Article having electromagnetic coupling module attached thereto

• US 8,081,121 B2
• Filed: 03/11/2009
• Issued: 12/20/2011
• Est. Priority Date: 10/27/2006
• Status: Active Grant

• Current Assignee: Murata Manufacturing Co Limited
• Original Assignee: Murata Manufacturing Co Limited
• Inventors: Kato, Noboru, Dokai, Yuya, Ikemoto, Nobuo
• Primary Examiner(s): LE, HOANGANH T
• Application Number:
  US12/401,767
• Publication Number:
  US 20090179810A1
• Time in Patent Office: 1,014 Days
• Field of Search: 343/700.MS, 343/895, 343/702, 343/741, 343/742, 343/866, 343/867, 343/850
• US Class Current: 343/700.MS
• CPC Class Codes: G06K 19/04 characterised by the shape
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 7/10178 including auxiliary means for focusing, repeating or boosting the electromagnetic interrogation field comparable booster antennas integrated on the record carrier itself G06K19/07794
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H04B 5/22 Capacitive coupling

Abstract

An article having an electromagnetic coupling module attached thereto includes an electromagnetic coupling module and a PET bottle having the electromagnetic coupling module bonded thereto. The electromagnetic coupling module includes a wireless IC chip arranged to process transmission and reception signals and the feed circuit board having the wireless IC chip mounted thereon. The feed circuit board includes a feed circuit including a resonant circuit having a predetermined resonant frequency. The feed circuit performs characteristic impedance matching between the PET bottle and the wireless IC chip. The PET bottle functions as a radiator arranged to radiate a transmission signal supplied from the feed circuit using electromagnetic field coupling and to supply a received reception signal to the feed circuit using electromagnetic field coupling.

Claims

1. An article having an electromagnetic coupling module attached thereto, comprising:

an electromagnetic coupling module including a wireless IC chip arranged to process a transmission signal and a reception signal and a feed circuit board connected to the wireless IC chip, the feed circuit board including a feed circuit, the feed circuit including a resonant circuit having a predetermined resonant frequency; and

a dielectric body having the feed circuit board bonded thereto;

wherein

the feed circuit matches a characteristic impedance between the dielectric body and the wireless IC chip; and

the dielectric body functions as a radiator to radiate a transmission signal supplied from the feed circuit via electromagnetic field coupling and to supply a received reception signal to the feed circuit via electromagnetic field coupling.

2. The article having an electromagnetic coupling module attached thereto according to claim 1, wherein the dielectric body includes a first dielectric body that defines a container and a second dielectric body contained in the first dielectric body.

3. The article having an electromagnetic coupling module attached thereto according to claim 2, wherein the second dielectric body is a liquid.

4. The article having an electromagnetic coupling module attached thereto according to claim 1, wherein

a resonant frequency of a signal radiated from the dielectric body is substantially the same as a self-resonance frequency of the feed circuit;

and

a maximum gain of the transmission and reception signals is substantially determined by at least one of a size and a shape of the feed circuit board, a distance between the feed circuit board and the dielectric body, and a medium disposed between the feed circuit board and the dielectric body.

5. The article having an electromagnetic coupling module attached thereto according to claim 1, wherein a dimension of the dielectric body in a direction perpendicular or substantially perpendicular to the electromagnetic coupling module is at least about ⅛

λ

of a center frequency.

6. The article having an electromagnetic coupling module attached thereto according to claim 1, further comprising:

an impedance conversion interconnection electrode located near the electromagnetic coupling module;

wherein

the impedance conversion interconnection electrode is disposed on or inside the dielectric body.

7. The article having an electromagnetic coupling module attached thereto according to claim 1, further comprising:

an impedance conversion interconnection electrode disposed close to the electromagnetic coupling module;

wherein

the impedance conversion interconnection electrode is provided on another dielectric body that is disposed on or inside the dielectric body.

8. The article having an electromagnetic coupling module attached thereto according to claim 1, wherein the wireless IC chip is connected to the feed circuit board so as to be electrically conductive with each other.

9. The article having an electromagnetic coupling module attached thereto according to claim 1, wherein the wireless IC chip is coupled to the feed circuit board via at least one of a magnetic field and an electric field.

10. The article having an electromagnetic coupling module attached thereto according to claim 1, wherein the feed circuit is a lumped constant resonant circuit including a capacitance element and an inductance element.

11. The article having an electromagnetic coupling module attached thereto according to claim 10, wherein the lumped constant resonant circuit is one of an LC series resonant circuit and an LC parallel resonant circuit.

12. The article having an electromagnetic coupling module attached thereto according to claim 10, wherein the lumped constant resonant circuit includes a plurality of LC series resonant circuits or a plurality of LC parallel resonant circuits.

13. The article having an electromagnetic coupling module attached thereto according to claim 10, wherein the capacitance element is disposed between the wireless IC chip and the inductance element.

14. The article having an electromagnetic coupling module attached thereto according to claim 10, wherein the feed circuit board is a multilayer board defined by a stack of a plurality of dielectric layers or a plurality of magnetic layers, and the capacitance element and the inductance element are provided on or within the multilayer board.

15. The article having an electromagnetic coupling module attached thereto according to claim 10, wherein the feed circuit board is one of a dielectric single-layer board and a magnetic single-layer board, and at least one of the capacitance element or the inductance element are provided on a surface of the single-layer board.

16. The article having an electromagnetic coupling module attached thereto according to claim 1, wherein the feed circuit board is a rigid or flexible board made of a resin or a ceramic.