05K 1/0243 Printed circuits associated with mounted high frequency components
• CPC Class Codes: H05K 1/16 incorporating printed electric components, e.g. printed resistor, capacitor, inductor
• CPC Class Codes: H05K 1/162 incorporating printed capacitors
• CPC Class Codes: H05K 1/165 incorporating printed inductors
• CPC Class Codes: H05K 2201/10098 Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas

Abstract

A product includes a power supply circuit board, which includes a power supply circuit having a stable frequency characteristic which enables communication among various products to be obtained. The product includes a power supply circuit board including a power supply circuit arranged thereon having an inductance element, and a wireless communication circuit board electrically connected to the power supply circuit. The wireless communication circuit board is mounted on the power supply circuit board. The product further includes a radiation plate which emits a transmission signal which is supplied from the power supply circuit through electromagnetic field coupling and which has a frequency substantially determined in accordance with a resonant frequency of the power supply circuit, and which is used to supply a reception signal to the power supply circuit through electromagnetic field coupling.

Claims

1. A product comprising:

a product body;

a power supply circuit board including a power supply circuit including an inductance element; and

a wireless communication circuit board which is electrically connected to the power supply circuit;

wherein

one of the power supply circuit board and the wireless communication circuit board is mounted on the other, or the power supply circuit board and the wireless communication circuit board are integrally formed as single board, and the other board or the integrally formed board is mounted on the product body;

the product includes a radiation plate arranged to perform at least one of a function of emitting a transmission signal which is supplied from the power supply circuit through electromagnetic field coupling and which has a frequency substantially determined by a resonant frequency of the power supply circuit, and a function of supplying a reception signal to the power supply circuit through the electromagnetic field coupling; and

the power supply circuit board has a multi-layered structure including a plurality of layers, and the inductance element is provided within the power supply circuit board and has a coil shape that extends to at least two of the plurality of layers.

2. The product according to claim 1, wherein the radiation plate is a metallic member included in the product body.

3. The product according to claim 1, wherein the radiation plate is a metallic plate which is disposed on the product body.

4. The product according to claim 1, wherein the power supply circuit is a lumped constant resonant circuit including a capacitance element and the inductance element.

5. The product according to claim 4, wherein the lumped constant resonant circuit is an LC series resonant circuit or an LC parallel resonant circuit.

6. The product according to claim 5, wherein the lumped constant resonant circuit includes a plurality of LC series resonant circuits or a plurality of IC parallel resonant circuits.

7. The product according to claim 4, wherein the capacitance element is arranged between the wireless communication circuit board and the inductance element.

8. The product according to claim 4, wherein the power supply circuit board is a multilayer board including a plurality of dielectric layers or magnetic layers laminated to one another, and the capacitance element is arranged either on a surface of the multilayered structure or inside the multilayered structure.

9. The product according to claim 1, wherein the power supply circuit board is either a rigid resin board or a rigid ceramic board.

10. The product according to claim 1, wherein the radiation plate is an electrode having a band shape, and a length of the band shaped electrode is equal to an integral multiple of a half wavelength of a resonant frequency.

11. The product according to claim 1, wherein an electrode on a wireless communication circuit board side is arranged on the wireless communication circuit board, an electrode on a first board side is arranged on the power supply circuit board, and the wireless communication circuit board and the power supply circuit board are electrically connected to each other so that the electrode on the wireless communication circuit board side and the electrode on the first board side are electrically connected to each other.

12. The product according to claim 1, wherein an electrode on a wireless communication circuit board side is arranged on the wireless communication circuit board, an electrode on a first board side is arranged on the power supply circuit board, and the wireless communication circuit board and the power supply circuit board are electrically connected to each other by capacitance coupling generated between the electrode on the wireless communication circuit board side and the electrode on the first board side.

13. The product according to claim 12, wherein the electrode on the wireless communication circuit board side and the electrode on the first board side are flat electrodes arranged substantially parallel to each other, and the wireless communication circuit board and the power supply circuit board are attached to each other through a dielectric adhesive layer.

14. The product according to claim 1, wherein an electrode on a wireless communication circuit board side is arranged on the wireless communication circuit board, an electrode on a first board side is arranged on the power supply circuit board, and the wireless communication circuit board and the power supply circuit board are electrically connected to each other by magnetic field coupling generated between the electrode on the wireless communication circuit board side and the electrode on the first board side.

15. The product including the power supply circuit board according to claim 14, wherein the electrode on the wireless communication circuit board side and the electrode on the first board side are electrodes having coil shapes, and the wireless communication circuit board and the power supply circuit board are attached to each other through an insulation adhesive layer or a magnetic adhesive layer.

16. The product including the power supply circuit board according to claim 1, wherein an electrode on a second board side is arranged on the power supply circuit board, and the power supply circuit board and the radiation plate are connected to each other through capacitance coupling generated between the electrode on the second board side and the radiation plate.

17. The product including the power supply circuit board according to claim 16, wherein the electrode on the second board side is a flat electrode arranged substantially parallel to the radiation plate, and the power supply circuit board and the radiation plate are attached to each other through a dielectric adhesive layer.

18. The product according to claim 1, wherein an electrode on a second board side is arranged on the power supply circuit board, and the power supply circuit board and the radiation plate are connected to each other through magnetic field coupling generated between the electrode on the second board side and the radiation plate.

19. The product including the power supply circuit board according to claim 18, wherein the electrode on the second board side is an electrode having a coil shape, and the power supply circuit board and the radiation plate are attached to each other through an insulation adhesive layer or a magnetic adhesive layer.